The Characterization of Damage Propagation in BGA’s on Flip-Chip Electronic Packages

2005 ◽  
Author(s):  
Kayleen L. E. Helms ◽  
Betty Phillips
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Flip Chip ◽  
Internal Heat ◽  
Design Guidelines ◽  
Electronic Packages ◽  
Analysis Technique ◽  
Characterization Study ◽  
Multiple Measurements ◽  
The Impact

A characterization study is undertaken to monitor damage progression at the second-level interconnect in BGA’s on flip-chip electronic packages. Specifically, the progression of solder joint cracking under use conditions (thermal and combined thermomechanical loading) is investigated. The study uses a multi-color dye and peel failure analysis technique to track the initiation and propagation of solder joint cracks under loading. The approach being used differs from conventional failure analysis techniques in that multiple measurements of damage growth are obtained from the same part providing a full damage history. By using multiple dye colors, all crack initiation points, directions of propagation, and surface crack areas are obtainable experimentally. The scope of the study includes investigating the impact of such factors as die size, package size, BGA size, BGA pitch, enabling load, and internal heat spreaders (IHS’s) on the damage history observed. Based on this study, investigation of sequential loading can be pursued to identify directions and design guidelines for improving solder joint reliability of future BGA’s on flip-chip electronic packages.

VLSI Design for Functional Failure Analysis in the < 90 nm and Flip-Chip Era

2003 ◽  
Author(s):  
Yoav Weizman ◽  
Ezra Baruch
Keyword(s):  
Failure Analysis ◽  
Flip Chip ◽  
Light Emission ◽  
Vlsi Design ◽  
Optical Resolution ◽  
Critical Issue ◽  
Acquisition Time ◽  
Resolution Limit ◽  
Design Rules ◽  
The Impact

Abstract In recent years, two new techniques were introduced for flip chip debug; the Laser Voltage Probing (LVP) technique and Time Resolved Light Emission Microscopy (TRLEM). Both techniques utilize the silicon’s relative transparency to wavelengths longer than the band gap. This inherent wavelength limitation, together with the shrinking dimensions of modern CMOS devices, limit the capabilities of these tools. It is known that the optical resolution limits of the LVP and TRLEM techniques are bounded by the diffraction limit which is ~1um for both tools using standard optics. This limitation was reduced with the addition of immersion lens optics. Nevertheless, even with this improvement, shrinking transistor geometry is leading to increased acquisition time, and the overlapping effect between adjacent nodes remains a critical issue. The resolution limit is an order of magnitude above the device feature densities in the &lt; 90nm era. The scaling down of transistor geometry is leading to the inevitable consequence where more than 50% of the transistors in 90nm process have widths smaller than 0.4um. The acquisition time of such nodes becomes unreasonably long. In order to examine nodes in a dense logic cuicuit, cross talk and convolution effects between neighboring signals also need to be considered. In this paper we will demonstrate the impact that these effects may have on modern design. In order to maintain the debug capability, with the currently available analytical tools for future technologies, conceptual modification of the FA process is required. This process should start on the IC design board where the VLSI designer should be familiar with FA constraints, and thus apply features that will enable enhanced FA capabilities to the circuit in hand during the electrical design or during the physical design stages. The necessity for reliable failure analysis in real-time should dictate that the designer of advanced VLSI blocks incorporates failure analysis constraints among other design rules. The purpose of this research is to supply the scientific basis for the optimal incorporation of design rules for optical probing in the &lt; 90nm gate era. Circuit designers are usually familiar with the nodes in the design which are critical for debug, and the type of measurement (logic or DC level) they require. The designer should enable the measurement of these signals by applying certain circuit and physical constraints. The implementation of these constraints may be done at the cell level, the block level or during the integration. We will discuss the solutions, which should be considered in order to mitigate tool limitations, and also to enable their use for next generation processes.

