Study on Alternative Cooling Methods Beyond Next Generation Microprocessors

2003 ◽  
Author(s):  
Albert Chan ◽  
Jie Wei
Keyword(s):  
Heat Dissipation ◽  
Low Cost ◽  
Ambient Pressure ◽  
Operating Conditions ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Field Service ◽  
Cooling Methods

Feasibility study on alternative cooling methods to air-cooling with heat sinks is provided in this paper. The study focuses on cooling of 64-bit microprocessor at 80nm technology node with projected heat dissipation of 200W. An example was presented to illustrate limitation of air-cooling for the 200W microprocessor using an all-Cu heat sink with tall fins. Three alternatives to air-cooling were studied in this work: liquid cooling, two-phase convective flow cooling and refrigeration cooling. Thermodynamic analysis was used to estimate operating conditions and fluid flow rates for each alternative. The information provides a preliminary basis for assessing capabilities and weaknesses among alternatives. Liquid and two-phase cooling simply transfer heat from high to low temperature. In contrast, refrigeration cooling operates as a heat pump, moving heat from low to high temperature. Refrigeration cooling offers capability to cool microprocessor (LSI) chip to temperatures below ambient or freezing. The drawback is more heat must be removed from the system. Liquid cooling operates at close to ambient pressure, while two-phase and refrigeration cooling operate at higher pressures. Challenges to implementation of all three alternatives include availability of low cost, miniature components (pumps or compressors, heat exchanger and condenser), designing for redundancy (or reliability) and ease of installation and field service. In terms of component availability and cost, liquid cooling is preferred choice, followed by two-phase and refrigeration cooling.

New Thermal Management Systems for Data Centers

2012 ◽  
Vol 4 (3) ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Takashi Kitagawa ◽  
Haruhiko Ohta ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Single Phase ◽  
Data Centers ◽  
Cooling System ◽  
Heat Pipes ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Cooling Jacket ◽  
Cooling Methods

Energy consumption in data centers has seen a drastic increase in recent years. In data centers, server racks are cooled down in an indirect way by air-conditioning systems installed to cool the entire server room. This air cooling method is inefficient as information technology (IT) equipment is insufficiently cooled down, whereas the room is overcooled. The development of countermeasures for heat generated by IT equipment is one of the urgent tasks to be accomplished. We, therefore, proposed new liquid cooling systems in which IT equipment is cooled down directly and exhaust heat is not radiated into the server room. Three cooling methods have been developed simultaneously. Two of them involve direct cooling; a cooling jacket is directly attached to the heat source (or CPU in this case) and a single-phase heat exchanger or a two-phase heat exchanger is used as the cooling jacket. The other method involves indirect cooling; heat generated by CPU is transported to the outside of the chassis through flat heat pipes and the condensation sections of the heat pipes are cooled down by coolant with liquid manifold. Verification tests have been conducted by using commercial server racks to which these cooling methods are applied while investigating five R&D components that constitute our liquid cooling systems: the single-phase heat exchanger, the two-phase heat exchanger, high performance flat heat pipes, nanofluid technology, and the plug-in connector. As a result, a 44–53% reduction in energy consumption of cooling facilities with the single-phase cooling system and a 42–50% reduction with the flat heat pipe cooling system were realized compared with conventional air cooling system.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

Liquid Cooling Network Systems for Energy Conservation in Data Centers

2011 ◽  
Author(s):  
Mayumi Ouchi ◽  
Yoshiyuki Abe ◽  
Masato Fukagaya ◽  
Haruhiko Ohta ◽  
Yasuhisa Shinmoto ◽  
...  
Keyword(s):  
Heat Exchanger ◽  
Data Center ◽  
Single Phase ◽  
Cooling System ◽  
Heat Pipes ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Cooling Systems ◽  
Cooling Methods

