Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Geeta Limaye ◽  
Sandeep Shantaram ◽  
Jeff Suhling
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Material Properties ◽  
Isothermal Aging ◽  
High Strain ◽  
Image Correlation ◽  
Lead Free ◽  
Strain Rates ◽  
Full Field

Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn-Ag-Cu or SAC) family of alloys like SAC105, SAC305 etc. Recent studies have highlighted the detrimental effects of isothermal aging on the material properties of these alloys. SAC alloys have shown up to 50% reduction in their initial elastic modulus and ultimate tensile strength within a few months of elevated temperature aging. This phenomenon has posed a severe design challenge across the industry and remains a road-block in the migration to Pb-free. Multiple compositions with additives to SAC have been proposed to minimize the effect of aging and creep while maintaining the melting temperatures, strength and cost at par with SAC. Innolot is a newly developed high-temperature, high-performance lead-free substitute by InnoRel™ targeting the automotive electronics segment. Innolot contains Nickel (Ni), Antimony (Sb) and Bismuth (Bi) in small proportions in addition to Sn, Ag and Cu. The alloy has demonstrated enhanced reliability under thermal cycling as compared to SAC alloys. In this paper, the high strain rate material properties of Innolot have been evaluated as the alloy ages at an elevated temperature of 50°C. The strain rates chosen are in the range of 1–100 per-second which are typical at second level interconnects subjected to drop-shock environments. The strain rates and elevated aging temperature have been chosen also to correspond to prior tests conducted on SAC105 and SAC305 alloys at this research center. This paper presents a comparison of material properties and their degradation in the three alloys — SAC105, SAC305 and Innolot. Full field strain measurements have been accomplished with the use of high speed imaging in conjunction with Digital Image Correlation (DIC). Ramberg-Osgood non-linear model parameters have been determined to curve-fit through the experimental data. The parameters have been implemented in Abaqus FE model to obtain full-field stresses which correlates with contours obtained experimentally by DIC.

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

2015 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Lead Free ◽  
Electronic Systems ◽  
Strain Rates ◽  
High Strain Rates ◽  
Solder Interconnects

Electronics products may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient dynamic loads during drop-impact. Electronics subjected to drop-impact, shock and vibration may experience strain rates of 1–100 per sec. There are no material properties available in published literature at high strain rate at elevated temperature. High temperature and vibrations can contribute to the failures of electronic system. The reliability of electronic products can be improved through a thorough understanding of the weakest link in the electronic systems which is the solder interconnects. The solder interconnects accrue damage much faster when subjected to Shock and vibration at elevated temperatures. There is lack of fundamental understanding of reliability of electronic systems subjected to thermal loads. Previous studies have showed the effect of high strain rates and thermal aging on the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength. Extended period of thermal aging has been shown to affect the mechanical properties of lead free alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Previously, the microstructure, mechanical response and failure behavior of leadfree solder alloys when subjected to elevated isothermal aging and/or thermal cycling [Darveaux 2005, Ding 2007, Pang 2004] have been measured. Pang [1998] has showed that young’s modulus and yield stress of Sn-Pb are highly depending on strain rate and temperature. The ANAND viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components. Previously, Mechanical properties of lead-free alloys, at different high strain rates (10, 35, 50, 75 /sec) and elevated temperature (25 C-125 C) for pristine samples have been studied [Lall 2012 and Lall 2014]. Previous researchers [Suh 2007 and Jenq 2009] have determined the mechanical properties of SAC105 at very high strain rate (Above 1000 per sec) using compression testing. But there is no data available in published literature at high strain rate and at elevated temperature for aged conditions. In this study, mechanical properties of lead free SAC105 has been determined for high strain rate at elevated temperature for aged samples. Effect of aging on mechanical properties of SAC105 alloy a high strain rates has been studied. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures for aged specimen. Experimental data for the aged specimen has been fit to the ANAND’s viscoplastic model. SAC105 leadfree alloys have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C and 125°C. The test samples were exposed to isothermal aging conditions at 50°C for different aging time (30, 60, and 120 Days) before testing. Full-field strain in the specimen have been measured using high speed imaging at frame rates up to 75,000 fps in combination with digital image correlation. The cross-head velocity has been measured prior-to, during, and after deformation to ensure the constancy of cross-head velocity.

