A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

2015 ◽  
Author(s):  
Pradeep Lall ◽  
Vikas Yadav ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Mechanical Properties ◽  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Lead Free ◽  
Electronic Systems ◽  
Strain Rates ◽  
High Strain Rates ◽  
Solder Interconnects

Electronics products may often be exposed to high temperature during storage, operation and handling in addition to high strain rate transient dynamic loads during drop-impact. Electronics subjected to drop-impact, shock and vibration may experience strain rates of 1–100 per sec. There are no material properties available in published literature at high strain rate at elevated temperature. High temperature and vibrations can contribute to the failures of electronic system. The reliability of electronic products can be improved through a thorough understanding of the weakest link in the electronic systems which is the solder interconnects. The solder interconnects accrue damage much faster when subjected to Shock and vibration at elevated temperatures. There is lack of fundamental understanding of reliability of electronic systems subjected to thermal loads. Previous studies have showed the effect of high strain rates and thermal aging on the mechanical properties of leadfree alloys including elastic modulus and the ultimate tensile strength. Extended period of thermal aging has been shown to affect the mechanical properties of lead free alloys including elastic modulus and the ultimate tensile strength at low strain rates representative of thermal fatigue [Lee 2012, Motalab 2012]. Previously, the microstructure, mechanical response and failure behavior of leadfree solder alloys when subjected to elevated isothermal aging and/or thermal cycling [Darveaux 2005, Ding 2007, Pang 2004] have been measured. Pang [1998] has showed that young’s modulus and yield stress of Sn-Pb are highly depending on strain rate and temperature. The ANAND viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components. Previously, Mechanical properties of lead-free alloys, at different high strain rates (10, 35, 50, 75 /sec) and elevated temperature (25 C-125 C) for pristine samples have been studied [Lall 2012 and Lall 2014]. Previous researchers [Suh 2007 and Jenq 2009] have determined the mechanical properties of SAC105 at very high strain rate (Above 1000 per sec) using compression testing. But there is no data available in published literature at high strain rate and at elevated temperature for aged conditions. In this study, mechanical properties of lead free SAC105 has been determined for high strain rate at elevated temperature for aged samples. Effect of aging on mechanical properties of SAC105 alloy a high strain rates has been studied. Stress-Strain curves have been plotted over a wide range of strain rates and temperatures for aged specimen. Experimental data for the aged specimen has been fit to the ANAND’s viscoplastic model. SAC105 leadfree alloys have been tested at strain rates of 10, 35, 50 and 75 per sec at various operating temperatures of 50°C, 75°C, 100°C and 125°C. The test samples were exposed to isothermal aging conditions at 50°C for different aging time (30, 60, and 120 Days) before testing. Full-field strain in the specimen have been measured using high speed imaging at frame rates up to 75,000 fps in combination with digital image correlation. The cross-head velocity has been measured prior-to, during, and after deformation to ensure the constancy of cross-head velocity.

Effect of Isothermal Aging and High Strain Rate on Material Properties of Innolot

2013 ◽  
Author(s):  
Pradeep Lall ◽  
Geeta Limaye ◽  
Sandeep Shantaram ◽  
Jeff Suhling
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
Material Properties ◽  
Isothermal Aging ◽  
High Strain ◽  
Image Correlation ◽  
Lead Free ◽  
Strain Rates ◽  
Full Field