Energy consumption in data center has been drastically increasing in recent years. In data center, server racks are cooled down by air conditioning for the whole room in a roundabout way. This air cooling method is inefficient in cooling and it causes hotspot problem that IT equipments are not cooled down enough, but the room is overcooled. On the other hand, countermeasure against the heat of the IT equipments is also one of the big issues. We therefore proposed new liquid cooling systems which IT equipments themselves are cooled down and exhaust heat is not radiated into the server room. For our liquid cooling systems, three kinds of cooling methods have been developed simultaneously. Two of them are direct cooling methods that the cooling jacket is directly attached to heat source, or CPU in this case. Single-phase heat exchanger or two-phase heat exchanger is used as cooling jackets. The other is indirect cooling methods that the heat generated from CPU is transported to the outside of the chassis through flat heat pipes, and condensation sections of the heat pipes are cooled down by liquid. Verification tests have been conducted by use of real server racks equipped with these cooling techniques while pushing ahead with five R&D subjects which constitute our liquid cooling system, which single-phase heat exchanger, two-phase heat exchanger, high performance flat heat pipes, nanofluids technology, and plug-in connector. As a result, the energy saving effect of 50∼60% comparing with conventional air cooling system was provided in direct cooling technique with single-phase heat exchanger.

Dropwise Condensation on Carbon Steel Surface

2016 ◽  
Author(s):  
Fangyu Cao ◽  
Sean Hoenig ◽  
Chien-hua Chen
Keyword(s):  
Heat Transfer ◽  
Carbon Steel ◽  
Power Plants ◽  
Heat Dissipation ◽  
Low Cost ◽  
Condensation Heat Transfer ◽  
Working Fluid ◽  
High Heat Flux ◽  
Dropwise Condensation ◽  
Two Phase

The increasing demand of heat dissipation in power plants has pushed the limits of current two-phase thermal technologies such as heat pipes and vapor chambers. One of the most obvious areas for thermal improvement is centered on the high heat flux condensers including improved evaporators, thermal interfaces, etc, with low cost materials and surface treatment. Dropwise condensation has shown the ability to increase condensation heat transfer coefficient by an order of magnitude over conventional filmwise condensation. Current dropwise condensation research is focused on Cu and other special metals, the cost of which limits its application in the scale of commercial power plants. Presented here is a general use of self-assembled monolayer coatings to promote dropwise condensation on low-cost steel-based surfaces. Together with inhibitors in the working fluid, the surface of condenser is protected by hydrophobic coating, and the condensation heat transfer is promoted on carbon steel surfaces.

Relative Cooling With Liquid for Gas Turbines: Part I — A Solution for Exceeding 2000 K at Turbine Inlet

2001 ◽  
Author(s):  
Sandu Constantin ◽  
Dan Brasoveanu
Keyword(s):  
Thermal Efficiency ◽  
Gas Turbines ◽  
Cooling System ◽  
Turbine Blades ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Cooling Systems ◽  
Turbine Inlet ◽  
Cooling Methods ◽  
Current Operating

Abstract The thermal efficiency of gas turbines is critically dependent on the temperature of burnt gases at turbine inlet, the higher this temperature the higher the efficiency. Stochiometric combustion would provide maximum efficiency, but in the absence of an internal cooling system, turbine blades cannot tolerate gas temperatures that exceed 1300 K. Therefore, for this temperature, the thermal efficiency of turbine engine is 40% less than theoretical maximum. Conventional air-cooling techniques of turbine blades allow inlet temperatures of about 1500 K on current operating engines yielding thermal efficiency gains of about 6%. New designs, that incorporate advanced air-cooling methods allows inlet temperatures of 1750–1800 K, with a thermal efficiency gain of about 6% relative to current operating engines. This temperature is near the limit allowed by air-cooling systems. Turbine blades can be cooled with air taken from the compressor or with liquid. Cooling systems with air are easier to design but have a relatively low heat transfer capacity and reduce the efficiency of the engine. Some cooling systems with liquid rely on thermal gradients to promote re-circulation from the tip to the root of turbine blades. In this case, the flow and cooling of liquid are restricted. For best results, cooling systems with liquid should use a pump to re-circulate the coolant. In the past, designers tried to place this pump on the engine stator and therefore were unable to avoid high coolant losses because it is impossible to reliably seal the stator-rotor interface. Therefore it was assumed that cooling systems with liquid could not incorporate pumps. This is an unwarranted assumption as shown studying the system in a moving frame of reference that is linked to the rotor. Here is the crucial fact overlooked by previous designers. The relative motion of engine stator with respect to the rotor is sufficient to motivate a cooling pump. Both the pump and heat exchange system that is required to provide rapid cooling of liquid with cold ambient air, could be located within the rotor. Therefore, the entire cooling system can be encapsulated within the rotor and the sealing problem is circumvented. Compared to recent designs that use advanced air-cooling methods, such a liquid cooling system would increase the thermal efficiency by 8%–11% because the temperatures at turbine inlet can reach stoichiometric levels and most of the heat extracted from turbine during cooling is recuperated. The appreciated high reliability of the system will permit a large applicability in aerospace propulsion.

