A dislocation model of shear fatigue damage and life prediction of SMT solder joints under thermal cycling

1992 ◽  
Vol 15 (4) ◽  
pp. 553-558 ◽  
Author(s):  
J. Huang ◽  
H.Y. Lai ◽  
Y.Y. Qian ◽  
Y.H. Jiang ◽  
Q.L. Wang
Keyword(s):  
Thermal Cycling ◽  
Fatigue Damage ◽  
Life Prediction ◽  
Solder Joints ◽  
Dislocation Model ◽  
Shear Fatigue

Experimental Damage Mechanics of Microelectronic Solder Joints Under Fatigue Loading

2002 ◽  
Author(s):  
Cemal Basaran ◽  
Hong Tang ◽  
Shihua Nie
Keyword(s):  
Elastic Modulus ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Fatigue Damage ◽  
Solder Joints ◽  
Fatigue Loading ◽  
Damage Mechanism ◽  
Load Drop ◽  
Material Degradation ◽  
Elastic Modulus Degradation

Fatigue damage is a progressive process of material degradation. The objective of this study is to experimentally qualify the damage mechanism in solder joints in electronic packaging under thermal fatigue loading. Another objective of this paper is to show that damage mechanism under thermal cycling and mechanical cycling is very different. Elastic modulus degradation under thermal cycling, which is considered as a physically detectable quantity of material degradation, was measured by Nano-indenter. It was compared with tendency of inelastic strain accumulation of solder joints in Ball Grid Array (BGA) package under thermal cycling, which was measured by Moire´ interferometry. Fatigue damage evolution in solder joints with traditional load-drop criterion was also investigated by shear-strain hysteresis loops from strain-controlled cyclic shear testing of thin layer solder joints. Load-drop behavior was compared with elastic modulus degradation of solder joints under thermal cycling. Following conventional Coffin-Manson approach, S-N curve was obtained from isothermal fatigue testing with load-drop criterion. Coffin-Manson curves obtained from strain controlled mechanical tests were used to predict fatigue life of solder joints. In this paper it is shown that this approach underestimates the fatigue life by an order of magnitude. Results obtained in this project indicate that thermal fatigue and isothermal mechanical fatigue are completely different damage mechanism for microstructurally evolving materials.

Thermal performance and fatigue life prediction of POP stacked chip assembly under thermal cycling load

2020 ◽  
Vol 37 (4) ◽  
pp. 165-171
Author(s):  
Dongbo Li ◽  
Jianpei Wang ◽  
Bing Yang ◽  
Yongle Hu ◽  
Ping Yang
Keyword(s):  
Fatigue Life ◽  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints ◽  
Fatigue Life Prediction ◽  
Load Spectrum ◽  
Thermal Reliability ◽  
Joint Stress ◽  
Content Type ◽  
Fatigue Characteristics

Purpose This paper aims to perform experimental test on fatigue characteristics of package on package (POP) stacked chip assembly under thermal cycling load. Some suggestions for design to prolong fatigue life of POP stacked chip assembly are provided. Design/methodology/approach The POP stacked chip assembly which contains different package structure mode and chip position was manufactured. The fatigue characteristics of POP stacked chip assembly under thermal cycling load were tested. The fatigue load spectrum of POP stacked chip assembly under thermal cycling load was given. The fatigue life of chips can be estimated by using the creep–fatigue life prediction model based on different stress conditions. Findings The solder joint stress of top package is significantly less than that of bottom solder joints, and the maximum value occurs in the middle part of the solder joints inner ring. Originality/value This paper fulfils useful information about the thermal reliability of POP stacked chip assembly with different structure characteristics and materials parameters.

Life Prediction of SMT Solder Joints under Thermal Cycling

1994 ◽  
Vol 6 (1) ◽  
pp. 31-50 ◽  
Author(s):  
J.H. Huang ◽  
J.Y. Pei ◽  
Y.Y. Qian ◽  
Y.H. Jiang
Keyword(s):  
Thermal Cycling ◽  
Life Prediction ◽  
Solder Joints
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