Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

2005 ◽  
Author(s):  
Toru Ikeda ◽  
Won-Keun Kim ◽  
Noriyuki Miyazaki
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Quantitative Evaluation ◽  
Flip Chip ◽  
Moisture Absorption ◽  
Solder Joints ◽  
Reflow Process ◽  
Sensitivity Tests ◽  
Solder Reflow ◽  
Chip Size

Recently, adhesively bonding techniques such as the anisotropic conductive film (ACF) or the non-conductive adhesive resin are often used for connections in the chip size packages instead of conventional solder joints due to their reasonable cost and the ease of miniaturization. Adhesively bonding techniques expected to be a key technology for the chip size packaging and the system in package. However, the level of reliability for adhesively bonding techniques is still less than that for solder joints. The quantitative evaluation techniques for the reliability of adhesively bonding techniques are desired. This paper focused on the reliability of adhesively bonding joints in a flip chip package during the solder reflow process for other solder jointed devices. This paper presents a methodology for quantitative evaluation of the delamination in a flip chip interconnected by an ACF under moisture/reflow sensitivity tests. The delamination toughnesses between components in a flip chip based on the stress intensity factors were measured by fracture tests in conjunction with the numerical analysis developed in our previous study. Moisture concentration after moisture absorption was expected by the diffusion analysis using the finite element method. Then, vapor pressure in a flip chip during the solder reflow process was estimated. Finally the delamination was predicted by comparing the stress intensity factor of an interface crack due to vapor pressure with the delamination toughness. The delaminations in an actual flip chip package during moisture/reflow sensitivity tests have successfully predicted by the present methodology.

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

2003 ◽  
Vol 125 (1) ◽  
pp. 31-38 ◽  
Author(s):  
Toru Ikeda ◽  
Isao Arase ◽  
Yuya Ueno ◽  
Noriyuki Miyazaki ◽  
Nobutaka Ito ◽  
...  
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Stress Intensity Factors ◽  
Moisture Absorption ◽  
Evaluation Technique ◽  
Reflow Process ◽  
Intensity Factors ◽  
Moisture Concentration ◽  
Plastic Packages ◽  
Solder Reflow

A crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of the asymptotic solution of a corner of jointed dissimilar materials are utilized for the evaluation of a solder reflow crack in a quad flat package (QFP). First, we estimate the critical vapor pressure, which causes a crack from a corner in the molding resin, using the critical stress intensity factor of a V-notch corner. This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process is estimated. The critical moisture absorption time, which results in crack occurrence during the solder reflow process, can be predicted using this evaluation technique. Furthermore, we perform infrared solder reflow tests of the QFP for verifying the present failure evaluation technique.

Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly

2010 ◽  
Vol 2010 (1) ◽  
pp. 000156-000163
Author(s):  
Weijun Zhou ◽  
Quan Yuan ◽  
Chris Li ◽  
Stephen F. Hahn ◽  
Kurt A. Koppi ◽  
...  
Keyword(s):  
Block Copolymers ◽  
Dimensional Stability ◽  
Moisture Absorption ◽  
Lead Free ◽  
Lead Free Solder ◽  
Optical Polymers ◽  
Reflow Process ◽  
Short Period ◽  
Solder Reflow ◽  
Free Solder

A new class of thermoplastic optical polymers made by substantially fully hydrogenating block copolymers of styrene and butadiene, known as cyclic block copolymers (CBCs), were recently discovered to exhibit lead-free solder reflow resistance with peak reflow temperature up to 260°C. This kind of behavior is uncommon for traditional thermoplastic polymers. The block copolymer design and the resulting nanostructured morphology lead to strong elastic and soft solid material characteristics for CBC, which may explain why CBCs can maintain good dimensional stability at high temperatures (i.e., above its glass transition temperature, Tg) for a short period of time such as in a solder reflow process. This hypothesis was examined by computational fluid dynamics modeling on a molded CBC lens of LUXEON K2 LED package configuration. When the CBC lens is subjected to a simulated solder reflow process, the change in physical dimension due to thermal expansion and gravity effects is predicted to be negligible. However, the residual stress in the molded lens may play a profound role on its dimensional stability. There exists a critical stress value below which no observable deformation is predicted for the CBC lens. With excellent optical transparency and good long term optical stability, low moisture absorption, and good injection moldability, CBCs is a promising class of materials for LED packaging that contributes to improved LED manufacturing economics.