Quantitative Characterization of a Flip-Chip Solder Joint

1995 ◽  
Vol 62 (2) ◽  
pp. 390-397 ◽  
Author(s):  
S. K. Patra ◽  
S. S. Sritharan ◽  
Y. C. Lee
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Reaction Force ◽  
Minimum Energy ◽  
Process Variations ◽  
Axial Direction ◽  
Restoring Force ◽  
Minimization Principle ◽  
The Impact ◽  
Deposition Height

Based on an energy minimization principle, a mathematical/numerical model has been developed to study the impact of design and process variations associated with flip-chip solder joint on its ability to align in lateral and axial direction. The minimum-energy shape needed for joint evaluation is computed by a novel numerical method based on motion by mean curvature. The analysis shows that (1) the magnitude of the reaction force in lateral and axial direction reduces with increase in solder volume, (2) the normal reaction is an order of magnitude higher compared to the lateral reaction (restoring force) thus making the joint more susceptible to lateral misalignment compared to the axial misalignment, and (3) the axial misalignment is primarily dictated by the accuracy of the solder deposition height.

Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending

2007 ◽  
Author(s):  
D. Farley ◽  
Y. Zhou ◽  
A. Dasgupta ◽  
J. F. J. Caers ◽  
J. W. C. de Vries
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Failure Mode ◽  
Stress Testing ◽  
Flip Chip ◽  
Failure Mechanisms ◽  
Physics Of Failure ◽  
Static Mechanical ◽  
Mechanical Bending ◽  
Solder Joint Fatigue

An LGA (Land Grid Array) laminate-based epoxy-molded RF SiP (system-in-package) containing four wirebonded and three flip-chip dice is qualified for quasi-static mechanical flexure using a PoF (Physics-of-Failure) approach. The process includes: design and execution of accelerated stress testing; failure analysis to identify the failure mode and mechanism; and mechanistic simulations to assess acceleration factors for extrapolation of the failures to field environments for selected failure mechanisms. Illustrative qualification results are presented for solder joint fatigue.

Solder Joint Reliability Challenges in Sub 1.00 mm Ball Pitch for Flip Chip Ball Grid Array

2005 ◽  
Author(s):  
Keh Shin Beh ◽  
Wei Keat Loh ◽  
Jenn Seong Leong ◽  
Wooi Aun Tan
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Compressive Load ◽  
Heat Sinks ◽  
Thickness Effect ◽  
Solder Joint Reliability ◽  
Load Effect ◽  
Joint Reliability ◽  
Package Size ◽  
The Impact

FCBGA is an electronic package used to achieve a high Inputs/Outputs (I/Os). To continue to achieve a higher I/O count without increasing package size, ball pitch reduction is inevitable. However, ball pitch reduction using smaller ball size has posed substantial challenges to solder joint reliability (SJR). On top of that, rising power dissipation requirement in FCBGA package has created a need for high performance heat sinks. These heat sinks require significant compression loading to ensure good thermal conductance of thermal interface materials. The impact of these loads on SJR has typically not been considered in thermal cycle stressing. Hence, this paper focuses on different types of heat sinks and their compressive load effect on solder joint thermal fatigue performance. It also covers package size and board thickness effect when heat sink compressive load is taken into account during thermal stressing. Lastly, lead free and eutectic solders at sub 1.00mm ball pitch technology were also evaluated.

The Characterization of Damage Propagation of BGA Flip-Chip Electronic Packages Under Mechanical Shock Loading

2009 ◽  
Author(s):  
Kayleen L. E. Helms ◽  
Ketan R. Shah ◽  
Dan Gerbus ◽  
Vasu S. Vasudevan ◽  
Jagadeesh Radhakrishnan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Shock Loading ◽  
Lead Free ◽  
Electronic Packages ◽  
Mechanical Shock ◽  
Reliability Testing ◽  
Solder Joint Reliability ◽  
Damage Propagation ◽  
Joint Reliability

