Numerical Optimization of a Electroosmotically Enhanced Microchannel Heat Sink

2009 ◽  
Author(s):  
Afzal Husain ◽  
Kwang-Yong Kim
Keyword(s):  
Zeta Potential ◽  
Heat Sink ◽  
Scale Effects ◽  
Potential Temperature ◽  
Three Dimensional ◽  
Ionic Concentration ◽  
Heat Sinks ◽  
Microchannel Heat Sink ◽  
Design Variables ◽  
Micro Pump

A liquid flow microchannel heat sink has been studied with the help of three-dimensional numerical analysis for mixed (electroosmotic and pressure-driven) flow. The optimization of the microchannel heat sink has been performed with the help of surrogate method coupled with multi-objective evolutionary algorithms. The effects of ionic concentration represented by the zeta potential and Debye thickness are studied at various levels of externally applied electric potential. Temperature dependent coolant properties are considered to take into account the micro-scale effects for accurately predicting the thermal performance of the microchannel heat sink. Higher value of zeta potential leads to higher flow-rate and lower thermal resistance which consequently reduced the temperature of the microprocessor chip and load of micro-pump used to supply the coolant to the microchannels. Two design variables are selected related to the microchannel width, depth and fin width and design space is explored through four-level full factorial design. The channel width-to-depth ratio is found to be higher Pareto-sensitive (sensitivity along the Pareto-optimal front) than the other design variable. The trade-off between objective functions and Pareto-sensitivity of the design variables can be utilized to economically design the microchannel heat sinks. In view of the limiting pumping power available at the micro-level the application of the electroosmosis along with the commonly used pumping source can greatly enhance the performance of the microchannel heat sink.

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Optimization Under Uncertainty of Manifold Microchannel Heat Sinks

2012 ◽  
Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimization Under Uncertainty ◽  
Microchannel Heat Sink ◽  
Probabilistic Optimization ◽  
Manifold Microchannel

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

2009 ◽  
Vol 131 (2) ◽  
Author(s):  
Afzal Husain ◽  
Kwang-Yong Kim
Keyword(s):  
Shape Optimization ◽  
Thermal Resistance ◽  
Objective Function ◽  
Response Surface ◽  
Heat Sink ◽  
Fractional Factorial ◽  
Surface Model ◽  
Microchannel Heat Sink ◽  
Reference Shape ◽  
Design Variables

A microchannel heat sink shape optimization has been performed using response surface approximation. Three design variables related to microchannel width, depth, and fin width are selected for optimization, and thermal resistance has been taken as objective function. Design points are chosen through a three-level fractional factorial design of sampling methods. Navier–Stokes and energy equations for steady, incompressible, and laminar flow and conjugate heat transfer are solved at these design points using a finite volume solver. Solutions are carefully validated with the analytical and experimental results and the values of objective function are calculated at the specified design points. Using the numerically evaluated objective-function values, a polynomial response surface model is constructed and the optimum point is searched by sequential quadratic programming. The process of shape optimization greatly improves the thermal performance of the microchannel heat sink by decreasing thermal resistance of about 12% of the reference shape. Sensitivity of objective function to design variables has been studied to utilize the substrate material efficiently.

Enhanced Thermal Transport in Microchannel Using Oblique Fins

2012 ◽  
Vol 134 (10) ◽  
Author(s):  
Y. J. Lee ◽  
P. S. Lee ◽  
S. K. Chou
Keyword(s):  
Heat Transfer ◽  
Boundary Layer ◽  
Heat Transfer Enhancement ◽  
Heat Sink ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Transfer Enhancement ◽  
Microchannel Heat Sinks

