Thermal Analysis for Three-Dimensional Heat Spreader Integrated With Heat Sink

2003 ◽  
Author(s):  
Y. C. Wu ◽  
H. T. Chen ◽  
C. C. Lin ◽  
Y. H. Hung
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Heat Sources ◽  
Heat Spreader ◽  
Discrete Heat Sources ◽  
Thermal Analyzer ◽  
Parametric Studies ◽  
Overall Resistance

An effective thermal analyzer for exploring the thermal performance of 3-D heat spreader having discrete heat sources integrated with heat sink has been successfully developed in the study. The thermal performances such as local temperature distributions and isotherms on heat spreader surfaces; and overall resistance of heat spreader/sink assembly are investigated. Besides, a series of parametric studies have been performed. The parameters and conditions explored include the size and heat dissipation rate of heat sources, size and material of heat spreaders and heat sinks, type of convection in heat sink, and contact conditions between heat spreader and heat sink. The superiority of the developed thermal analyzer through two sample cases having multi-discrete heat sources has finally been demonstrated.

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

scholarly journals Study of Mini Channel Heat Sink with Different Internal Configuration

2020 ◽  
Vol 319 ◽  
pp. 02004
Author(s):  
Muhammad Akif Rahman ◽  
Md Badrath Tamam ◽  
Md Sadman Faruque ◽  
A.K.M. Monjur Morshed
Keyword(s):  
Nusselt Number ◽  
Thermal Performance ◽  
Heat Sink ◽  
Rectangular Channel ◽  
Three Dimensional ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Rectangular Channels ◽  
Flow Through ◽  
Internal Configuration

In this paper a numerical analysis of three-dimensional laminar flow through rectangular channel heat sinks of different geometric configuration is presented and a comparison of thermal performance among the heat sinks is discussed. Liquid water was used as coolant in the aluminum made heat sink with a glass cover above it. The aspect ratio (section height to width) of rectangular channels of the mini-channel heat sink was 0.33. A heat flux of 20 W/cm2 was continuously applied at the bottom of the channel with different inlet velocity for Reynold’s number ranging from 150 to 1044. Interconnectors and obstacles at different positions and numbers inside the channel were introduced in order to enhance the thermal performance. These modifications cause secondary flow between the parallel channels and the obstacles disrupt the boundary layer formation of the flow inside the channel which leads to the increase in heat transfer rate. Finally, Nusselt number, overall thermal resistance and maximum temperature of the heat sink were calculated to compare the performances of the modified heat sinks with the conventional mini channel heat sink and it was observed that the heat sink with both interconnectors and obstacles enhanced the thermal performance more significantly than other configurations. A maximum of 36% increase in Nusselt number was observed (for Re =1044).

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

scholarly journals Mathematical modeling and numerical simulation of heat dissipation in led bulbs

2020 ◽  
Vol 24 (3 Part A) ◽  
pp. 1877-1884 ◽  
Author(s):  
Diego Alarcón ◽  
Eduardo. Balvís ◽  
Ricardo Bendaña ◽  
Alberto Conejero ◽  
de Fernández ◽  
...  
Keyword(s):  
Mathematical Modeling ◽  
Numerical Simulation ◽  
Numerical Simulations ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Heat Sinks ◽  
Experimental Measurements ◽  
Heating And Cooling ◽  
The Common

We present a detailed study of heating and cooling processes in LED luminaires with passive heat sinks. Our analysis is supported by numerical simulations as well as experimental measurements, carried on commercial systems used for outdoor lighting. We have focused our analysis on the common case of a single LED source in thermal contact with an aluminum passive heat sink, obtaining an excellent agreement with experimental measurements and the numerical simulations performed. Our results can be easily expanded, without loss of generality, to similar systems.

Thermal Performance Measurement for Confined Heat Sinks by Using a Modified Transient Liquid Crystal Technique

2003 ◽  
Author(s):  
S. T. Kuo ◽  
M. P. Wang ◽  
M. C. Wu ◽  
Y. H. Hung
Keyword(s):  
Heat Transfer ◽  
Liquid Crystal ◽  
Heat Sink ◽  
Heat Sinks ◽  
Experimental Investigations ◽  
Heat Transfer Characteristics ◽  
Transfer Characteristics ◽  
Flow And Heat Transfer ◽  
Preheating Temperature ◽  
Parametric Studies

A series of experimental investigations with a new modified transient liquid crystal method on the studies related to the fluid flow and heat transfer characteristics in a channel installed with a heat sink have been successfully performed. The parametric studies on the local and average effective heat transfer characteristics for confined heat sinks have been explored. The influencing parameters and conditions include air preheating temperature at channel inlet, flow velocity and heat sink types. Besides, a concept of the amount of enhanced heat transfer (AEHT) is introduced and defined as the ratio of j/f. The j/f ratio is almost independent of Reynolds number for a specific confined heat sink. The j/f ratios are 0.0603 and 0.0124 for fully-confined and unconfined heat sinks, respectively.