Industry migration to lead-free solders has resulted in a proliferation of a wide variety of solder alloy compositions. The most popular amongst these are the Tin-Silver-Copper (Sn-Ag-Cu or SAC) family of alloys like SAC105, SAC305 etc. Recent studies have highlighted the detrimental effects of isothermal aging on the material properties of these alloys. SAC alloys have shown up to 50% reduction in their initial elastic modulus and ultimate tensile strength within a few months of elevated temperature aging. This phenomenon has posed a severe design challenge across the industry and remains a road-block in the migration to Pb-free. Multiple compositions with additives to SAC have been proposed to minimize the effect of aging and creep while maintaining the melting temperatures, strength and cost at par with SAC. Innolot is a newly developed high-temperature, high-performance lead-free substitute by InnoRel™ targeting the automotive electronics segment. Innolot contains Nickel (Ni), Antimony (Sb) and Bismuth (Bi) in small proportions in addition to Sn, Ag and Cu. The alloy has demonstrated enhanced reliability under thermal cycling as compared to SAC alloys. In this paper, the high strain rate material properties of Innolot have been evaluated as the alloy ages at an elevated temperature of 50°C. The strain rates chosen are in the range of 1–100 per-second which are typical at second level interconnects subjected to drop-shock environments. The strain rates and elevated aging temperature have been chosen also to correspond to prior tests conducted on SAC105 and SAC305 alloys at this research center. This paper presents a comparison of material properties and their degradation in the three alloys — SAC105, SAC305 and Innolot. Full field strain measurements have been accomplished with the use of high speed imaging in conjunction with Digital Image Correlation (DIC). Ramberg-Osgood non-linear model parameters have been determined to curve-fit through the experimental data. The parameters have been implemented in Abaqus FE model to obtain full-field stresses which correlates with contours obtained experimentally by DIC.

scholarly journals Microstructure and Mechanical Properties of Laser Welded 6061-T6 Aluminum Alloy under High Strain Rates

Metals ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 1145
Author(s):  
Jincheng Nie ◽  
Shengci Li ◽  
Huilong Zhong ◽  
Changjing Hu ◽  
Xiangsong Lin ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Plastic Deformation ◽  
Aluminum Alloy ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Base Material ◽  
Strain Rates ◽  
High Strain Rates ◽  
Plastic Deformation Region

Laser welding is widely used for the joining of aluminum alloy in the automotive industry, and the vehicles produced are inevitably subjected to high strain rate loading during their service. Therefore, this paper studied the mechanical properties of 6061-T6 aluminum alloy and its laser welded joint at strain rates between 0.0003 and 1000 s−1. Results showed that the microstructure of welded material (WM) was much finer than base material (BM), typical columnar crystals grew perpendicularly to the fusion line, and the minimum hardness value (~56 HV) was obtained inside WM. The strength and dynamic factors of BM and WM increased with increasing strain rate, and the strength of WM was less sensitive to strain rate compared with BM. The strain rate effect was not homogenous in the plastic deformation region. The modified Johnson–Cook (J–C) model which introduced the term C = C1 + C2·ε could well describe the dynamic plastic deformation of BM. However, the fitted results of the simplified J–C model were overall better than the modified J–C model for WM, especially for high strain rate (1000 s−1). These findings will benefit the determination of the dynamic deformation behavior of laser welded aluminum alloy under high strain rates, and could provide a better understanding of lightweight and the safety of vehicles.

Medium to High Strain-Rate Characterization of Lead Free Solder Alloys Through Metal Cutting Experiments

2019 ◽  
Author(s):  
Yuvraj Singh ◽  
Anirudh Udupa ◽  
Srinivasan Chandrasekar ◽  
Ganesh Subbarayan
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Metal Cutting ◽  
High Strain ◽  
Lead Free ◽  
Strain Rates ◽  
Lead Free Solder ◽  
Orthogonal Metal Cutting ◽  
Free Solder

Abstract Studies on medium to high strain-rate characterization (≥ 0.1s−1) of lead-free solder are relatively few, primarily due to the lack of available methods for testing. Prior work in literature uses Split Hopkinson Bar (SPHB) experiments for high strain-rate characterization (≥ 300s−1) [1,2], while a modified micro-scale tester is used for medium strain-rate characterization (0.005s−1 to 300s−1) [3] and an impact hammer test setup for testing in a strain-rate regime from 1s−1 to 100s−1 [4]. However, there is still limited data in strain-rate regimes of relevance, specifically for drop shock applications. In this paper, we present orthogonal metal cutting as a novel method to characterize lead-free solder alloys. Experiments are carried out using a wedgelike tool that cuts through a work piece at a fixed depth and rake angle while maintaining a constant cutting velocity. These experiments are conducted at room temperature on Sn1.0Ag0.5Cu bulk test specimens with strain-rates varying from 0.32 to 48s−1. The range of strain-rates is only limited by the ball screw driven slide allowing higher strain-rates if needed. The strains and strain-rates are captured through Particle Image Velocimetry (PIV) using sequential images taken from a high-speed camera just ahead of the cutting tool. The PIV enables non-contact recording of high strain-rate deformations, while the dynamometer on the cutting head allows one to capture the forces exerted during the cutting process. Results for the stress-strain response obtained through the experiments are compared to prior work for validation. Orthogonal metal cutting is shown to be a potentially attractive method for characterization of solder at higher strain-rates.