Increasing power and I/O demands in HDI (high density interconnect) components coupled with the industry-wide conversion to lead-free products has introduced additional risk for solder joint reliability (SJR) of BGA (ball grid array) Flip-Chip electronic packages. One particular concern is SJR under mechanical shock (dynamic bend) loading. While leaded alloys provided good performance in shock for many years due to the unparalleled ability of lead’s slip systems to absorb the energy in shock events, lead-free alloys cannot provide the same benefit. To mitigate this risk, better approaches for understanding damage propagation are needed to enable better design to limit and reduce the SJR risk during shipping and end-user handling. To this end, a characterization study is undertaken to monitor damage progression at the second-level interconnect in BGA’s on flip-chip electronic packages during mechanical shock loading. The study uses a board-level, strain-monitoring approach plus the dye and peel failure analysis technique to track the initiation and propagation of solder joint cracks under loading. The approach being used differs from conventional reliability testing in that both design and load variables are used to quantify damage growth and strain response to bridge the understanding of design feature impact to traditional reliability testing. The scope of the study includes investigating the impact of such factors as package placement, board layout, and enabling load on the monitored board strain and the damage propagation observed. From this study, directions and design guidelines for improving solder joint reliability of future BGA’s on flip-chip electronic packages under mechanical shock loading conditions are proposed.

A Characterization Study of Flip Chip Ball Grid Array (FCBGA) Dynamic Response and Performance on Peripheral Component Interconnect (PCI) Board Application

2005 ◽  
Author(s):  
Shaw Fong Wong ◽  
Wei Keat Loh ◽  
Yung Hsiang Lee ◽  
Eng Hooi Yap ◽  
Siang Woen Wong ◽  
...  
Keyword(s):  
Solder Joint ◽  
Flip Chip ◽  
Simulation Software ◽  
Dynamic Responses ◽  
Analysis Tool ◽  
Software Analysis ◽  
Characterization Study ◽  
Peripheral Component Interconnect ◽  
Risk Areas ◽  
And Performance

This paper outlines and discusses the new mechanical characterization metrology applied on PCI board. The dynamic responses of PCI board were monitored and characterized using accelerometers and strain gauges. PCI board bend modes were analyzed to differentiate high risk areas through analysis of board strain responses to solder joint crack performance. Key influences, such as thermal/mechanical enabling preload masses and profiled shock on solder joint crack severity were also conducted to understand the potential SJR performance risk modulators. Commercial simulation software analysis tool was applied to correlate and predict the board’s bend modes; providing key information for product enabling solutions design. With this new characterization and validation concept, a practical stiffener solution for PCI application was designed to improve board SJR performance in its application condition.

Development of Highly Reliable BGA and Flip-Chip Structures by Using Cu-Cored Solder Ball

2011 ◽  
Author(s):  
Hisashi Tanie ◽  
Nobuhiko Chiwata ◽  
Motoki Wakano ◽  
Masaru Fujiyoshi ◽  
Shinichi Fujiwara
Keyword(s):  
Fatigue Life ◽  
Impact Strength ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Flip Chip ◽  
Bending Test ◽  
Insulating Layer ◽  
Thermal Fatigue Life ◽  
Impact Bending ◽  
The Impact

A Cu-cored solder joint is a micro-joint structure in which a Cu sphere is encased in solder. It results in a more accurate height and has low thermal and electrical resistance. In a previous paper, we examined the thermal fatigue life of a Cu-cored solder ball grid array (BGA) joint through actual measurements and crack propagation analysis. As a result, we found that the thermal fatigue life of a Cu-cored solder BGA joint is about twice as long as that of a conventional joint. In this paper, we describe the impact strength of a Cu-cored solder BGA joint determined by conducting an impact bending test. This test is a technique to measure the impact strength of a micro-solder joint. This method was developed by Yaguchi et al., and they confirmed that it is an easier and more accurate method of measuring impact strength than the board level drop test. First, we simulated the impact bending test by finite element analysis (FEA) and calculated solder strains of both Cu-cored solder joints and conventional joints. The results indicated that the maximum solder strain of a Cu-cored solder joint during the impact bending test was slightly smaller than that of a conventional joint. The solder volume of the Cu-cored solder joint was also smaller than that of a conventional joint. On the other hand, joint stiffness of the Cu-cored solder joint was larger than in a conventional joint. The former increases the solder strain of the Cu-cored solder joint, and the latter decreases it. By balancing these phenomena, it is possible to obtain a maximum solder strain in the Cu-cored solder joint that is slightly smaller than in a conventional joint. Based on these phenomena, the impact strength of the Cu-cored solder joint is predicted to be the same as or higher than that of a conventional joint. Therefore, we measured the impact strengths of a Cu-cored solder joint and a conventional joint using the impact bending test. As a result, we confirmed that the impact strength of the Cu-cored solder joint was the same as or higher than that of a conventional joint. Accordingly, a Cu-cored solder BGA joint is a micro-joint structure that makes it possible to improve thermal fatigue life without decreasing impact strength. Moreover, we investigated whether the use of Cu-cored solder in a flip-chip (FC) joint improved its reliability. As a result, we found that the stress of an insulating layer on a Si die surface was reduced by using a Cu-cored solder FC joint. This is because bending deformation of the Cu land occurs, and the difference in thermal deformation between the Si chip and the Cu land becomes small. Accordingly, the Cu-cored solder FC joint is a suitable structure for improving reliability of a low-strength insulating layer.

