Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

2002 ◽  
Author(s):  
Cemal Basaran ◽  
Hong Tang ◽  
Shihua Nie
Keyword(s):  
Elastic Modulus ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Fatigue Damage ◽  
Solder Joints ◽  
Fatigue Loading ◽  
Damage Mechanism ◽  
Load Drop ◽  
Material Degradation ◽  
Elastic Modulus Degradation

Fatigue damage is a progressive process of material degradation. The objective of this study is to experimentally qualify the damage mechanism in solder joints in electronic packaging under thermal fatigue loading. Another objective of this paper is to show that damage mechanism under thermal cycling and mechanical cycling is very different. Elastic modulus degradation under thermal cycling, which is considered as a physically detectable quantity of material degradation, was measured by Nano-indenter. It was compared with tendency of inelastic strain accumulation of solder joints in Ball Grid Array (BGA) package under thermal cycling, which was measured by Moire´ interferometry. Fatigue damage evolution in solder joints with traditional load-drop criterion was also investigated by shear-strain hysteresis loops from strain-controlled cyclic shear testing of thin layer solder joints. Load-drop behavior was compared with elastic modulus degradation of solder joints under thermal cycling. Following conventional Coffin-Manson approach, S-N curve was obtained from isothermal fatigue testing with load-drop criterion. Coffin-Manson curves obtained from strain controlled mechanical tests were used to predict fatigue life of solder joints. In this paper it is shown that this approach underestimates the fatigue life by an order of magnitude. Results obtained in this project indicate that thermal fatigue and isothermal mechanical fatigue are completely different damage mechanism for microstructurally evolving materials.

A Multi-Level Low Cycle Fatigue Damage Model for Forging Die Material

2006 ◽  
Vol 514-516 ◽  
pp. 804-809
Author(s):  
S. Gao ◽  
Ewald Werner
Keyword(s):  
Fatigue Life ◽  
Fatigue Damage ◽  
Low Cycle Fatigue ◽  
Damage Model ◽  
Fatigue Loading ◽  
Cycle Fatigue ◽  
Die Material ◽  
Multi Level ◽  
Loading Sequence ◽  
Forging Die

The forging die material, a high strength steel designated W513 is considered in this paper. A fatigue damage model, based on thermodynamics and continuum damage mechanics, is constructed in which both the previous damage and the loading sequence are considered. The unknown material parameters in the model are identified from low cycle fatigue tests. Damage evolution under multi-level fatigue loading is investigated. The results show that the fatigue life is closely related to the loading sequence. The fatigue life of the materials with low fatigue loading first followed by high fatigue loading is longer than that for the reversed loading sequence.

scholarly journals Prediction of mechanical properties and fatigue life of nano silver paste in chip interconnection

2020 ◽  
Author(s):  
Hui YANG ◽  
Jihui Wu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Stress And Strain ◽  
Nano Silver ◽  
Finite Element Software ◽  
Flip Chips ◽  
Empirical Correction ◽  
Prediction Of Mechanical Properties

Abstract The simulation of nano-silver solder joints in flip-chips is performed by the finite element software ANSYS, and the stress-strain distribution results of the solder joints are displayed. In this simulation, the solder joints use Anand viscoplastic constitutive model, which can reasonably simulate the stress and strain of solder joints under thermal cycling load. At the same time this model has been embedded in ANSYS software, so it is more convenient to use. The final simulation results show that the areas where the maximum stresses and strains occur at the solder joints are mostly distributed in the contact areas between the solder joints and the copper pillars and at the solder joints. During the entire thermal cycling load process, the area where the maximum change in stress and strain occurs is always at the solder joint, and when the temperature changes, the temperature at the solder joint changes significantly. Based on comprehensive analysis, the relevant empirical correction calculation equation is used to calculate and predict the thermal fatigue life of nano-silver solder joints. The analysis results provide a reference for the application of nano-silver solder in the electronic packaging industry.

scholarly journals Analysis of Damage Evolution in Concrete under Fatigue Loading by Acoustic Emission and Ultrasonic Testing

Materials ◽  
2022 ◽  
Vol 15 (1) ◽  
pp. 341
Author(s):  
Marc Thiele ◽  
Stephan Pirskawetz
Keyword(s):  
Acoustic Emission ◽  
Elastic Modulus ◽  
Cyclic Loading ◽  
Fatigue Damage ◽  
Fatigue Loading ◽  
Measurement Methods ◽  
Material Structure ◽  
Fatigue Process ◽  
Acoustic Methods ◽  
Normal Strength

The fatigue process of concrete under compressive cyclic loading is still not completely explored. The corresponding damage processes within the material structure are especially not entirely investigated. The application of acoustic measurement methods enables a better insight into the processes of the fatigue in concrete. Normal strength concrete was investigated under compressive cyclic loading with regard to the fatigue process by using acoustic methods in combination with other nondestructive measurement methods. Acoustic emission and ultrasonic signal measurements were applied together with measurements of strains, elastic modulus, and static strength. It was possible to determine the anisotropic character of the fatigue damage caused by uniaxial loading based on the ultrasonic measurements. Furthermore, it was observed that the fatigue damage seems to consist not exclusively of load parallel oriented crack structures. Rather, crack structures perpendicular to the load as well as local compacting are likely components of the fatigue damage. Additionally, the ultrasonic velocity appears to be a good indicator for fatigue damage beside the elastic modulus. It can be concluded that acoustic methods allow an observation of the fatigue process in concrete and a better understanding, especially in combination with further measurement methods.