scholarly journals An Image-Based Impact Test for the High Strain Rate Tensile Properties of Brittle Materials

2018 ◽  
Vol 183 ◽  
pp. 02042
Author(s):  
Lloyd Fletcher ◽  
Fabrice Pierron
Keyword(s):  
Tensile Strength ◽  
Elastic Modulus ◽  
High Strain Rate ◽  
Strain Rate ◽  
Stress Wave ◽  
High Strain ◽  
Brittle Materials ◽  
Test Method ◽  
Strain Rates ◽  
High Strain Rates

Testing ceramics at high strain rates presents many experimental diffsiculties due to the brittle nature of the material being tested. When using a split Hopkinson pressure bar (SHPB) for high strain rate testing, adequate time is required for stress wave effects to dampen out. For brittle materials, with small strains to failure, it is difficult to satisfy this constraint. Because of this limitation, there are minimal data (if any) available on the stiffness and tensile strength of ceramics at high strain rates. Recently, a new image-based inertial impact (IBII) test method has shown promise for analysing the high strain rate behaviour of brittle materials. This test method uses a reflected compressive stress wave to generate tensile stress and failure in an impacted specimen. Throughout the propagation of the stress wave, full-field displacement measurements are taken, from which strain and acceleration fields are derived. The acceleration fields are then used to reconstruct stress information and identify the material properties. The aim of this study is to apply the IBII test methodology to analyse the stiffness and strength of ceramics at high strain rates. The results show that it is possible to identify the elastic modulus and tensile strength of tungsten carbide at strain rates on the order of 1000 s-1. For a tungsten carbide with 13% cobalt binder the elastic modulus was identified as 516 GPa and the strength was 1400 MPa. Future applications concern boron carbide and sapphire, for which limited data exist in high rate tension.

Compressive Behavior of Plain and Fiber-Reinforced High-Strength Concrete Subjected to High Strain Rate Loading

2011 ◽  
Vol 82 ◽  
pp. 57-62 ◽  
Author(s):  
Sha Sha Wang ◽  
Min Hong Zhang ◽  
Ser Tong Quek
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
High Strength Concrete ◽  
High Strain ◽  
Split Hopkinson Pressure Bar ◽  
High Strength ◽  
Strain Rates ◽  
Compressive Behavior ◽  
High Strain Rates ◽  
Strength Concrete

This paper presents a laboratory experimental study on the effect of high strain rate on compressive behavior of plain and fiber-reinforce high-strength concrete (FRHSC) with similar strength of 80-90 MPa. Steel fibers, polyethylene fibers, and a combination of these were used in the FRHSC. A split Hopkinson pressure bar equipment was used to determine the concrete behavior at strain rates from about 30 to 300 s-1. The ratio of the strength at high strain rates to that at static loading condition, namely dynamic increase factor (DIF), of the concretes was determined and compared with that recommended by CEB-FIP code. Fracture patterns of the specimens at high strain rates are described and discussed as well. Results indicate that the CEB-FIP equation is applicable to the plain high strength concrete, but overestimates the DIF of the FRHSC at strain rates beyond a transition strain rate of 30 s-1. Based on the experimental results, a modified equation on DIF is proposed for the FRHSC.

