Optimization Under Uncertainty of Manifold Microchannel Heat Sinks

2012 ◽  
Author(s):  
Suchismita Sarangi ◽  
Karthik K. Bodla ◽  
Suresh V. Garimella ◽  
Jayathi Y. Murthy
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimization Under Uncertainty ◽  
Microchannel Heat Sink ◽  
Probabilistic Optimization ◽  
Manifold Microchannel

Conventional microchannel heat sinks provide good heat dissipation capability but are associated with high pressure drop and corresponding pumping power. The use of a manifold system that distributes the flow into the microchannels through multiple, alternating inlet and outlet pairs is investigated here. This manifold arrangement greatly reduces the pressure drop incurred due to the smaller flow paths, while simultaneously increasing the heat transfer coefficient by tripping the thermal boundary layers. A three-dimensional numerical model is developed and validated, to study the effect of various geometric parameters on the performance of the manifold microchannel heat sink. Apart from a deterministic analysis, a probabilistic optimization study is also performed. In the presence of uncertainties in the geometric and operating parameters of the system, this probabilistic optimization approach yields an optimal design that is also robust and reliable. Uncertainty-based optimization also yields auxiliary information regarding local and global sensitivities and helps identify the input parameters to which outputs are most sensitive. This information can be used to design improved experiments targeted at the most sensitive inputs. Optimization under uncertainty also provides a quantitative estimate of the allowable uncertainty in input parameters for an acceptable uncertainty in the relevant output parameters. The optimal geometric design parameters with uncertainties that maximize heat transfer coefficient while minimizing pressure drop for fixed input conditions are identified for a manifold microchannel heat sink. A comparison between the deterministic and probabilistic optimization results is also presented.

Flow Boiling Heat Transfer in a Silicon Microchannel Heat Sink Using Liquid Crystal Thermography

2008 ◽  
Author(s):  
Ayman Megahed ◽  
Ibrahim Hassan ◽  
Tariq Ahmad
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Boiling Heat Transfer ◽  
Flow Boiling ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Microchannel Heat Sink

The present study focuses on the experimental investigation of boiling heat transfer characteristics and pressure drop in a silicon microchannel heat sink. The microchannel heat sink consists of a rectangular silicon chip in which 45 rectangular microchannels were chemically etched with a depth of 295 μm, width of 254 μm, and a length of 16 mm. Un-encapsulated Thermochromic liquid Crystals (TLC) are used in the present work to enable nonintrusive and high spatial resolution temperature measurements. This measuring technique is used to provide accurate full and local surface-temperature and heat transfer coefficient measurements. Experiments are carried out for mass velocities ranging between 290 to 457 kg/m2.s and heat fluxes from 6.04 to 13.06 W/cm2 using FC-72 as the working fluid. Experimental results show that the pressure drop increases as the exit quality and the flow rate increase. High values of heat transfer coefficient can be obtained at low exit quality (xe < 0.2). However, the heat transfer coefficient decreases sharply and remains almost constant as the quality increases for an exit quality higher than 0.2.

scholarly journals Heat Transfer Enhancement of Plate-Fin Heat Sinks with Different Types of Winglet Vortex Generators

Energies ◽  
2020 ◽  
Vol 13 (19) ◽  
pp. 5219
Author(s):  
Jin-Cherng Shyu ◽  
Jhao-Siang Jheng
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Heat Sink ◽  
Heat Sinks ◽  
Vortex Generators ◽  
Airflow Velocity ◽  
Delta Winglet ◽  
The Heat Transfer Coefficient

Because the delta winglet in common-flow-down configuration has been recognized as an excellent type of vortex generators (VGs), this study aims to experimentally and numerically investigate the thermo-hydraulic performance of four different forms of winglet VGs featuring sweptback delta winglets in the channel flow in the range 200 < Re < 1000. Both Nusselt number and friction factor of plate-fin heat sinks having different forms of winglets, including delta winglet pair (DWP), rectangular winglet pair (RWP), swept delta winglet pair (SDWP), and swept trapezoid winglet pair (STWP), were measured in a standard wind tunnel without bypass in this study. Four rows of winglets with in-line arrangement were punched on each 10-mm-long, 0.2-mm-thick copper plate, and a total of 16 pieces of copper plates with spacing of 2 mm were fastened together to achieve the heat sink. The projected area, longitudinal and winglet tip spacing, height and angle of attack of those winglets were fixed. Besides that, three-dimensional numerical simulation was also performed in order to investigate the temperature and fluid flow over the plate-fin. The results showed that the longitudinal, common-flow-down vortices generated by the VGs augmented the heat transfer and pressure drop of the heat sink. At airflow velocity of 5 m/s, the heat transfer coefficient and pressure drop of plain plate-fin heat sink were 50.8 W/m2·K and 18 Pa, respectively, while the heat transfer coefficient and the pressure drop of heat sink having SDWP were 70.4 W/m2·K and 36 Pa, respectively. It was found that SDWP produced the highest thermal enhancement factor (TEF) of 1.28 at Re = 1000, followed by both RWP and STWP of similar TEF in the range 200 < Re < 1000. The TEF of DWP was the lowest and it was rapidly increased with the increase of airflow velocity.

