Modeling the Behavior of Insertion-Mounted Components — Part 1

2004 ◽  
Author(s):  
Ricky Valentin ◽  
Donald Barker ◽  
Aaron Johnson
Keyword(s):  
Fatigue Failure ◽  
Printed Circuit Boards ◽  
Failure Mechanisms ◽  
Failure Prediction ◽  
Prediction Methods ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Failure Assessment ◽  
Assessment Approach

Insertion mount, or trough hole, technology has historically been considered a fatigue-free method for soldering components to printed circuit boards; recently, though, applications implementing this technology have experienced use lifetimes sufficient to warrant investigation into fatigue failure. Although much research has been done into failure mechanisms and rapid failure prediction methods for surface mount components, there have been on such studies in the area of insertion mount technology. Therefore, this paper will be the first in a series of two papers introducing a rapid failure assessment approach for components fixed using insertion mount technology. The purpose of this paper will be to introduce the methodology used in this study, as well as to provide a method for determining the critical lead forces quickly and accurately.

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby
Keyword(s):  
Printed Circuit Boards ◽  
Solution Method ◽  
Identification Problem ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Knowledge Based ◽  
Sequence Identification ◽  
Placement Machine ◽  
Solution Methodology

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.

Repair of Printed Circuit Boards Carrying Surface Mount Components

Circuit World ◽  
1988 ◽  
Vol 14 (2) ◽  
pp. 11-15 ◽  
Author(s):  
M.M.F. Verguld ◽  
M.H.W. Leenaerts
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit

Prognostic Health Monitoring Method for Fatigue Failure of Solder Joints on Printed Circuit Boards Based on a Canary Circuit

2013 ◽  
Author(s):  
Kenji Hirohata ◽  
Yousuke Hisakuni ◽  
Takahiro Omori ◽  
Tomoko Monda ◽  
Minoru Mukai
Keyword(s):  
Fatigue Failure ◽  
Health Monitoring ◽  
Failure Probability ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
High Density ◽  
Probability Estimation ◽  
Circuit Boards ◽  
Printed Circuit ◽  
High Density Packaging

Continuing improvements in both capacity and miniaturization of electronic equipment such as solid state drives (SSDs) are spurring demand for high-density packaging of NAND-type flash memory mounted on SSD printed circuit boards. High-density packaging leads to increased fatigue failure risk of solder joints due to the decreased reliability margin for stress. We have developed a failure precursor detection technology based on fatigue failure probability estimation during use. This method estimates the cycles to fatigue failure of an actual circuit by detecting broken connections in a canary circuit (a dummy circuit of daisy-chained solder joints). The canary circuit is designed to fail earlier than the actual circuit under the same failure mode by using accelerated reliability testing and inelastic stress simulation. The statistical distribution of the strain range of solder joints can be provided by Monte Carlo simulations based on the finite element method and random load modeling. A feasibility study of the failure probability estimation method is conducted by applying the method to a printed circuit board on which a ball grid array (BGA) package is mounted using BGA solder joints. The proposed method is found to be useful for prognostic health monitoring of solder joint’s fatigue failure.

scholarly journals Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Materials ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 550 ◽  
Author(s):  
Philipp Nothdurft ◽  
Gisbert Riess ◽  
Wolfgang Kern
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Failure Mechanisms ◽  
Electric Signal ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Wide Range ◽  
Pcb Manufacturing ◽  
Common Coupling ◽  
New Strategies

Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

scholarly journals Good Artists Torrent, Great Artists Fork

Media-N ◽  
2019 ◽  
Vol 15 (2) ◽  
pp. 1-4
Author(s):  
Taylor Hokanson ◽  
Nick Bontrager
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Led Light ◽  
Surface Mount ◽  
Printed Circuit ◽  
Commercial Applications

In this workshop, Professors Nick Bontrager and Taylor Hokanson introduce the tools and services required to fabricate printed circuit boards, or PCBs. The process is more accessible than ever before, and is cheap enough to allow individuals to obtain functional prototypes, in small quantities, that are indistinguishable from similar PCBs that might be produced in the hundreds of thousands for industry or commercial applications. Using an “unpopulated” demonstration board designed by the workshop co-chairs, participants walk through all the steps needed to assemble and solder surface-mount components, finishing the event with a battery-operated, wearable, LED light display.

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