Numerical Investigation of Heat Transfer and Pressure Loss of Double-Layer Microchannels for Chip Liquid Cooling

2012 ◽  
Author(s):  
Gongnan Xie ◽  
Yanquan Liu ◽  
Bengt Sunden ◽  
Weihong Zhang ◽  
Jun Zhao
Keyword(s):  
Heat Transfer ◽  
Double Layer ◽  
Pressure Loss ◽  
Heat Dissipation ◽  
Thermal Characteristics ◽  
Parallel Flow ◽  
Air Cooling ◽  
Pumping Power ◽  
Liquid Cooling ◽  
Counter Flow

The problem involved in the increase of the chip output power of high-performance integrated electronic devices is the failure of reliability because of excessive thermal loads. This requires advanced cooling methods to manage the increase of the dissipated heat. The traditional air-cooling may not meet the requirements, and therefore a new generation of liquid cooling technology becomes necessary. Various microchannels are widely used to cool the electronic chips by a gas or liquid, but these microchannels are often designed to be single-layer channels. In this paper, the laminar heat transfer and pressure loss in a kind of double-layer microchannel have been investigated numerically. The layouts of parallel-flow and counter-flow for inlet/outlet flow directions are designed and then several sets of inlet flowrates are considered. The simulations show that such a double-layer microchannel can not only reduce the pressure drop effectively but also exhibits better thermal characteristics, and the parallel-flow layout is found to be better for heat dissipation when the pumping power is limited, while the counter-flow layout is better when a high pumping power is provided.

Experimental Characterization of an Open Loop Pulsating Heat Pipe Cooler

2014 ◽  
Author(s):  
Daniele Torresin ◽  
Mathieu Habert ◽  
Francesco Agostini ◽  
Bruno Agostini ◽  
Violette Mounier
Keyword(s):  
Heat Pipe ◽  
Heat Load ◽  
Low Cost ◽  
Fluid Pressure ◽  
Electronics Cooling ◽  
Open Loop ◽  
Air Cooling ◽  
Pulsating Heat Pipe ◽  
Two Phase ◽  
Term Operation

Pulsating heat pipes (PHP) have emerged in the last years as suitable cooling devices for dissipating the high heat loads generated by electronic devices since they allow to extend the applicability of air cooling in area nowadays covered by water cooling. Two-phase cooling technologies based on the two phase pulsating heat pipe principle are promising solutions because, being entirely passive they can comply with long term operation without maintenance. The main advantage of a PHP compared to conventional thermosyphon technologies for electronics cooling is that a PHP is orientation independent. The authors has developed a novel, compact, and low cost PHP based on automotive technology. The present paper presents the experimental results of an air cooled open loop pulsating heat pipe with optimized manifold design to minimize fluid pressure drops in the fluid turns. The effect of several parameters including filling ratio and heat load are presented. Tests have been done with the refrigerant fluid R245fa in vertical and horizontal orientations. The measurements showed a maximum thermal resistance ranging between 40 and 48 K/kW in vertical and horizontal position respectively for a heat load of 2 kW and air temperature of 20 °C.

