CAE Simulation and Verification of Wire Sweep for BGA 436

2000 ◽  
Author(s):  
Wen-Ren Jong ◽  
You-Ren Chen
Keyword(s):  
Experimental Studies ◽  
Simulation Software ◽  
High Density ◽  
Electrical Performance ◽  
Molding Compound ◽  
Fine Pitch ◽  
Bonding Wires ◽  
Solder Balls ◽  
Cae Analysis ◽  
Cae Simulation

Abstract The microelectronics industry continues to grow rapidly in size and importance. As thinner and denser IC packages become, packaging process becomes more challenging and troublesome. The ball grid array (BGA) technology uses substrate and solder balls to replace the traditional leadframe, which offers many advantages over fine pitch technology. These include better assembly yield, superior electrical performance, and higher I/O density. However, the high density of bonding wires form a separating layer which will hold back the molding compound flowing through these regions. The paper presents the simulation of melt-front advancement and wire sweep for BGA 436. The results has been verified by the experimental studies. It is found that the high-density of wires has played a very important role in performing the CAE analysis. It shows that the melt-front advancement can be precisely predicted by CAE simulation software with proper consideration of wire density. With the accurate simulation of melt-front advancement, the CAE results can be further used to perform further engineering analysis. The wire sweep of the package demonstrates the use of CAE analysis, which also shows very good agreement with the experimental study.

Fine-pitch solder joining for high density interconnection

2014 ◽  
Author(s):  
Kuniaki Sueoka ◽  
Sayuri Kohara ◽  
Akihiro Horibe ◽  
Fumiaki Yamada ◽  
Hiroyuki Mori ◽  
...  
Keyword(s):  
High Density ◽  
Fine Pitch

scholarly journals Effect of dynamic loads and vibrations on lithium-ion batteries

2021 ◽  
pp. 146134842110081
Author(s):  
Xia Hua ◽  
Alan Thomas
Keyword(s):  
Lithium Ion Batteries ◽  
Lithium Ion Battery ◽  
Experimental Studies ◽  
Lithium Ion ◽  
Battery Pack ◽  
Dynamic Loads ◽  
Electrical Performance ◽  
Mechanical Degradation ◽  
Energy Storage Devices ◽  
Battery Cell

Lithium-ion batteries are being increasingly used as the main energy storage devices in modern mobile applications, including modern spacecrafts, satellites, and electric vehicles, in which consistent and severe vibrations exist. As the lithium-ion battery market share grows, so must our understanding of the effect of mechanical vibrations and shocks on the electrical performance and mechanical properties of such batteries. Only a few recent studies investigated the effect of vibrations on the degradation and fatigue of battery cell materials as well as the effect of vibrations on the battery pack structure. This review focused on the recent progress in determining the effect of dynamic loads and vibrations on lithium-ion batteries to advance the understanding of lithium-ion battery systems. Theoretical, computational, and experimental studies conducted in both academia and industry in the past few years are reviewed herein. Although the effect of dynamic loads and random vibrations on the mechanical behavior of battery pack structures has been investigated and the correlation between vibration and the battery cell electrical performance has been determined to support the development of more robust electrical systems, it is still necessary to clarify the mechanical degradation mechanisms that affect the electrical performance and safety of battery cells.

scholarly journals Recent Advances in ZnO-Based Carbon Monoxide Sensors: Role of Doping

Sensors ◽  
2021 ◽  
Vol 21 (13) ◽  
pp. 4425
Author(s):  
Ana María Pineda-Reyes ◽  
María R. Herrera-Rivera ◽  
Hugo Rojas-Chávez ◽  
Heriberto Cruz-Martínez ◽  
Dora I. Medina
Keyword(s):  
Carbon Monoxide ◽  
High Performance ◽  
Gas Sensing ◽  
Experimental Studies ◽  
Electrical Performance ◽  
Long Term Stability ◽  
Sensing Applications ◽  
Recent Advances ◽  
Sensitivity And Selectivity ◽  
Doped Zno