A Theory for Mathematical Framework of Fatigue Damage on S-N Plane

2014 ◽  
Vol 627 ◽  
pp. 117-120 ◽  
Author(s):  
Hoda Eskandari ◽  
Ho Sung Kim
Keyword(s):  
Fatigue Life ◽  
Boundary Conditions ◽  
Fatigue Damage ◽  
Fatigue Loading ◽  
Mathematical Framework ◽  
Accumulated Damage ◽  
Damage Quantification ◽  
Damage Equation

A theory for mathematical framework is developed with axioms for fatigue damage, quantification and relativity concept, boundary conditions, and compatibility, allowing us to evaluate the validity of candidate damage equations/quantities on S-N plane for prediction of fatigue life. Manifestation points for accumulated damage were defined for boundary conditions by differentiating between damage accumulated before failure, and failure caused by damage at quantised fatigue loading cycles. A selected damage equation leading to a theoretical S-N curve was validated as an example.

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

1998 ◽  
Vol 120 (4) ◽  
pp. 322-327 ◽  
Author(s):  
H. Doi ◽  
K. Kawano ◽  
A. Yasukawa ◽  
T. Sato
Keyword(s):  
Mechanical Properties ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Failure Mode ◽  
Flip Chip ◽  
Solder Joints ◽  
Alumina Substrate ◽  
Heat Spreader ◽  
Flip Chips ◽  
Heat Spreaders

The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect.

Critical Accumulated Strain Energy (Case) Failure Criterion for Thermal Cycling Fatigue of Solder Joints

1994 ◽  
Vol 116 (3) ◽  
pp. 163-170 ◽  
Author(s):  
Tsung-Yu Pan
Keyword(s):  
Fatigue Life ◽  
Energy Density ◽  
Thermal Cycling ◽  
Creep Strain ◽  
Failure Criterion ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Solder Joints ◽  
Field Service ◽  
Accumulated Strain

In the automotive and computer industries, a perennial challenge has been to design an adequate and efficient accelerated thermal cycling test which would correspond to field service conditions. Failures, induced in both thermal cycle testing and field service, are characterized by thermal fatigue behavior. Several fatigue models have been proposed, none of these models take into account all of the many parameters of the test or service environment. In thermal cycling, for example, the temperature range, ramp rate, hold time, and stepped heating and cooling are known to influence the number of cycles to failure. In this study, a critical accumulated strain energy (CASE) failure criterion is proposed to correlate the fatigue life to both the plastic and creep strain energies, which accumulate in solder joints during the thermal cycling. This criterion suggests that solder joints fail as the strain energy accumulates and reaches a critical value. By using finite element analysis with a “ladder” procedure, both time-independent plastic strain energy and time-dependent creep strain energy are quantified. These are related to fatigue life by the equation: C = N*f (Ep + 0.13Ec), where C is the critical strain energy density, Nf is the fatigue life, Ep and Ec are plastic and creep strain energy density accumulation per cycle, respectively, for the eutectic Sn-Pb solders. By analyzing Hall and Sherry’s thermal cycling data (Hall and Sherry, 1986), it is found that creep is the predominant factor in deciding fatigue life. Creep accounts for 51 to 97 percent of the total accumulated strain energy, depending on the cycling profiles. This criterion is used to simulate crack propagation in a solder joint by analyzing the strain energy in small “domains” within the joint.

Extending the fatigue life of Pb-free SAC solder joints under thermal cycling

2013 ◽  
Vol 53 (5) ◽  
pp. 741-747 ◽  
Author(s):  
Shoho Ishikawa ◽  
Hironori Tohmyoh ◽  
Satoshi Watanabe ◽  
Tomonori Nishimura ◽  
Yoshikatsu Nakano
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Sac Solder

Load Spectrum Compiling and Practical Application of Output Flange for Wheel Loader Gearbox

2011 ◽  
Vol 346 ◽  
pp. 483-489
Author(s):  
Ying Shuang Zhang ◽  
Guo Qiang Wang ◽  
Ji Xin Wang
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Fatigue Damage ◽  
Prediction Method ◽  
Fatigue Loading ◽  
Load Spectrum ◽  
Element Analysis ◽  
Wheel Loader ◽  
Program Load Spectrum ◽  
Program Load

To realize the structural light weighting design of the transmission components of engineering vehicles on the basis of life in control, this paper took wheel loader as an example, collected the time-domain load signals of the transmission system in typical working conditions, provided processing steps for load spectrum synthesis by a certain percentage, and generated the program load spectrum which consisted of various amplitudes and means. The load spectrum can be used for fatigue loading at the output flange of gearbox. Then, the finite element model of the flange was established, and the stress analysis was carried out in the stress concentration location such as fillet. The prediction method of fatigue life on the base of program load spectrum was given. After the fatigue life prediction based on the compiled load spectrum and the theory of cumulative fatigue damage, the fatigue life of outside fillet of the flange, where is of maximum stress, is obtained. It was possible to obtain adequately fatigue prediction results in engineering vehicle design, using load spectrum, finite element analysis, and a stress-life approach to fatigue damage calculations.

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