Strain Rate Effects and Rate-Dependent Constitutive Models of Lead-Based and Lead-Free Solders

2009 ◽  
Vol 77 (1) ◽  
Author(s):  
Fei Qin ◽  
Tong An ◽  
Na Chen
Keyword(s):  
Strain Rate ◽  
Impact Analysis ◽  
Solder Joints ◽  
High Strain ◽  
Drop Impact ◽  
Lead Free ◽  
Strain Rates ◽  
High Strain Rates ◽  
Rate Dependent ◽  
Lead Free Solders

As traditional lead-based solders are banned and replaced by lead-free solders, the drop impact reliability is becoming increasingly crucial because there is little understanding of mechanical behaviors of these lead-free solders at high strain rates. In this paper, mechanical properties of one lead-based solder, Sn37Pb, and two lead-free solders, Sn3.5Ag and Sn3.0Ag0.5Cu, were investigated at strain rates that ranged from 600 s−1 to 2200 s−1 by the split Hopkinson pressure and tensile bar technique. At high strain rates, tensile strengths of lead-free solders are about 1.5 times greater than that of the Sn37Pb solder, and also their ductility are significantly greater than that of the Sn37Pb. Based on the experimental data, strain rate dependent Johnson–Cook models for the three solders were derived and employed to predict behaviors of solder joints in a board level electronic package subjected to standard drop impact load. Results indicate that for the drop impact analysis of lead-free solder joints, the strain rate effect must be considered and rate-dependent material models of lead-free solders are indispensable.

scholarly journals Investigation on Mechanical Properties of GH4720Li at High Strain Rates at Wider Temperature Range

2021 ◽  
Vol 2021 ◽  
pp. 1-12
Author(s):  
Jie Chen ◽  
Haifeng Zhang ◽  
Yunlong Zhang ◽  
Hongtao Zhang ◽  
Qingxiang Yang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Compressive Strength ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
True Stress ◽  
Strain Rates ◽  
Hot Compression Test ◽  
Strength And Plasticity ◽  
Low Strain Rate

In this paper, the dynamic mechanical properties of GH4720Li nickel-base alloy under a large temperature range and high and low strain rates were studied by the hot compression test. The difference of mechanical properties of GH4720Li alloy under high and low strain rates was analyzed from the perspective of microstructure. The hot compression test experimental results showed that the true stress of GH4720Li alloy decreased at a low strain rate as the trial temperature elevated. Nevertheless, it was abnormal that the true stress increased at high strain rate condition as temperature elevated. By comparing the microstructure under high and low strain rates, it was found that the precipitates under low strain conditions contained a large amount of Cr (Mo). However, the content of Cr (Mo) in the precipitates at a high strain rate decreased, while the content of Fe increased. It would be concluded that Cr (Mo) would reduce the compressive strength and plasticity of GH4720Li alloy, while Fe would increase the compressive strength and plasticity of GH4720Li alloy. In addition, under the condition of a low strain rate, the shape of Cr (Mo) precipitates obtained at 20°C was lamellar, but it was spherical at 800°C. The compressive strength of GH4720Li composites with lamellar precipitates was higher than that of spherical precipitates.

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Pradeep Lall ◽  
Vishal Mehta ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
Elevated Temperature ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
Electronic Components ◽  
High Aging Temperature ◽  
Fine Pitch ◽  
Duration Of Storage ◽  
Operating Temperatures

Abstract Leadfree electronics in harsh environments often may be exposed to elevated temperature for the duration of storage, transport, and usage in addition to high strain rate triggering loads during drop-impact, vibration, and shock. These electronic components may get exposed to high strain rates of 1 to 100 s−1 and operating temperatures up to 200 °C in critical surroundings. Doped SAC solder alloys such as SAC-Q are being considered for use in fine-pitch electronic components. SAC-Q consists of Sn-Ag-Cu alloy in addition to Bi (SAC+Bi). Prior data presented to date for lead-free solders, such as SAC-Q alloy, at high aging temperature and high strain rate are for 50 °C sustained exposure. In this paper, the effect of sustained exposure to temperature of 100 °C on high strain rate properties of SAC-Q is studied. Thermally aged SAC-Q samples at 100 °C have been tested at a range of strain rates including 10, 35, 50, and 75 s−1 and operating temperatures ranging from 25 °C up to 200 °C. Stress–strain curves are established for the given range of strain rates and operating temperatures. Also, the computed experimental results and data have been fitted to the Anand viscoplasticity model for SAC-Q for comparison.