Finned Metal Foam Heat Sinks for Electronics Cooling in Forced Convection

2002 ◽  
Vol 124 (3) ◽  
pp. 155-163 ◽  
Author(s):  
A. Bhattacharya ◽  
R. L. Mahajan
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Forced Convection ◽  
Metal Foam ◽  
Experimental Results ◽  
Heat Sinks ◽  
The Heat Transfer Coefficient

In this paper, we present recent experimental results on forced convective heat transfer in novel finned metal foam heat sinks. Experiments were conducted on aluminum foams of 90 percent porosity and pore size corresponding to 5 PPI (200 PPM) and 20 PPI (800 PPM) with one, two, four and six fins, where PPI (PPM) stands for pores per inch (pores per meter) and is a measure of the pore density of the porous medium. All of these heat sinks were fabricated in-house. The forced convection results show that heat transfer is significantly enhanced when fins are incorporated in metal foam. The heat transfer coefficient increases with increase in the number of fins until adding more fins retards heat transfer due to interference of thermal boundary layers. For the 20 PPI samples, this maximum was reached for four fins. For the 5 PPI heat sinks, the trends were found to be similar to those for the 20 PPI heat sinks. However, due to larger pore sizes, the pressure drop encountered is much lower at a particular air velocity. As a result, for a given pressure drop, the heat transfer coefficient is higher compared to the 20 PPI heat sink. For example, at a Δp of 105 Pa, the heat transfer coefficients were found to be 1169W/m2-K and 995W/m2-K for the 5 PPI and 20 PPI 4-finned heat sinks, respectively. The finned metal foam heat sinks outperform the longitudinal finned and normal metal foam heat sinks by a factor between 1.5 and 2, respectively. Finally, an analytical expression is formulated based on flow through an open channel and incorporating the effects of thermal dispersion and interfacial heat transfer between the solid and fluid phases of the porous medium. The agreement of the proposed relation with the experimental results is promising.

Microchannel Size Effects on Two-Phase Local Heat Transfer and Pressure Drop in Silicon Microchannel Heat Sinks With a Dielectric Fluid

2007 ◽  
Author(s):  
Tannaz Harirchian ◽  
Suresh V. Garimella
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
Heat Sinks ◽  
Dielectric Fluid ◽  
Two Phase ◽  
Microchannel Heat Sinks ◽  
The Heat Transfer Coefficient

Two-phase heat transfer in microchannels can support very high heat fluxes for use in high-performance electronics-cooling applications. However, the effects of microchannel cross-sectional dimensions on the heat transfer coefficient and pressure drop have not been investigated extensively. In the present work, experiments are conducted to investigate the local flow boiling heat transfer in microchannel heat sinks. The effect of channel size on the heat transfer coefficient and pressure drop is studied for mass fluxes ranging from 250 to 1600 kg/m2s. The test sections consist of parallel microchannels with nominal widths of 100, 250, 400, 700, and 1000 μm, all with a depth of 400 μm, cut into 12.7 mm × 12.7 mm silicon substrates. Twenty-five microheaters embedded in the substrate allow local control of the imposed heat flux, while twenty-five temperature microsensors integrated into the back of the substrates enable local measurements of temperature. The dielectric fluid Fluorinert FC-77 is used as the working fluid. The results of this study serve to quantify the effectiveness of microchannel heat transport while simultaneously assessing the pressure drop trade-offs.

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

2015 ◽  
Author(s):  
Sebastian Scholl ◽  
Catherine Gorle ◽  
Farzad Houshmand ◽  
Tanya Liu ◽  
Hyoungsoon Lee ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Mass Flow ◽  
Heat Sink ◽  
Conjugate Heat Transfer ◽  
Computational Cost ◽  
Unit Cell ◽  
Micro Structure

This study considers CFD simulations with conjugate heat transfer performed in the framework of designing a complex micro-scale cooling geometry. The numerical investigation of the three-dimensional, laminar flow (Reynolds number smaller than 480) and the solid conduction is done on a reduced model of the heat sink micro-structure to enable exploring a variety of configurations at a limited computational cost. The reduced model represents a unit-cell, and uses periodic and symmetry boundary conditions to mimic the conditions in the entire cooling manifold. A simulation of the entire heat sink micro-structure was performed to verify the unit-cell set-up, and the comparison demonstrated that the unit-cell simulations allow reducing the computational cost by two orders of magnitude while retaining accurate results. The baseline design for the unit-cell represents a configuration used in traditional electronic heat sinks, i.e. a simple channel geometry with a rectangular cross section, with a diameter of 50 μm, where the fluid flows between two cooling fins. Subsequently three types of modified geometries with feature sizes of 50 μm were considered: baffled geometries that guide the flow towards the hotspot region, geometries where the fins are connected by crossbars, and a woodpile structure without cooling fins. Three different mass-flow rates were tested. Based on the medium mass-flow rate considered, the woodpile geometry showed the highest heat transfer coefficient with an increase of 70% compared to the baseline geometry, but at the cost of increasing the pressure drop by more than 300%. The crossbar geometries were shown to be promising configurations, with increases in the heat transfer coefficient of more than 20% for a 70% increase in pressure drop. The potential for further optimization of the crossbar configurations by adding or removing individual crossbars will be investigated in a follow up study. The results presented demonstrate the increase in performance that can be obtained by investigating a variety of designs for single phase cooling devices using unit-cell conjugate heat transfer simulations.

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