Monitoring and detecting carbon monoxide (CO) are critical because this gas is toxic and harmful to the ecosystem. In this respect, designing high-performance gas sensors for CO detection is necessary. Zinc oxide-based materials are promising for use as CO sensors, owing to their good sensing response, electrical performance, cost-effectiveness, long-term stability, low power consumption, ease of manufacturing, chemical stability, and non-toxicity. Nevertheless, further progress in gas sensing requires improving the selectivity and sensitivity, and lowering the operating temperature. Recently, different strategies have been implemented to improve the sensitivity and selectivity of ZnO to CO, highlighting the doping of ZnO. Many studies concluded that doped ZnO demonstrates better sensing properties than those of undoped ZnO in detecting CO. Therefore, in this review, we analyze and discuss, in detail, the recent advances in doped ZnO for CO sensing applications. First, experimental studies on ZnO doped with transition metals, boron group elements, and alkaline earth metals as CO sensors are comprehensively reviewed. We then focused on analyzing theoretical and combined experimental–theoretical studies. Finally, we present the conclusions and some perspectives for future investigations in the context of advancements in CO sensing using doped ZnO, which include room-temperature gas sensing.

Analysis of HPDC Process with Automobile Part (Oil Pan) by CAE Simulation

2013 ◽  
Vol 753-755 ◽  
pp. 1318-1323 ◽  
Author(s):  
Kwang Kyu Seo ◽  
Hong Kyu Kwon
Keyword(s):  
Die Casting ◽  
Simulation Software ◽  
Filling Process ◽  
Solidification Shrinkage ◽  
Automobile Part ◽  
Computer Aided ◽  
Gate System ◽  
Simulation Results ◽  
Casting Design ◽  
Cae Simulation

In this research, Computer Aided Engineering (CAE) simulation was performed by using the simulation software (AnyCasting) in order to optimize casting design of an automobile part (Oil Pan_7G9E) which is well known and complicated to achieve a good casting layout. The simulation results were analyzed and compared carefully in order to apply them into the production die-casting mold. During the filling process, internal porosities caused by air entrap were predicted and reduced remarkably by the modification of the gate system and the configuration of overflow. With the solidification analysis, internal porosities caused by the solidification shrinkage were predicted and reduced by the modification of the gate system.

Electrical performance analysis of fine line on high density package substrate

2015 ◽  
Author(s):  
Hung-Chun Kuo ◽  
Ming-Fong Jhong ◽  
Hung-Hsiang Cheng ◽  
Chen-Chao Wang ◽  
Chih-Pin Hung
Keyword(s):  
Performance Analysis ◽  
High Density ◽  
Electrical Performance ◽  
Fine Line

scholarly journals Head-on-Pillow Defect Detection: X-Ray Inspection Limitations

2019 ◽  
Vol 16 (2) ◽  
pp. 91-102
Author(s):  
Lars Bruno ◽  
Benny Gustafson
Keyword(s):  
Solder Joints ◽  
Solder Paste ◽  
Wafer Level ◽  
Reflow Soldering ◽  
X Ray ◽  
Soldering Process ◽  
Irregular Shapes ◽  
Fine Pitch ◽  
Solder Balls ◽  
Ball Grid Array Packages

Abstract Both the number and the variants of ball grid array packages (BGAs) are tending to increase on network printed board assemblies with sizes ranging from a few millimeter die size wafer level packages with low ball count to large multidie system-in-package (SiP) BGAs with 60–70 mm side lengths and thousands of I/Os. One big challenge, especially for large BGAs, SiPs, and for thin fine-pitch BGA assemblies, is the dynamic warpage during the reflow soldering process. This warpage could lead to solder balls losing contact with the solder paste and its flux during parts of the soldering process, and this may result in solder joints with irregular shapes, indicating poor or no coalescence between the added solder and the BGA balls. This defect is called head-on-pillow (HoP) and is a failure type that is difficult to determine. In this study, x-ray inspection was used as a first step to find deliberately induced HoP defects, followed by prying off of the BGAs to verify real HoP defects and the fault detection correlation between the two methods. The result clearly shows that many of the solder joints classified as potential HoP defects in the x-ray analysis have no evidence at all of HoP after pry-off. This illustrates the difficulty of determining where to draw the line between pass and fail for HoP defects when using x-ray inspection.