Sectional oblique fins are employed, in contrast to continuous fins in order to modulate the flow in microchannel heat sinks. The breakage of a continuous fin into oblique sections leads to the reinitialization of the thermal boundary layer at the leading edge of each oblique fin, effectively reducing the boundary layer thickness. This regeneration of entrance effects causes the flow to always be in a developing state, thus resulting in better heat transfer. In addition, the presence of smaller oblique channels diverts a small fraction of the flow into adjacent main channels. The secondary flows created improve fluid mixing, which serves to further enhance heat transfer. Both numerical simulations and experimental investigations of copper-based oblique finned microchannel heat sinks demonstrated that a highly augmented and uniform heat transfer performance, relative to the conventional microchannel, is achievable with such a passive technique. The average Nusselt number, Nuave, for the copper microchannel heat sink which uses water as the working fluid can increase as much as 103%, from 11.3 to 22.9. Besides, the augmented convective heat transfer leads to a reduction in maximum temperature rise by 12.6 °C. The associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective heat transfer enhancement scheme for a single-phase microchannel heat sink.

Forced Convection Computational Fluid Dynamics Analysis of Architected and Three-Dimensional Printable Heat Sinks Based on Triply Periodic Minimal Surfaces

2020 ◽  
Vol 13 (2) ◽  
Author(s):  
Oraib Al-Ketan ◽  
Mohamed Ali ◽  
Mohamad Khalil ◽  
Reza Rowshan ◽  
Kamran A. Khan ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Heat Transfer Coefficient ◽  
Minimal Surfaces ◽  
Heat Sink ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Triply Periodic Minimal Surfaces ◽  
Triply Periodic

Abstract The drive for small and compact electronic components with higher processing capabilities is limited by their ability to dissipate the associated heat generated during operations, and hence, more advanced heat sink designs are required. Recently, the emergence of additive manufacturing techniques facilitated the fabrication of complex structures and overcame the limitation of traditional techniques such as milling, drilling, and casting. Therefore, complex heat sink designs are now easily realizable. In this study, we propose a design procedure for mathematically realizable architected heat sinks and investigate their performance using the computational fluid dynamics (CFD) approach. The proposed heat sinks are mathematically designed with topologies based on triply periodic minimal surfaces (TPMSs). Three-dimensional CFD models are developed using the starccm+ platform for uniform heat sinks and topologically graded heat sinks to study the heat transfer performance in forced convection domains. The overall heat transfer coefficient, surface temperature, and pressure drop versus the input heat sources as well as the Reynolds number are used to evaluate the heat sink performance. Moreover, temperature contours and velocity streamlines were examined to analyze the fluid flow behavior within the heat sinks. Results showed that the tortuosity and channel complexity of the Diamond solid-networks heat sink result in a 32% increase in convective heat transfer coefficient compared with the Gyroid solid-network heat sink which has the comparable surface area under the examined flow conditions. This increase is at the expense of increased pressure drops which increases by the same percentage. In addition, it was found that expanding channel size along flow direction using the porosity grading approach results in significant pressure drop (27.6%), while the corresponding drop in convective heat transfer is less significant (15.7%). These results show the importance of employing functional grading in the design of heat sinks. Also, the manufacturability of the proposed designs was assessed using computerized tomography (CT) scan and scanning electron microscopy (SEM) imaging performed on metallic samples fabricated using powder bed fusion techniques. A visible number of internal manufacturing defects can affect the performance of the proposed heat sinks.

Thermal Analysis for Three-Dimensional Heat Spreader Integrated With Heat Sink

2003 ◽  
Author(s):  
Y. C. Wu ◽  
H. T. Chen ◽  
C. C. Lin ◽  
Y. H. Hung
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Heat Sources ◽  
Heat Spreader ◽  
Discrete Heat Sources ◽  
Thermal Analyzer ◽  
Parametric Studies ◽  
Overall Resistance

An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces; and overall resistance of heat spreader/sink assembly are investigated. Besides, a series of parametric studies have been performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, size and material of heat spreaders and heat sinks, type of convection in heat sink, and contact conditions between heat spreader and heat sink. The superiority of the developed thermal analyzer through two sample cases having multi-discrete heat sources has finally been demonstrated.