scholarly journals Simulation of heat dissipation model of lithium-ion battery pack

2021 ◽  
Vol 300 ◽  
pp. 01014
Author(s):  
Maode Li ◽  
Chuan He ◽  
Jinkui Zheng
Keyword(s):  
Phase Change ◽  
Temperature Rise ◽  
Heat Dissipation ◽  
Lithium Ion ◽  
Maximum Temperature ◽  
Air Cooling ◽  
Power Battery ◽  
Staggered Arrangement ◽  
Dissipation Model ◽  
Cooling Methods

Lithium-ion power battery has become an important part of power battery. According to the performance and characteristics of lithiumion power battery, the influence of current common charge and discharge and different cooling methods on battery performance was analysed in this paper. According to the software simulation, in the 5C charge-discharge cycle, the maximum temperature of the cells with regular arrangement is 57.97°C, the maximum temperature of the cells with staggered arrangement is 55.83°C, and the maximum temperature of phase change cooling is 47.42°C. The most important thing is that the temperature difference between the cells with phase change cooling is only 5.5°C. Some simulation results of air cooling and phase change show that phase change cooling can control the heat dissipation and temperature rise of power battery well. The research in this paper can provide better theoretical guidance for the temperature rise, heat transfer and thermal management of automotive power battery.

Imminent Needs in Future Development of Air Cooled Microprocessors Heat Sinks

2010 ◽  
Vol 2010 (1) ◽  
pp. 000434-000439
Author(s):  
V. Ganescu ◽  
A. Pascu
Keyword(s):  
Heat Dissipation ◽  
Heat Removal ◽  
Leading Edge ◽  
Ambient Air ◽  
Heat Sinks ◽  
System Level ◽  
Air Cooling ◽  
Cfd Simulations ◽  
Constant Heat ◽  
Laminar Convection

This study reiterates the fact that revolutionary heat sink geometries, materials and overall exponentially higher performing alternatives are continuously and highly needed as applied to the air cooling of a typical computer system microprocessor. Attention was focused on forced convection regimes of operation and from a system level approach. Minor improvements in the performance of air cooled microprocessor heat sinks via typical small design improvements are discussed. Laminar convection and constant heat dissipation were looked at. The CFD simulations exemplified were completed for several power levels and ambient air characterized by a Pr = 0.71. The numerical results presented coincided in large with the experimentally derived documented data. In conclusion, the authors stress the fact that leading-edge alternatives in air-cooled heat removal of such applications are imperiously necessary.

Improved Air Cooling Heat Pipe Based Thermal Solutions for Heat Sinks in Optical Plug Modules

2015 ◽  
Author(s):  
Ehsan B. Haghighi ◽  
Thanh L. Phan ◽  
Vijit Wuttijumnong ◽  
Koichi Mashiko ◽  
Yuji Saito ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Data Communication ◽  
Heat Pipes ◽  
Heat Sinks ◽  
Air Cooling ◽  
Airflow Rate ◽  
Total Thermal Resistance ◽  
Free And Forced Convection ◽  
Conventional Cooling ◽  
Cooling Methods

Ever-increasing both data speed and traffic volume in the network telecommunications; as a result, producing more heat loss, challenges the conventional cooling methods. An optical plug module is a transceiver in data communication applications. By increasing the cooling demands, new thermal management solutions are necessary for optical plug modules. This article experimentally studies the heat pipe based cooling solutions for the optical plug modules. Heat pipes can passively transfer part of the produced heat from the hardly accessible places of the modules and expose it to the present active air cooling. Three different heat pipe based arrangements for a four-port optical plug assembly at both free and forced convection were investigated. Based on the results heat pipes helped to reduce heat sinks and total thermal resistance of this assembly on average by 27% and 16%, respectively under airflow rate of 10 ft3/min.

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