PROFIL KERAGAMAN VEGETASI EKOSISTEM MANGROVE DI DESA TAMUKU KABUPATEN LUWU UTARA

2019 ◽  
Vol 5 ◽  
pp. 104
Author(s):  
Suhendra Purnawan ◽  
Subari Yanto ◽  
Ernawati S.Kaseng
Keyword(s):  
Survey Methods ◽  
Mangrove Ecosystem ◽  
Line Transect ◽  
Mangrove Forests ◽  
Vegetation Diversity ◽  
Line Transect Survey ◽  
Analysis Technique ◽  
Mangrove Vegetation ◽  
Data Collection Technique ◽  
The Impact

This study aims to describe the profile of vegetation diversity in the mangrove ecosystem in Tamuku Village, Bone-Bone-Bone District, North Luwu Regency. This research is a qualitative research using survey methods. The data collection technique uses the Quadrant Line Transect Survey technique. The data analysis technique uses the thinking flow which is divided into three stages, namely describing phenomena, classifying them, and seeing how the concepts that emerge are related to each other. The results of this study are the profile of mangrove vegetation in Tamuku Village, which is still found 16 varieties of true mangrove vegetation and 7 varieties of mangrove vegetation joined in the coastal area of Tamuku Village, Bone-Bone District, North Luwu Regency, South Sulawesi. The condition of mangrove vegetation in Tamuku Village is currently very worrying due to human activities that cause damage such as the project of normalization of flow, opening of new farms, disposal of garbage, water pollution due to chemicals, and exploitation of mangrove forests for living needs. The impact is ecosystem damage and reduced vegetation area as a place to grow and develop mangroves.

Pengungkapan Corporate Social Responsibility (CSR) dan Kinerja Keuangan Perusahaan dengan Pengungkapan Anti Korupsi sebagai Variabel Moderasi

2019 ◽  
Vol 13 (2) ◽  
Author(s):  
Arief Hidayatullah Khamainy ◽  
Dessy Novitasari Laras Asih
Keyword(s):  
Regression Analysis ◽  
Financial Performance ◽  
Stock Exchange ◽  
Linear Regression Analysis ◽  
Sampling Technique ◽  
Analysis Technique ◽  
Study Population ◽  
Csr Disclosure ◽  
Corporate Social ◽  
The Impact

The research was carried out to find the influence of training material and methods of training toward workability. The study was conducted respectively from an employee of PD BPR Bantul Yogyakarta. The purpose of this research is expected to be useful for stakeholders in seeing CSR disclosure in the company in testing and analyzing its effect on the company's financial performance and with the presence of anti-corruption exposure, whether it will strengthen the impact of CSR disclosure on the company's financial performance. The study population in this study were all mining companies registered on the Indonesia Stock Exchange in 2016-2018 with a total of 63 companies. The research sample was taken using a random sampling technique that was calculated by the Slovin formula so that 54 samples were obtained for analysis. Linear Regression Analysis and Moderation Regression Analysis were chosen as the analysis technique used in this study. The results show that CSR disclosure does not affect the company's financial performance, and anti-corruption disclosure does not affect the relationship between the two.

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