scholarly journals Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Materials ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 550 ◽  
Author(s):  
Philipp Nothdurft ◽  
Gisbert Riess ◽  
Wolfgang Kern
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Failure Mechanisms ◽  
Electric Signal ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Wide Range ◽  
Pcb Manufacturing ◽  
Common Coupling ◽  
New Strategies

Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

scholarly journals Separation and Recovery of Fine Particles from Waste Circuit Boards Using an Inflatable Tapered Diameter Separation Bed

2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
Chenlong Duan ◽  
Cheng Sheng ◽  
Lingling Wu ◽  
Yuemin Zhao ◽  
Jinfeng He ◽  
...  
Keyword(s):  
Environmental Pollution ◽  
Printed Circuit Boards ◽  
Fine Particles ◽  
Metal Recovery ◽  
Circuit Board ◽  
Circuit Boards ◽  
Recovery Rates ◽  
Operational Conditions ◽  
Printed Circuit ◽  
Wide Range

Recovering particle materials from discarded printed circuit boards can enhance resource recycling and reduce environmental pollution. Efficiently physically separating and recovering fine metal particles (−0.5 mm) from the circuit boards are a key recycling challenge. To do this, a new type of separator, an inflatable tapered diameter separation bed, was developed to study particle motion and separation mechanisms in the bed’s fluid flow field. For 0.5–0.25 mm circuit board particles, metal recovery rates ranged from 87.56 to 94.17%, and separation efficiencies ranged from 87.71 to 94.20%. For 0.25–0.125 mm particles, metal recovery rates ranged from 84.76 to 91.97%, and separation efficiencies ranged from 84.74 to 91.86%. For superfine products (−0.125 mm), metal recovery rates ranged from 73.11 to 83.04%, and separation efficiencies ranged from 73.00 to 83.14%. This research showed that the inflatable tapered diameter separation bed achieved efficient particle separation and can be used to recover fine particles under a wide range of operational conditions. The bed offers a new mechanical technology to recycle valuable materials from discarded printed circuit boards, reducing environmental pollution.

Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

2010 ◽  
Vol 18 (1) ◽  
pp. 47-52 ◽  
Author(s):  
Jae-Choon Cho ◽  
Hwa-Young Lee ◽  
Sung-Taek Lim ◽  
Moon-Soo Park ◽  
Yong-Soo Oh ◽  
...  
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Peel Strength ◽  
Circuit Boards ◽  
Curing Behavior ◽  
Printed Circuit

Printed circuit boards for lead‐free soldering: materials and failure mechanisms

Circuit World ◽  
2007 ◽  
Vol 33 (2) ◽  
pp. 10-16 ◽  
Author(s):  
Per Johander ◽  
Per‐Erik Tegehall ◽  
Abelrahim Ahmed Osman ◽  
Göran Wetter ◽  
Dag Andersson
Keyword(s):  
Printed Circuit Boards ◽  
Failure Mechanisms ◽  
Lead Free ◽  
Circuit Boards ◽  
Printed Circuit

Dissolution of Brominated Epoxy Resins by Dimethyl Sulfoxide To Separate Waste Printed Circuit Boards

2013 ◽  
Vol 47 (6) ◽  
pp. 2654-2660 ◽  
Author(s):  
Ping Zhu ◽  
Yan Chen ◽  
Liangyou Wang ◽  
Guangren Qian ◽  
Wei Jie Zhang ◽  
...  
Keyword(s):  
Dimethyl Sulfoxide ◽  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards

scholarly journals Design and fabrication of low-cost micromachining system for prototyping printed circuit boards

2021 ◽  
Author(s):  
Dhinesh S K ◽  
◽  
Senthil Kumar K L ◽  
Megalingam A ◽  
Gokulraj A P ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Low Cost ◽  
Working Environment ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Milling Operation ◽  
Wide Range ◽  
Complex Shapes ◽  
The Cost ◽  
Selection Of

Printed circuit boards (PCBs) have a portentous position in constructing modern electronic equipment. Currently, chemical etching is the process used to produce PCBs at huge volumes, which is not suitable for preparing prototypes. The working environment is also not an encouraging one. There is no economical way to manufacture PCBs in low volumes, which is the basic requirement for Small and Medium Scale Enterprises (SMEs). Prototyping the desired circuit boards, prior to the mass production, is essential to avoid major losses by producing faulty designs. Developing a low-cost machine for prototyping PCBs may overcome these drawbacks. Hence, in this work, a machine capable of performing PCB mechanical milling operation on wide range of materials like copper/epoxy boards and flexible substrates has been developed. The machine developed is capable of milling lines that are 0.3 mm in width and 0.46 mm in depth. The performance of the machine reveals that it can mill any complex shapes and designs with expected accuracy. Selection of hardware components according to the needs would reduce the cost and programming snag further, which makes it affordable to SMEs.

Modeling the Behavior of Insertion-Mounted Components — Part 1

2004 ◽  
Author(s):  
Ricky Valentin ◽  
Donald Barker ◽  
Aaron Johnson
Keyword(s):  
Fatigue Failure ◽  
Printed Circuit Boards ◽  
Failure Mechanisms ◽  
Failure Prediction ◽  
Prediction Methods ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Failure Assessment ◽  
Assessment Approach

Insertion mount, or trough hole, technology has historically been considered a fatigue-free method for soldering components to printed circuit boards; recently, though, applications implementing this technology have experienced use lifetimes sufficient to warrant investigation into fatigue failure. Although much research has been done into failure mechanisms and rapid failure prediction methods for surface mount components, there have been on such studies in the area of insertion mount technology. Therefore, this paper will be the first in a series of two papers introducing a rapid failure assessment approach for components fixed using insertion mount technology. The purpose of this paper will be to introduce the methodology used in this study, as well as to provide a method for determining the critical lead forces quickly and accurately.

scholarly journals EXPERIMENTAL AND NUMERICAL VIBRATION ANALYSIS OF PRINTED CIRCUIT BOARDS

2020 ◽  
Author(s):  
Richard Bachoo ◽  
Shurland Balliram ◽  
Jacqueline Bridge
Keyword(s):  
Integrated Circuits ◽  
Natural Frequency ◽  
Vibration Analysis ◽  
Printed Circuit Boards ◽  
Damping Ratio ◽  
Connected Components ◽  
Circuit Boards ◽  
Electronic Components ◽  
Printed Circuit ◽  
Wide Range

Printed circuit boards (PCBs) are important modules which are incorporated in a wide range of industrial equipment and machinery for the purpose of control or signal manipulation applications. PCBs situated in dynamic environments may be prone to failure from excessive amounts of cyclical stresses arising from harmonic or random vibration sources. The ability to numerically model and predict the dynamic behaviour of PCBs and associated components is therefore a valuable tool for analysts concerned with PCB reliability. In this paper, experimental vibration analysis and the finite element method (FEM) are used to investigate the changes in resonant behaviour of a PCB as the mass, location and stiffness of electronic components vary. Circuit boards that are either sparsely or densely populated with ubiquitous soldered electronic components such as resistors, transistors, capacitors and integrated circuits are considered. The analysis indicates that for boards with a small number of components the natural frequency decreases compared to that of the bare PCB whilst a board with a larger number of soldered components has a corresponding increase. It is also shown that the overall effect of the solder is to reduce the natural frequency of the PCB and to a lesser extent the damping ratio. The study identifies the potential of tailoring the vibration response of a PCB by the appropriate selection and location of its connected components.

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