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

2017 ◽  
Author(s):  
Jing Wang ◽  
Yuling Niu ◽  
Seungbae Park
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Energy Release Rate ◽  
Energy Release ◽  
Release Rate ◽  
Strain Energy ◽  
Strain Energy Release Rate ◽  
Strain Energy Release ◽  
Solder Reflow ◽  
Delamination Behavior

In this study, the moisture induced delamination behavior of a plastic ball grid array package under the solder reflow process was investigated by the finite element analysis. The entire moisture history of the PBGA package was simulated for preconditioning at moisture sensitivity level 1 and the subsequent exposure to a soldering reflow. A fracture mechanics based analysis was used to investigate the combined effects of temperature, moisture and vapor pressure on the delamination behavior at the die/molding compound and die/die attach interfaces during solder reflow. For determining the total strain energy release rate and total stress intensity factor under a multiphysics environment like reflow, researchers commonly used the principle of superposition to combine the results from individual thermal stress, hygroscopic stress and vapor pressure induced stress analyses. In this study, a new method was proposed to obtain the total strain energy release rate and total stress intensity factor under the multi-physics environment in a single fracture analysis instead of three. Two different methods-virtual crack closure technique (VCCT) and crack tip opening displacement method (CTOD) were employed and compared in studying the variation of strain energy release rates during lead-free solder reflow. The relationship between the strain energy release rate and crack length was also obtained. The developments of the stress intensity factors due to individual effect of thermal mismatch, hygroscopic swelling and vapor pressure were calculated. The mode mixity was also determined under different temperatures and crack length.

scholarly journals Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

2006 ◽  
Vol 46 (2-4) ◽  
pp. 512-522 ◽  
Author(s):  
Se Young Yang ◽  
Young-Doo Jeon ◽  
Soon-Bok Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Flip Chip ◽  
Electronic Packages ◽  
Reflow Process ◽  
Solder Reflow

Elastic Analysis of Flip-Chip Solder Joints Undergoing Thermal Excursions

1994 ◽  
Vol 116 (2) ◽  
pp. 110-115 ◽  
Author(s):  
H. D. Conway ◽  
P. Bo̸rgesen ◽  
C.-Y. Li
Keyword(s):  
Elastic Deformation ◽  
Quantitative Evaluation ◽  
Flip Chip ◽  
Solder Joints ◽  
Elastic Analysis ◽  
Power Cycles ◽  
Qualitative Understanding ◽  
Area Array

An elastic analysis is developed to provide estimates of the stresses in area array solder joints during thermal excursions. The analysis provides a rapid quantitative evaluation of the important stresses during elastic deformation, and may serve as a basis for the qualitative understanding of the loading of interconnects during thermal and power cycles.

Flip Chip for Image Sensor Packaging

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001898-001917
Author(s):  
Deok-Hoon Kim ◽  
Young-Sang Cho ◽  
Peter Elenius
Keyword(s):  
Flip Chip ◽  
Transient Liquid Phase ◽  
Image Sensor ◽  
Reliability Test ◽  
Seal Ring ◽  
Test Results ◽  
Reflow Process ◽  
Bending Tests ◽  
Joint Structure ◽  
Solder Reflow

The use of flip chip interconnects for image sensor packaging provides several unique challenges during packaging as well as benefits to the customer. The principal challenges during assembly include the requirements of: no contamination of the image sensor during reflow, fabrication of a sealing structure to prevent future environmental contamination of the image sensor, and fabrication of a solder joint structure for the seal ring that can pass pre-conditioning. To achieve these requirements, the use of a fluxless solder reflow process and transient liquid phase (TLP) bonding will be explained. Benefits to the customer for this type of flip chip image sensor packaging as compared to chip on board (COB) and thru silicon via (TSV) packages is a thinner camera module and versus TSV packages the ability to pass all required reliability tests without the use of an underfill. Reliability test results will be shown for thermal cycling, drop, and bending tests.

Development of vapor pressure in FR4-copper composite material during solder reflow process

2012 ◽  
Author(s):  
Nazri Kamsah ◽  
Mohd Nasir Tamin ◽  
Haslinda Mohamed Kamar ◽  
Hidayatunnur Lahuri ◽  
Amir Nur Rashid Wagiman
Keyword(s):  
Composite Material ◽  
Vapor Pressure ◽  
Reflow Process ◽  
Solder Reflow ◽  
Copper Composite

scholarly journals Strategies for inducing heredity of β-Sn texture in micro solder joints during multi-reflow process

2021 ◽  
Vol 204 ◽  
pp. 109671
Author(s):  
Yuanyuan Qiao ◽  
Xiaoying Liu ◽  
Haitao Ma ◽  
Ning Zhao
Keyword(s):  
Solder Joints ◽  
Reflow Process
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