A Technique for Determining the Mechanical Behavior and Electrical Performance of Thin Films

1999 ◽  
Author(s):  
Li Li ◽  
Biao Huang ◽  
Q. Qiao ◽  
M. H. Gordon ◽  
W. F. Schmidt ◽  
...  
Keyword(s):  
Thin Films ◽  
Mechanical Behavior ◽  
Film Theory ◽  
Nonlinear Finite Element ◽  
Electrical Performance ◽  
Finite Element Models ◽  
Numerical Predictions ◽  
Acceptable Range ◽  
Solder Balls ◽  
Measured Resistance

Abstract We describe a technique to determine the mechanical behavior and electrical performance of thin films. Thin films (2 μm) are deflected with a probe, and the displacement of the thin films and total electrical resistance are recorded. Nonlinear finite element models (ANSYS) are used to predict the corresponding force and stress. Three microstructures are built and tested: cantilever (80 μm long and 100 μm wide), bridge (290 μm long and 50 μm wide), and cross (320 μm long and 30 μm wide). No failures are observed at 15 μm deflection for all three structures, and a yield strength at least 1.34 GPa (4–20 times larger than the reported bulk value, but consistent with thin film theory) is inferred. The measured total resistance for every device ranges from open to 0.2 Ω. A direct correlation between the measured resistance and numerically predicted force (or contact pressure since the same probe tip is used in all tests) is noted, validating the numerical predictions. The bridge and cross designs appear feasible as a burn-in test socket, and we predict a mating force of 80–350 N for a 25 mm square chip with 10,000 solder balls on 250 μm spacing. This force will depend on the acceptable range of resistances as measured by our system.

Combined Manufacture Methods for High Density LTCC Substrates: Thick Film Screen Printing, Ink Jet, Postfiring Thin Film Processes, and Laser-Drilled Fine Vias

2009 ◽  
Vol 6 (1) ◽  
pp. 6-12 ◽  
Author(s):  
Arne Albertsen ◽  
Koji Koiwai ◽  
Kyoji Kobayashi ◽  
Tomonori Oguchi ◽  
Katsumi Aruga
Keyword(s):  
Thin Film ◽  
Thick Film ◽  
Screen Printing ◽  
Flip Chip ◽  
High Density ◽  
Uv Laser ◽  
Fine Pitch ◽  
Ink Jet ◽  
Printing Ink ◽  
Base Substrate

This paper highlights the possible combination of technologies such as thick film screen printing, ink jet, and post-firing thin film processes in conjunction with laser-drilled fine vias to produce high-density, miniaturized LTCC substrates. To obtain the silver pattern on the inner layers, both conventional thick film printing and ink jet printing (using nano silver particle dispersed ink) were applied on the ceramic green sheets. The ink jet process made it possible to metallize fine lines with line/space = 30/30 μm. For interlayer connections, fine vias of 30 μm in diameter formed by UV laser were used. Then these sheets were stacked on top of each other and fired to obtain a base substrate. On this base substrate, fine copper patterns for flip chip mounting were formed by a thin film process. The surface finish consisted of a nickel passivation and a gold layer deposited by electroless plating. The combination of the three patterning processes for conducting traces and UV laser drilling of fine vias make it appear possible to realize fine pitch LTCC, for example, for flip chip device mounting.

A 10 MHz to 80 GHz BGA Transition from Chip to LTCC Interposer for Chip Scale Packages

2015 ◽  
Vol 2015 (CICMT) ◽  
pp. 000067-000072
Author(s):  
Bradley A. Thrasher ◽  
William E. McKinzie ◽  
Deepukumar M. Nair ◽  
Michael A. Smith ◽  
Allan Beikmohamadi ◽  
...  
Keyword(s):  
Insertion Loss ◽  
Flip Chip ◽  
Ball Grid Array ◽  
Electrical Performance ◽  
60 Ghz ◽  
Test Chip ◽  
Full Wave ◽  
Test Board ◽  
Measurement Results ◽  
Solder Balls

Presented here are the design, fabrication, and measurement results of a low temperature cofired ceramic (LTCC) chip-to-interposer transition utilizing a flip-chip ball grid array (BGA) interconnect that provides excellent electrical performance up to and including 80 GHz. A test board fabricated in LTCC is used as the interposer substrate and another smaller LTCC part is used as a surrogate chip for demonstration purposes. The BGA chip-to-interposer transition is designed as a back-to-back pair of transitions with an assembly consisting of an LTCC interposer, an LTCC test chip, and a BGA interconnect constructed with 260 μm diameter polymer core solder balls. The LTCC material employed is DuPont™ GreenTape™ 9K7. Full-wave simulation results predict excellent electrical performance from 10 MHz to 80 GHz, with the chip-to-interposer BGA transition having less than 0.5 dB insertion loss at 60 GHz and less than 1 dB insertion loss up to 80 GHz. In an assembled package (back-to-back BGA transitions), the insertion loss was measured to be 1 dB per transition at 60 GHz and less than 2 dB per transition for all frequencies up to 80 GHz.

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