Flip Chip for Image Sensor Packaging

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001898-001917
Author(s):  
Deok-Hoon Kim ◽  
Young-Sang Cho ◽  
Peter Elenius
Keyword(s):  
Flip Chip ◽  
Transient Liquid Phase ◽  
Image Sensor ◽  
Reliability Test ◽  
Seal Ring ◽  
Test Results ◽  
Reflow Process ◽  
Bending Tests ◽  
Joint Structure ◽  
Solder Reflow

The use of flip chip interconnects for image sensor packaging provides several unique challenges during packaging as well as benefits to the customer. The principal challenges during assembly include the requirements of: no contamination of the image sensor during reflow, fabrication of a sealing structure to prevent future environmental contamination of the image sensor, and fabrication of a solder joint structure for the seal ring that can pass pre-conditioning. To achieve these requirements, the use of a fluxless solder reflow process and transient liquid phase (TLP) bonding will be explained. Benefits to the customer for this type of flip chip image sensor packaging as compared to chip on board (COB) and thru silicon via (TSV) packages is a thinner camera module and versus TSV packages the ability to pass all required reliability tests without the use of an underfill. Reliability test results will be shown for thermal cycling, drop, and bending tests.

Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps

2005 ◽  
Vol 863 ◽  
Author(s):  
Hermann Oppermann ◽  
Matthias Hutter ◽  
Matthias Klein ◽  
Gunter Engelmann ◽  
Michael Toepper ◽  
...  
Keyword(s):  
Substrate Temperature ◽  
Flip Chip ◽  
Failure Modes ◽  
Compound Semiconductors ◽  
Temperature Cycling ◽  
Reliability Test ◽  
Test Results ◽  
Solder Bumps ◽  
Flip Chip Assembly ◽  
Gold Metallization

AbstractAu/Sn solder bumps are mainly used for flip chip assembly of compound semiconductors in optoelectronic and RF applications. They allow a fluxless assembly which is required to avoid contamination of optical interfaces and the metallurgy is well suited to the final gold metallization on GaAs or InP. Flip chip assembly experiments were carried out using two layer Au/Sn bumps as plated without prior bump reflow. An RF and reliability test vehicles comprise a GaAs chip which was flip chip soldered on a silicon substrate. Temperature cycling tests with and without underfiller were performed. The different failure modes for underfilled and nonunderfilled samples were discussed and compared. Additional reliability tests were performed with flip chip bonding by gold thermocompression for comparison. The test results and the failure modes are discussed in detail.

scholarly journals Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages

2006 ◽  
Vol 46 (2-4) ◽  
pp. 512-522 ◽  
Author(s):  
Se Young Yang ◽  
Young-Doo Jeon ◽  
Soon-Bok Lee ◽  
Kyung-Wook Paik
Keyword(s):  
Flip Chip ◽  
Electronic Packages ◽  
Reflow Process ◽  
Solder Reflow

Predicting Technique of Delamination at Adhesively Bonding Joints in a Flip Chip Package During Solder Reflow Process

2005 ◽  
Author(s):  
Toru Ikeda ◽  
Won-Keun Kim ◽  
Noriyuki Miyazaki
Keyword(s):  
Stress Intensity ◽  
Vapor Pressure ◽  
Quantitative Evaluation ◽  
Flip Chip ◽  
Moisture Absorption ◽  
Solder Joints ◽  
Reflow Process ◽  
Sensitivity Tests ◽  
Solder Reflow ◽  
Chip Size

Recently, adhesively bonding techniques such as the anisotropic conductive film (ACF) or the non-conductive adhesive resin are often used for connections in the chip size packages instead of conventional solder joints due to their reasonable cost and the ease of miniaturization. Adhesively bonding techniques expected to be a key technology for the chip size packaging and the system in package. However, the level of reliability for adhesively bonding techniques is still less than that for solder joints. The quantitative evaluation techniques for the reliability of adhesively bonding techniques are desired. This paper focused on the reliability of adhesively bonding joints in a flip chip package during the solder reflow process for other solder jointed devices. This paper presents a methodology for quantitative evaluation of the delamination in a flip chip interconnected by an ACF under moisture/reflow sensitivity tests. The delamination toughnesses between components in a flip chip based on the stress intensity factors were measured by fracture tests in conjunction with the numerical analysis developed in our previous study. Moisture concentration after moisture absorption was expected by the diffusion analysis using the finite element method. Then, vapor pressure in a flip chip during the solder reflow process was estimated. Finally the delamination was predicted by comparing the stress intensity factor of an interface crack due to vapor pressure with the delamination toughness. The delaminations in an actual flip chip package during moisture/reflow sensitivity tests have successfully predicted by the present methodology.

Manufacturing In-Line Whole Wafer Focused Ion Beam (FIB) Memory Address Descramble Verification

2008 ◽  
Author(s):  
Steven B. Herschbein ◽  
Hyoung H. Kang ◽  
Scott L. Jansen ◽  
Andrew S. Dalton
Keyword(s):  
Flip Chip ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Random Access ◽  
Cell Counting ◽  
Test Results ◽  
Laboratory Procedure ◽  
Memory Array ◽  
Dual Beam ◽  
Process Level

Abstract Test engineers and failure analyst familiar with random access memory arrays have probably encountered the frustration of dealing with address descrambling. The resulting nonsequential internal bit cell counting scheme often means that the location of the failing cell under investigation is nowhere near where it is expected to be. A logical to physical algorithm for decoding the standard library block might have been provided with the design, but is it still correct now that the array has been halved and inverted to fit the available space in a new processor chip? Off-line labs have traditionally been tasked with array layout verification. In the past, hard and soft failures could be induced on the frontside of finished product, then bitmapped to see if the sites were in agreement. As density tightened, flip-chip FIB techniques to induce a pattern of hard fails on packaged devices came into practice. While the backside FIB edit method is effective, it is complex and expensive. The installation of an in-line Dual Beam FIB created new opportunities to move FA tasks out of the lab and into the FAB. Using a new edit procedure, selected wafers have an extensive pattern of defects 'written' directly into the memory array at an early process level. Bitmapping of the RAM blocks upon wafer completion is then used to verify correlation between the physical damaged cells and the logical sites called out in the test results. This early feedback in-line methodology has worked so well that it has almost entirely displaced the complex laboratory procedure of backside FIB memory array descramble verification.

