Development of vapor pressure in FR4-copper composite material during solder reflow process

2012 ◽  
Author(s):  
Nazri Kamsah ◽  
Mohd Nasir Tamin ◽  
Haslinda Mohamed Kamar ◽  
Hidayatunnur Lahuri ◽  
Amir Nur Rashid Wagiman
Keyword(s):  
Composite Material ◽  
Vapor Pressure ◽  
Reflow Process ◽  
Solder Reflow ◽  
Copper Composite

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

2005 ◽  
Author(s):  
Toru Ikeda ◽  
Won-Keun Kim ◽  
Noriyuki Miyazaki
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Quantitative Evaluation ◽  
Flip Chip ◽  
Moisture Absorption ◽  
Solder Joints ◽  
Reflow Process ◽  
Sensitivity Tests ◽  
Solder Reflow ◽  
Chip Size

Recently, adhesively bonding techniques such as the anisotropic conductive film (ACF) or the non-conductive adhesive resin are often used for connections in the chip size packages instead of conventional solder joints due to their reasonable cost and the ease of miniaturization. Adhesively bonding techniques expected to be a key technology for the chip size packaging and the system in package. However, the level of reliability for adhesively bonding techniques is still less than that for solder joints. The quantitative evaluation techniques for the reliability of adhesively bonding techniques are desired. This paper focused on the reliability of adhesively bonding joints in a flip chip package during the solder reflow process for other solder jointed devices. This paper presents a methodology for quantitative evaluation of the delamination in a flip chip interconnected by an ACF under moisture/reflow sensitivity tests. The delamination toughnesses between components in a flip chip based on the stress intensity factors were measured by fracture tests in conjunction with the numerical analysis developed in our previous study. Moisture concentration after moisture absorption was expected by the diffusion analysis using the finite element method. Then, vapor pressure in a flip chip during the solder reflow process was estimated. Finally the delamination was predicted by comparing the stress intensity factor of an interface crack due to vapor pressure with the delamination toughness. The delaminations in an actual flip chip package during moisture/reflow sensitivity tests have successfully predicted by the present methodology.

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

2003 ◽  
Vol 125 (1) ◽  
pp. 31-38 ◽  
Author(s):  
Toru Ikeda ◽  
Isao Arase ◽  
Yuya Ueno ◽  
Noriyuki Miyazaki ◽  
Nobutaka Ito ◽  
...  
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Stress Intensity Factors ◽  
Moisture Absorption ◽  
Evaluation Technique ◽  
Reflow Process ◽  
Intensity Factors ◽  
Moisture Concentration ◽  
Plastic Packages ◽  
Solder Reflow

A crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of the asymptotic solution of a corner of jointed dissimilar materials are utilized for the evaluation of a solder reflow crack in a quad flat package (QFP). First, we estimate the critical vapor pressure, which causes a crack from a corner in the molding resin, using the critical stress intensity factor of a V-notch corner. This critical factor was measured by V-notched three-point bending tests and the displacement extrapolation method along with the three dimensional (3-D) finite element method (FEM). Moisture concentration in the QFP after absorption is analyzed, and vapor pressure caused by the solder reflow process is estimated. The critical moisture absorption time, which results in crack occurrence during the solder reflow process, can be predicted using this evaluation technique. Furthermore, we perform infrared solder reflow tests of the QFP for verifying the present failure evaluation technique.

scholarly journals Development and Characterization of Teflon-Copper Composite Material

2018 ◽  
Vol 778 ◽  
pp. 225-229
Author(s):  
Imran Hamid ◽  
Abdul Rauf ◽  
Faisal Nasim ◽  
Muhammad Siddique ◽  
Adnan Gul
Keyword(s):  
Composite Material ◽  
Hot Isostatic Pressing ◽  
Solid Lubricants ◽  
Powder Metallurgy Technique ◽  
Covalent Bonds ◽  
Secondary Bonds ◽  
Three Samples ◽  
Commercial Applications ◽  
Copper Composite