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

2020 ◽  
Author(s):  
Jin Yao Ho ◽  
Kai Choong Leong
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Volume Fraction ◽  
Solid Volume Fraction ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Base Temperature ◽  
Storage Unit ◽  
Cooling Of Electronics

Abstract A thermal energy storage unit filled with phase change material (PCM) can serve as a heat sink for the cooling of electronics with intermittent or periodic heat dissipation rates. The use of thermal conductive structures (TCS) is an effective method of improving the thermal performance of a PCM-based heat sink. In this paper, topology optimization is explored to develop a new class of TCS with a tree-like structure to enhance the thermal performance of a trapezoidal heat sink. The topology-optimized heat sink was then fabricated by Selective Laser Melting (SLM) using an aluminum alloy, AlSi10Mg, as the base powder. Experiments were performed to evaluate the thermal performance of the topology-optimized heat sink with the tree-like structure. In addition, a conventional longitudinal-fin heat sink of the same solid volume fraction (φ = 16.2%) and a heat sink without enhanced structure were also fabricated and experimentally investigated for comparison. Rubitherm RT-35HC paraffin wax was used as the PCM. Three different heat fluxes of 4.00 kW/m2, 5.08 kW/m2 and 7.24 kW/m2 were applied at the base of each specimen by a silicone rubber heater. The structure wall and the PCM temperatures were measured over time. Our results show that, for all heat rates tested, the topology-optimized heat sink was able to maintain a lower base temperature as compared to the fin-structure and the plain heat sinks. A thermal enhancement ratio (ε) is defined to evaluate the performance of the heat sinks with and without the use of PCM. From the experimental results, the highest ε value of 8.6 was achieved by the topology-optimized heat sink. These results indicate the better performance of the topology-optimized heat sink in dissipating heat as compared to the other specimens.

scholarly journals Transport in Flat Heat Pipes at High Heat Fluxes From Multiple Discrete Sources

2004 ◽  
Vol 126 (3) ◽  
pp. 347-354 ◽  
Author(s):  
Unnikrishnan Vadakkan ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Fluid Flow ◽  
Heat Pipe ◽  
Three Dimensional ◽  
Heat Pipes ◽  
Density Change ◽  
Heat Sources ◽  
Discrete Heat Sources ◽  
Energy Equations

A three-dimensional model has been developed to analyze the transient and steady-state performance of flat heat pipes subjected to heating with multiple discrete heat sources. Three-dimensional flow and energy equations are solved in the vapor and liquid regions, along with conduction in the wall. Saturated flow models are used for heat transfer and fluid flow through the wick. In the wick region, the analysis uses an equilibrium model for heat transfer and a Brinkman-Forchheimer extended Darcy model for fluid flow. Averaged properties weighted with the porosity are used for the wick analysis. The state equation is used in the vapor core to relate density change to the operating pressure. The density change due to pressurization of the vapor core is accounted for in the continuity equation. Vapor flow, temperature and hydrodynamic pressure fields are computed at each time step from coupled continuity/momentum and energy equations in the wick and vapor regions. The mass flow rate at the interface is obtained from the application of kinetic theory. Predictions are made for the magnitude of heat flux at which dryout would occur in a flat heat pipe. The input heat flux and the spacing between the discrete heat sources are studied as parameters. The location in the heat pipe at which dryout is initiated is found to be different from that of the maximum temperature. The location where the maximum capillary pressure head is realized also changes during the transient. Axial conduction through the wall and wick are seen to play a significant role in determining the axial temperature variation.

Numerical Analysis for Thermal Performance of High Power Multi-Chip LED Packaging

2010 ◽  
Vol 139-141 ◽  
pp. 1433-1437
Author(s):  
Kai Lin Pan ◽  
Jiao Pin Wang ◽  
Jing Liu ◽  
Guo Tao Ren
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Three Dimensional ◽  
Junction Temperature ◽  
Light Emitting ◽  
Die Attach ◽  
Dissipation Model ◽  
Key Issues

Heat dissipation and cost are the key issues for light-emitting diode (LED) packaging. In this paper, based on the thermal resistance network model of LED packaging, three-dimensional heat dissipation model of high power multi-chip LED packaging is developed and analyzed with the application of finite element method. Temperature distributions of the current multi-chip LED packaging model are investigated systematically under the different materials of the chip substrate, die attach, and/or different structures of the heat sink and fin. The results show that the junction temperature can be decreased effectively by increasing the height of the heat sink, the width of the fin, and the thermal conductivity of the chip substrate and die attach materials. The lower cost and higher reliability for LED source can be obtained through reasonable selection of materials and structure parameters of the LED lighting system.

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