Transient liquid phase bonding of Cu and Al using metallic particles interlayers

2021 ◽  
pp. 095440542098823
Author(s):  
Alireza Zaheri ◽  
Mohammadreza Farahani ◽  
Alireza Sadeghi ◽  
Naser Souri
Keyword(s):  
Liquid Phase ◽  
Mechanical Test ◽  
Transient Liquid Phase ◽  
Transient Liquid Phase Bonding ◽  
Joint Interface ◽  
Test Results ◽  
X Ray Diffraction ◽  
X Ray ◽  
Metallic Particles ◽  
Powder Interlayer

The bonding strength, and microstructures of Cu and Al couples using metallic powders as interlayer during transient liquid phase bonding (TLP bonding) were investigated. The interfacial morphologies and microstructures were studied by scanning electron microscopy equipped with energy dispersive X-ray spectroscopy, and X-ray diffraction. First, to explore the optimum bonding time and temperature, nine samples were bonded without interlayers in a vacuum condition. Mechanical test results indicated that bonding at 560°C in 20 min returns the highest bond strength (84% of Al). This bonding condition was used to join ten samples with powder interlayers. Powders were prepared by mixing different combinations of Cu, Al (+Fe nanoparticles) and Zn. In the bonding zone, different Cu9Al4, CuAl, and CuAl2 intermetallic co-precipitate. The strongest bonding is formed in the sample with the 70Al (+Fe)-30Cu powder interlayer. Powder interlayers present thinner and more uniform intermetallic layers at the joint interface.

The Influence of Understanding Accounting Information Systems, Leadership Style, Employee Motivation, and Work Discipline in Employees Performance KC BRI Sidoarjo

Academia Open ◽  
2021 ◽  
Vol 5 ◽  
Author(s):  
Shafrino Wahyu ◽  
Herman Ernandi
Keyword(s):  
Information Systems ◽  
Leadership Style ◽  
Hypothesis Test ◽  
Accounting Information ◽  
Research Data ◽  
Reliability Test ◽  
Test Results ◽  
Accounting Information Systems ◽  
Validity Test ◽  
Systems Leadership

This research aims to know the influence of understanding Accounting Information Systems, Leadership Style, Employees Motivation, and Work Discipline in Employees Performance at KC BRI Sidoarjo. The instrument is in the form of google forms to get research data. This research data collection is validity test and reliability test. The hypothesis is that there is an the influence of understanding accounting information systems, leadership style, employees motivation, and work discipline in employees performance. The analytical tool used to test the hypothesis is SPSS version 18. The test results based on the validity test show that all questions on Google Forms are declared valid. While the test results based on the reliability test of all variables, the value of cronbach's alpha > 0,6 means that it is declared reliable and for the results of the Hypothesis Test in the form of T-Statistic and R-Square, it states that there is an influence between understanding accounting information systems, leadership style, employees motivation, and work discipline in employees performance. This is shown from the results of tcount for the variable understanding of the accounting information system (X1) of 2.113, the variable of leadership style (X2) of 2.101, the variable of employees motivation (X3) of 2.114, and the variable of work discipline (X4) of 2.189.

Modified Equation to Predict Leak/Rupture Criteria for Axially Through-Wall Notched X80 and X100 Linepipes Having Higher Charpy Energy

2004 ◽  
Author(s):  
Shinobu Kawaguchi ◽  
Naoto Hagiwara ◽  
Mitsuru Ohata ◽  
Masao Toyoda
Keyword(s):  
Fracture Toughness ◽  
Flow Stress ◽  
Pipe Material ◽  
Test Results ◽  
Absorbed Energy ◽  
Bending Tests ◽  
Full Scale Tests ◽  
Hoop Stresses ◽  
The Relationship ◽  
Modified Equation

A method of predicting the leak/rupture criteria for API 5L X80 and X100 linepipes was evaluated, based on the results of hydrostatic full-scale tests for X60, X65, X80 and X100 linepipes with an axially through-wall (TW) notch. The TW notch test results clarified the leak/rupture criteria, that is, the relationship between the initial notch lengths and the maximum hoop stresses during the TW notch tests. The obtained leak/rupture criteria were then compared to the prediction of the Charpy V-notch (CVN) absorbed energy-based equation, which has been proposed by Kiefner et al. The comparison revealed that the CVN-based equation was not applicable to the pipes having a CVN energy (Cv) greater than 130 J and flow stress greater than X65. In order to predict the leak/rupture criteria for these linepipes, the static absorbed energy for ductile cracking, (Cvs)i, was introduced as representing the fracture toughness of a pipe material. The (Cvs)i value was determined from the microscopic observation of the cut and buffed Charpy V-notch specimens after static 3-point bending tests. The CVN energy in the original CVN-based equation was replaced by an equivalent CVN energy, (Cv)eq’ which was defined as follows: (Cv)eq = 4.5 (Cvs)i. The leak/rupture criteria for the X80 and X100 linepipes with higher CVN energies were reasonably predicted by the modified equation using the (Cvs)i value.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

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