Thermal Design Criteria for Extraordinary Performance of Devices Cooled by Microchannel Heat Sink

2010 ◽  
Vol 2 (4) ◽  
Author(s):  
Dylan Farnam ◽  
Bahgat Sammakia ◽  
Kanad Ghose
Keyword(s):  
Contact Area ◽  
Heat Sink ◽  
Heat Removal ◽  
Thermal Design ◽  
Heat Sinks ◽  
Design Criteria ◽  
Microchannel Heat Sink ◽  
Device Architecture ◽  
Microchannel Heat Sinks ◽  
Thermal Solution

Increasing power dissipation in microprocessors and other devices is leading to the consideration of more capable thermal solutions than the traditional air-cooled fin heat sinks. Microchannel heat sinks (MHSs) are promising candidates for long-term thermal solution given their simplicity, performance, and the development of MHS-compatible 3D device architecture. As the traditional methods of cooling generally have uniform heat removal on the contact area with the device, thermal consequences of design have traditionally been considered only after the layout of components on a device is finalized in accordance with connection and other criteria. Unlike traditional cooling solutions, however, microchannel heat sinks provide highly nonuniform heat removal on the contact area with the device. This feature is of utmost importance and can actually be used quite advantageously, if considered during the design phase of a device. In this study, simple thermal design criteria governing the general placement of components on devices to be cooled by microchannel heat sink are developed and presented. These thermal criteria are not meant to supersede connection and other important design criteria but are intended as a necessary and valuable supplement. Full-scale numerical simulations of a device with a realistic power map cooled by microchannel heat sink prove the effectiveness of the criteria, showing large reduction in maximum operating temperature and harmful temperature gradients. The simulations further show that the device and microchannel heat sink can dissipate a comparatively high amount of power, with little thermal danger, when design considers the criteria developed herein.

A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

2010 ◽  
Author(s):  
Aziz Koyuncuog˘lu ◽  
Tuba Okutucu ◽  
Haluk Ku¨lah
Keyword(s):  
Heat Sink ◽  
Complementary Metal Oxide Semiconductor ◽  
Heat Sinks ◽  
Oxide Semiconductor ◽  
Microchannel Heat Sink ◽  
Liquid Cooling ◽  
Chip Cooling ◽  
Electronic Circuitry ◽  
Cmos Compatible ◽  
Adjacent Channels

A novel complementary metal oxide semiconductor (CMOS) compatible microchannel heat sink is designed and fabricated for monolithic liquid cooling of electronic circuits. The microchannels are fabricated with full metal walls between adjacent channels with a polymer top layer for easy sealing and optical visibility of the channels. The use of polymer also provides flexibility in adjusting the width of the channels allowing better management of the pressure drop. The proposed microchannel heat sink requires no design change of the electronic circuitry underneath, hence, can be produced by adding a few more steps to the standard CMOS fabrication flow. The microchannel heat sinks were tested successfully under various heat flux and coolant flow rate conditions. The preliminary cooling tests indicate that the proposed design is promising as a monolithic liquid cooling solution for CMOS circuits.

Multiobjective Optimization of a Microchannel Heat Sink Using Evolutionary Algorithm

2008 ◽  
Vol 130 (11) ◽  
Author(s):  
Afzal Husain ◽  
Kwang-Yong Kim
Keyword(s):  
Multiobjective Optimization ◽  
Evolutionary Algorithm ◽  
Performance Optimization ◽  
Heat Sink ◽  
Algorithm Design ◽  
Pareto Optimal ◽  
Microchannel Heat Sink ◽  
Objective Functions ◽  
Design Variables ◽  
Polynomial Response Surface

A multiobjective performance optimization of microchannel heat sink is carried out numerically applying surrogate analysis and evolutionary algorithm. Design variables related to microchannel width, depth, and fin width are selected, and two objective functions, thermal resistance and pumping power, are employed. With the help of finite volume solver, Navier–Stokes analyses are performed at the design sites obtained from full factorial design of sampling methods. Using the numerically evaluated objective function values, polynomial response surface is constructed for each objective functions, and multiobjective optimization is performed to obtain global Pareto optimal solutions. Analysis of optimum solutions is simplified by carrying out trade-off with design variables and objective functions. Objective functions exhibit changing sensitivity to design variables along the Pareto optimal front.

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