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

High Strain Rate Compressive Properties of Soft Tissue

2003 ◽  
Author(s):  
Caleb R. Van Sligtenhorst ◽  
Duane S. Cronin ◽  
G. Wayne Brodland
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Material Properties ◽  
Fiber Orientation ◽  
Soft Tissues ◽  
High Strain ◽  
Split Hopkinson Pressure Bar ◽  
Strain Rates ◽  
Post Mortem ◽  
Fresh Tissue

High strain rate material properties and constitutive equations are essential for the development of numerical and physical models to assess the performance of soft materials subject to high rate deformation, with potential applications including protective equipment and vehicle crashworthiness. However, these properties are not available for many soft tissues. This is because specialized testing methods must be employed to obtain the necessary data. Fresh bovine tissue from the semimembranosis muscle was obtained and tested using a polymeric Split Hopkinson Pressure Bar. Samples were tested from 1.4 to 200 hours post mortem to observe the effect of rigor and other possible temporal effects on the material properties. Since this muscle had relatively uniform fiber orientation, it was possible to obtain specimens with fiber directions parallel, perpendicular, and at 45 degrees to the compression axis. The stress-strain curves for the muscle were concave upwards, as is typical of soft tissues at high strain rates. Fiber orientation was determined to have negligible effect at the tested strain rates. The testing revealed that the stiffness of the tissue increased with post mortem time until approximately 6 hours. At times greater than 200 hours post mortem, the tissue properties were found to be very similar to the properties of fresh tissue. These findings suggest that properties of fresh tissue might be estimated using more easily obtained post-rigor tissue.

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and shock. These electronic components may get exposed to high strain rates of 1 to 100 s−1 and operating temperatures up to 200 °C in critical surroundings. Doped SAC solder alloys such as SAC-Q are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). Prior data presented to date for lead-free solders, such as SAC-Q alloy, at high aging temperature and high strain rate are for 50 °C sustained exposure. In this paper, the effect of sustained exposure to temperature of 100 °C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100 °C have been tested at a range of strain rates including 10, 35, 50, and 75 s−1 and operating temperatures ranging from 25 °C up to 200 °C. Stress–strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fitted to the Anand viscoplasticity model for SAC-Q for comparison.

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

2021 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
Ken Blecker
Keyword(s):  
High Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Isothermal Aging ◽  
High Strain ◽  
Thermal Exposure ◽  
Strain Rates ◽  
Strain Behavior ◽  
Wide Range ◽  
Electronic Parts

Abstract Electronic parts may often get exposed to high strains during shocks, vibrations and drop conditions in both commercial and defense applications. In addition, such electronic parts can often be simultaneously exposed to extreme surrounding temperatures between −65°C and 200°C after storage in non-climate-controlled conditions. Electronic equipment can be subjected to strain rates of 1 to 100 per second in shock and vibration. Many of the doped SAC soldering alloys in the electronic components, including SAC-Q, SAC-R, Innolot have found applications in long-term thermal exposure environments. Low temperature high strain-rate properties are needed to assure durability under high temperature storage followed by shock and vibration. There is scarcity of high strain-rate data on alloys exposed to high temperature aging operating at extreme low-temperatures and extremely-high temperatures. For this study, SAC-Q material was tested and analyzed at temperatures from −65°C to 200°C and at a strain rates of from 10 to 75 per second. Following the production and retrieval of the specimens, specimens were stored for isothermal aging for up to 6 months at 100°C temperature, before performing tensile test experiments at various operating temperatures. Stress vs strain curves are formed for the wide range of strain rates and surrounding temperatures. In addition, test results and data were complemented by the Anand viscoplasticity model and by calculating stress-strain behavior, evaluated in a wide range of working temperatures and strains rates.

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

2019 ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments may often be exposed to elevated temperature for the duration of storage, process and usage in addition to high strain rate triggering loads during drop-impact, vibration and shock. These electronic components may get exposed to high strain rates of 1 to 100 per seconds and operating temperature up to 200°C in the critical surroundings. SAC solder alloys (e.g. SAC-Q (CYCLOMAX), and Innolot) are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). The data presented till date for lead-free solders like SAC-Q alloy at high aging temperature and at high strain rate are for 50°C sustained exposure. In this paper, effect of sustained exposure of 100°C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100°C have been tested at a range of strain rates including 10, 35, 50, and 75 per second and operating temperatures starting from 25°C up to 200°C. Stress-strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fit to the Anand Viscoplasticity model for SAC-Q for comparison.

Influence of high strain-rates on the dynamic flexural material properties of spruce–pine–fir wood studs

2014 ◽  
Vol 41 (1) ◽  
pp. 56-64 ◽  
Author(s):  
Eric Jacques ◽  
Alan Lloyd ◽  
Abass Braimah ◽  
Murat Saatcioglu ◽  
Ghasan Doudak ◽  
...  
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Material Properties ◽  
High Strain ◽  
Small Sample ◽  
Modulus Of Rupture ◽  
Strain Rates ◽  
High Strain Rates ◽  
Stress Strain ◽  
Strain Relationship

