Digital-signal-processor-based inspection of populated surface-mount technology printed circuit boards

1991 ◽  
Author(s):  
David A. Hartley ◽  
Clifford A. Hobson ◽  
Francis Lilley
Keyword(s):  
Digital Signal Processor ◽  
Printed Circuit Boards ◽  
Digital Signal ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Signal Processor

PCB Related Failures in Electronic Assemblies

2011 ◽  
Vol 341-342 ◽  
pp. 411-415
Author(s):  
Ping Liu ◽  
Xiao Long Gu ◽  
Xin Bing Zhao ◽  
Xiao Gang Liu
Keyword(s):  
Printed Circuit Boards ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Process Procedures ◽  
Manufacture Process ◽  
Black Pad ◽  
Conductive Anodic Filament ◽  
Electronic Assemblies

The complexity of Printed Circuit Boards (PCBs) has increased dramatically over the last three decades with the development of surface mount technology (SMT). The typical manufacture of rigid multilayer PCB contains many process procedures, which makes manufacture and application much more challenges. This paper focuses on some typical PCB related failures. Recommendations are provided on optimizing PCB manufacture process and material application. Microvia crack, black pad, galvanic attack, pad design, conductive anodic filament and pad crater are presented in detail.

A Solution Methodology for the Multiple Batch Surface Mount PCB Placement Sequence Problem

1994 ◽  
Vol 116 (4) ◽  
pp. 282-289 ◽  
Author(s):  
Yu-Wen Huang ◽  
K. Srihari ◽  
Jim Adriance ◽  
George Westby
Keyword(s):  
Printed Circuit Boards ◽  
Solution Method ◽  
Identification Problem ◽  
Circuit Boards ◽  
Surface Mount ◽  
Printed Circuit ◽  
Knowledge Based ◽  
Sequence Identification ◽  
Placement Machine ◽  
Solution Methodology

The placement of surface mount components is a time consuming and critical task in the assembly of surface mount Printed Circuit Boards (PCBs). The focus of this research was the identification of “near optimal” solutions for the placement sequence identification problem. The factors considered include the placement machine and the specific PCB, the feeder space available, the need for tooling and nozzle changes, and the actual traveling path of the placement head. Expert (or knowledge based) systems were used as the solution method for this problem. The system developed can cope with single PCBs, panels, 180 deg offset boards (panels), and multiple PCB batches. The prototype knowledge based system developed in this research identifies solutions in (almost) realtime.

scholarly journals High-Density Interconnect Technology Assessment of Printed Circuit Boards for Space Applications

2020 ◽  
Vol 17 (3) ◽  
pp. 79-88
Author(s):  
Maarten Cauwe ◽  
Bart Vandevelde ◽  
Chinmay Nawghane ◽  
Marnix Van De Slyeke ◽  
Erwin Bosman ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Boards ◽  
Digital Signal ◽  
High Density ◽  
Circuit Boards ◽  
Space Applications ◽  
Track Width ◽  
Printed Circuit ◽  
Field Programmable ◽  
Space Projects

Abstract High-density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality of modern integrated circuits such as field-programmable gate arrays, digital signal processors and application processors. Increasing demands for functionality translate into higher signal speeds combined with an increasing number of input/outputs (I/Os). To limit the overall package size, the contact pad pitch of the components is reduced. The combination of a high number of I/Os with a reduced pitch places additional demands onto the PCB, requiring the use of laser-drilled microvias, high-aspect ratio core vias, and small track width and spacing. Although the associated advanced manufacturing processes have been widely used in commercial, automotive, medical, and military applications, reconciling these advancements in capability with the reliability requirements for space remains a challenge. Two categories of the HDI technology are considered: two levels of staggered microvias (basic HDI) and (up to) three levels of stacked microvias (complex HDI). In this article, the qualification of the basic HDI technology in accordance with ECSS-Q-ST-70-60C is described. At 1.0-mm pitch, the technology passes all testing successfully. At .8-mm pitch, failures are encountered during interconnection stress testing and conductive anodic filament testing. These failures provide the basis for updating the design rules for HDI PCBs.

scholarly journals A tool for errors detection in printed circuit boards production

2009 ◽  
Vol 7 (01) ◽  
Author(s):  
A. De Luca Pennacchia ◽  
L. G. De la Fraga ◽  
U. Martí­nez Hernández
Keyword(s):  
Image Processing ◽  
Integrated Circuits ◽  
Digital Image Processing ◽  
Digital Image ◽  
Printed Circuit Boards ◽  
Software Tool ◽  
Reference Points ◽  
Surface Mount Technology ◽  
Circuit Boards ◽  
Printed Circuit

The progressive implementation of software functions in Integrated Circuits (ICs) has considerably increased the number of transistors and pin connections of ICs. For that reason, Printed Circuit Boards (PCBs) are fabricated with the Surface Mount Technology (SMT) nowadays and IC mounting on PCB is a crucial process that requires high precision. An Automatic Mechanical Montage (AMM) system is used to mount ICs on the sockets using a couple of reference points for every IC in order to find the correct positions for mounting the IC. Due to some factors in the process of PCB development, there are differences between designed and manufactured PCBs, which could generate delays in their production. In this work, a software tool which allows to work with digital images of PCBs is described. This tool finds the differences generated in PCB development, especially the differences in IC reference points using Digital Image Processing (DIP) techniques.

Sign in / Sign up

Export Citation Format

Share Document