scholarly journals Mechanical Response of Porcine Liver Tissue under High Strain Rate Compression

2019 ◽  
Vol 6 (2) ◽  
pp. 49 ◽  
Author(s):  
Joseph Chen ◽  
Sourav S. Patnaik ◽  
R. K. Prabhu ◽  
Lauren B. Priddy ◽  
Jean-Luc Bouvard ◽  
...  
Keyword(s):  
High Strain Rate ◽  
Strain Rate ◽  
Liver Tissue ◽  
High Strain ◽  
Material Behavior ◽  
Stress Profile ◽  
Strain Rates ◽  
High Strain Rates ◽  
Porcine Liver ◽  
Strain Rate Compression

In automobile accidents, abdominal injuries are often life-threatening yet not apparent at the time of initial injury. The liver is the most commonly injured abdominal organ from this type of trauma. In contrast to current safety tests involving crash dummies, a more detailed, efficient approach to predict the risk of human injuries is computational modelling and simulations. Further, the development of accurate computational human models requires knowledge of the mechanical properties of tissues in various stress states, especially in high-impact scenarios. In this study, a polymeric split-Hopkinson pressure bar (PSHPB) was utilized to apply various high strain rates to porcine liver tissue to investigate its material behavior during high strain rate compression. Liver tissues were subjected to high strain rate impacts at 350, 550, 1000, and 1550 s−1. Tissue directional dependency was also explored by PSHPB testing along three orthogonal directions of liver at a strain rate of 350 s−1. Histology of samples from each of the three directions was performed to examine the structural properties of porcine liver. Porcine liver tissue showed an inelastic and strain rate-sensitive response at high strain rates. The liver tissue was found lacking directional dependency, which could be explained by the isotropic microstructure observed after staining and imaging. Furthermore, finite element analysis (FEA) of the PSHPB tests revealed the stress profile inside liver tissue and served as a validation of PSHPB methodology. The present findings can assist in the development of more accurate computational models of liver tissue at high-rate impact conditions allowing for understanding of subfailure and failure mechanisms.

High Strain Rate Compression Behavior and Constitutive Relation of As-Extruded Mg-Gd-Y Magnesium Alloy

2011 ◽  
Vol 686 ◽  
pp. 162-167 ◽  
Author(s):  
Zheng Liu ◽  
Ping Li Mao ◽  
Chang Yi Wang
Keyword(s):  
Magnesium Alloy ◽  
High Strain Rate ◽  
Strain Rate ◽  
High Strain ◽  
Strain Rates ◽  
High Strain Rates ◽  
Stress Strain ◽  
Compression Behavior ◽  
Calculated Stress ◽  
Strain Rate Compression

The high strain rate compression behavior of extruded Mg-Gd-Y magnesium alloy was tested by split Hopkinson pressure bar (SHPB) under the strain rates of 465s-1，2140s-1and 3767s-1. As comparison the quasi-static compression behavior was tested in the meanwhile. The results show that the quasi-static yield stress is equivalent to that of high strain rates, but the flow stress at high strain rates are higher than that of quasi-static stain rate at the same strain. When the strain rate is increase from quasi-static to high strain rates the deformation stresses increase obviously but within the present testing high strain rates, increasing the strain rate the stress has a slight increasing, indicating that at high strain rate the stress of Mg-Gd-Y magnesium alloy is not sensitive to the strain rate. The constitutive equation between deformation stress, strain and strain rate was build based on the tested compression stress strain curves. The calculated stress strain data were compared with tested stress strain curves. The results demonstrate that when the strain rates are 0.001s-1，465s-1，2140s-1respectively the calculated and experimental data are fit very well. The calculated stress is higher than that of tested stress if the strain rate is increase to 3767s-1and the strain is more than 0.15. The discrepancy was explained through the physical soundness of Johnson-Cook model.

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