The influence of high strain-rate loading on the flexural response of typical light-frame wood construction has been investigated. A total of 30 stud grade 38 mm × 140 mm × 2440 mm (2″ × 6″ × 8′) spruce–pine–fir (S–P–F) lumber specimens were tested within a range of low and high strain-rates between 6 × 10−6 s−1 and 0.4 s−1. A single-degree-of-freedom iterative solution procedure was used to compute the high strain-rate modulus of rupture (MOR) and modulus of elasticity (MOE). The MOR was statistically enhanced by high strain-rates, while the MOE and strain at rupture were not. Since equilibrium of the dynamic stress–strain relationship requires that one or both of the MOE and strain at rupture must be sensitive to strain-rate effects, the lack of observed rate enhancement on these material properties was attributed to large scatter within a small sample set. Based on the results, material dynamic increase factors and a stress–strain relationship suitable for blast resistant design of timber structures were also proposed.

scholarly journals Experimental methodology for the measurement of plasticity on metals at high strain-rates

2018 ◽  
Vol 183 ◽  
pp. 02063 ◽  
Author(s):  
Alexander Sancho ◽  
Mike J. Cox ◽  
Giles Aldrich-Smith ◽  
Tim Cartwright ◽  
Catrin M. Davies ◽  
...  
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
High Speed ◽  
High Strain ◽  
Tensile Tests ◽  
Detection Algorithm ◽  
Image Correlation ◽  
Experimental Methodology ◽  
Tensile Behaviour ◽  
Strain Rates

An experimental methodology has been developed for the tensile characterisation of ductile isotropic metals at high strain-rate. This study includes the region beyond plastic instability or necking, which is rarely analysed for conventional applications. The research explores an imaging technique used to track the geometry of the specimen during tensile tests and calculate true local values of stress and strain by applying Bridgman theory [1]. To improve the quality of the images taken at high strain-rate an in-situ high speed shadowgraph technique has been developed, and to obtain better results from the images a sub-pixel accuracy edge detection algorithm has been implemented. The technique has been applied to an austenitic stainless steel. Its tensile behaviour has been assessed by testing round samples at strain-rates ranging from quasi-static to ~103 s-1. The results obtained with the proposed methodology have been validated by comparison with more conventional techniques such as video-extensometer and digital image correlation in the pre-necking region and good performance even at the highest strain-rate tested has been proved.

Impact tensile behavior and frequency response of 3D braided composites

2011 ◽  
Vol 82 (3) ◽  
pp. 280-287 ◽  
Author(s):  
Xuehui Gan ◽  
Jianhua Yan ◽  
Bohong Gu ◽  
Baozhong Sun
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Tensile Properties ◽  
High Strain ◽  
Tensile Modulus ◽  
Tensile Failure ◽  
Uniaxial Tensile ◽  
Strain Rates ◽  
Braided Composites ◽  
3D Braided Composites

The uniaxial tensile properties of 4-step 3D braided E-glass/epoxy composites under quasi-static and high-strain rate loadings have been investigated to evaluate the tensile failure mode at different strain rates. The uniaxial tensile properties at high strain rates from 800/s to 2100/s were tested using the split Hopkinson tension bar (SHTB) technique. The tensile properties at quasi-static strain rate were also tested and compared with those in high strain rates. Z-transform theory is applied to 3D braided composites to characterize the system dynamic behaviors in frequency domain. The frequency responses and the stability of 3D braided composites under quasi-static and high-strain rate compression have been analyzed and discussed in the Z-transform domain. The results indicate that the stress-strain curves are rate sensitive, and tensile modulus, maximum tensile stress and corresponding tensile strain are also sensitive to the strain rate. The tensile modulus, maximum tensile stress of the 3D braided composites are linearly increased with the strain rate. With increasing of the strain rate (from 0.001/s to 2100/s), the tensile failure of the 3D braided composite specimens has a tendency of transition from ductile failure to brittle failure. The magnitude response and phase response is very different in quasi-static loading with that in high-strain rate loading. The 3D braided composite system is more stable at high strain rate than quasi-static loading.

Research on Numerical Algorithm of Constitutive Equation under High Speed Deformation in Hadfield Steel

2012 ◽  
Vol 562-564 ◽  
pp. 688-692 ◽  
Author(s):  
Deng Yue Sun ◽  
Jing Li ◽  
Fu Cheng Zhang ◽  
Feng Chao Liu ◽  
Ming Zhang
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Deformation Behavior ◽  
High Speed ◽  
High Strain ◽  
Equivalent Stress ◽  
Hadfield Steel ◽  
Stress And Strain ◽  
Strain Rates ◽  
The Finite Element Method

The influence of the strain rate on the plastic deformation of the metals was significant during the high strain rate of loading. However, it was very difficult to obtain high strain rate data (≥ 104 s-1) by experimental techniques. Therefore, the finite element method and iterative method were employed in this study. Numerical simulation was used to characterise the deformation behavior of Hadfield steel during explosion treatment. Base on experimental data, a modified Johnson-Cook equation for Hadfield steel under various strain rate was fitted. The development of two field variables was quantified during explosion hardening: equivalent stress and strain rates.

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