Composites are the combination of materials that are mixed together to achieve specific structural properties. Teflon (Polytetrafluoroethylene PTFE) consists of long-chain molecular structure. Its monomer consists of two carbon atoms each of them having flourine atoms attached. Bonds within each chain are strong covalent bonds where as the secondary bonds between two chains are weaker. By raising temperature, the distance between the chains increases providing good adjustment of the atoms of other materials due to anisotropy of its mechanical properties. Powder metallurgy technique using hot isostatic pressing, a hybrid densification process in which pressure and temperature are applied at the same time, has been used to develop a teflon-copper composite material. Three samples were prepared by changing the teflon-copper composition as 60:40%, 65:35% and 70:30% by weight. Commercially available powders of teflon and copper of grain size ~ 40 μm was used. The aim to develop this type of material was to increase its density (~ 4 g/cm3), and hardness. The commercial applications of such type of composite material are solid lubricants, sleeves, bearings etc. In this paper the effect of composition on hardness, tensile strength and surface roughness is studied.

scholarly journals Particularities of structure formation of aluminum-copper composite materials manufactured by casting technology

2020 ◽  
pp. 116-121
Author(s):  
V. A. Kalinichenko ◽  
A. S. Kalinichenko ◽  
S. V. Grigoriev
Keyword(s):  
Composite Material ◽  
Composite Materials ◽  
Structure Formation ◽  
Matrix Material ◽  
Matrix Alloy ◽  
Alloying Elements ◽  
Casting Technology ◽  
The Matrix ◽  
Reinforcing Material ◽  
Copper Composite

To create friction pairs operating in severe working conditions, composite materials are now increasingly used. Composite materials obtained with the use of casting technologies are of interest due to the possibility to manufacture wide range of compositions at low price compared to powder metallurgy. Despite the fact that many composite materials have been sufficiently studied, it is of interest to develop new areas of application and give them the properties required by the consumer. In the present work the composite materials on the basis of silumin reinforced with copper granules were considered. Attention was paid to the interaction between the matrix alloy and the reinforcing phase material as determining the properties of the composite material. The analysis of distribution of the basic alloying elements in volume of composite material and also in zones of the interphases interaction is carried out. The analysis of the possibility of obtaining a strong interphase zone of contact between the reinforcing component and the matrix material without significant dissolution of the reinforcing material is carried out.

Thermoplastic Optical Polymers with Lead-Free Solder Reflow Resistance for HB-LED Packaging and Assembly

2010 ◽  
Vol 2010 (1) ◽  
pp. 000156-000163
Author(s):  
Weijun Zhou ◽  
Quan Yuan ◽  
Chris Li ◽  
Stephen F. Hahn ◽  
Kurt A. Koppi ◽  
...  
Keyword(s):  
Block Copolymers ◽  
Dimensional Stability ◽  
Moisture Absorption ◽  
Lead Free ◽  
Lead Free Solder ◽  
Optical Polymers ◽  
Reflow Process ◽  
Short Period ◽  
Solder Reflow ◽  
Free Solder

A new class of thermoplastic optical polymers made by substantially fully hydrogenating block copolymers of styrene and butadiene, known as cyclic block copolymers (CBCs), were recently discovered to exhibit lead-free solder reflow resistance with peak reflow temperature up to 260°C. This kind of behavior is uncommon for traditional thermoplastic polymers. The block copolymer design and the resulting nanostructured morphology lead to strong elastic and soft solid material characteristics for CBC, which may explain why CBCs can maintain good dimensional stability at high temperatures (i.e., above its glass transition temperature, Tg) for a short period of time such as in a solder reflow process. This hypothesis was examined by computational fluid dynamics modeling on a molded CBC lens of LUXEON K2 LED package configuration. When the CBC lens is subjected to a simulated solder reflow process, the change in physical dimension due to thermal expansion and gravity effects is predicted to be negligible. However, the residual stress in the molded lens may play a profound role on its dimensional stability. There exists a critical stress value below which no observable deformation is predicted for the CBC lens. With excellent optical transparency and good long term optical stability, low moisture absorption, and good injection moldability, CBCs is a promising class of materials for LED packaging that contributes to improved LED manufacturing economics.

Sign in / Sign up

Export Citation Format

Share Document