Theoretical Modeling of Conformal Criterion for Flexible Electronics Attached onto Complex Surface

2021 ◽  
pp. 1-10
Author(s):  
Lin Xiao ◽  
Ming Cheng ◽  
Furong Chen ◽  
Shan Jiang ◽  
YongAn Huang
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Electronic Devices ◽  
Target Surface ◽  
Complex Surface ◽  
Rigid Sphere ◽  
Principal Curvatures ◽  
Element Analysis ◽  
Mechanics Model ◽  
Conformal Contact

Abstract Transferring completed electronic devices onto curvilinear surfaces is popular for fabricating three-dimensional curvilinear electronics with high performance, while the problem of conformality between the unstretchable devices and the surfaces needs to be considered. Prior conformability design based on conformal mechanics model is a feasible way to reduce the non-conformal contact. Former studies mainly focused on stretchable film electronics conforming onto soft bio-tissue with a sinusoidal form microscopic morphology or unstretchable film conforming onto rigid sphere substrate, which limits its applicability in the aspect of shape and modulus of the substrate. Here, a conformal mechanics model with general geometric shape and material is introduced by choosing a bicurvature surface as the target surface, and the conformal contact behavior of film electronics is analyzed. All eight fundamental local surface features is obtained by adjusting two principal curvatures of the bicurvature surface, and the conformal performance is simulated. A dimensionless conformal criterion is given by minimizing the total energy as a function of seven dimensionless parameters, including four in geometric and three in material. The model and analysis results are verified by the finite element analysis, and it can provide a guidance for prior conformability design of the curvilinear electronic devices during the planar manufacturing process.

scholarly journals A widely adaptable analytical method for thermal analysis of flexible electronics with complex heat source structures

2019 ◽  
Vol 475 (2228) ◽  
pp. 20190402 ◽  
Author(s):  
Yafei Yin ◽  
Min Li ◽  
Wei Yuan ◽  
Xiaolian Chen ◽  
Yuhang Li
Keyword(s):  
Heat Source ◽  
Thermal Management ◽  
Flexible Electronics ◽  
Analytical Method ◽  
Thermal Field ◽  
Complex Shape ◽  
Source Region ◽  
Electronic Devices ◽  
Crucial Issue ◽  
Element Analysis

Flexible electronics, as a relatively new category of device, exhibit prodigious potential in many applications, especially in bio-integrated fields. It is critical to understand that thermal management of certain kinds of exothermic flexible electronics is a crucial issue, whether to avoid or to take advantage of the excessive temperature. A widely adaptable analytical method, validated by finite-element analysis and experiments, is conducted to investigate the thermal properties of exothermic flexible electronics with a heat source in complex shape or complex array layout. The main theoretical strategy to obtain the thermal field is through an integral along the complex curve source region. The results predicted by the analytical model enable accurate control of temperature and heat flow in the flexible electronics, which may help in the design and fabrication of flexible electronic devices in the future.

scholarly journals Experimental and Computational Study of Acceleration Response in Layered Cylindrical Structure Considering Impedance Mismatch Effect

2011 ◽  
Vol 18 (6) ◽  
pp. 807-826 ◽  
Author(s):  
Sachiko Sueki ◽  
Samaan G. Ladkany ◽  
Brendan J. O’Toole
Keyword(s):  
High Frequency ◽  
High Performance ◽  
Computational Study ◽  
Electronic Devices ◽  
Experimental Results ◽  
Acceleration Response ◽  
Element Analysis ◽  
Impedance Mismatch ◽  
Cylindrical Structures ◽  
Axial Acceleration

Electronic devices, especially those having high performance capabilities, are sensitive to mechanical shocks and vibrations. Failure of such devices in smart projectiles caused by vibrations has been observed. The currently accepted methodology to protect electronic devices in smart projectiles is use of stiffeners and dampers. However these methods are not effective in protecting the electronic devices from high frequency accelerations in excess of 5,000 Hz. Therefore, it is important to find more effective methods to reduce high frequency vibrations for smart projectiles. In this study, layered cylindrical structures are studied experimentally and computationally to understand the effect of impedance mismatch in axial acceleration response under an impact loading. Experiments are conducted by applying impact forces at one end of cylindrical structures and measuring accelerations at the other end. Experimental results suggest that high frequency accelerations in layered structures could be less compared to those in homogeneous cylinders if a returning wave from the end of the projectile does not interfere with the applied impact force. Computational studies using finite element analysis (FEA) verified the experimental results of our interference hypothesis.

scholarly journals The Conformal Design of an Island-Bridge Structure on a Non-Developable Surface for Stretchable Electronics

Micromachines ◽  
2018 ◽  
Vol 9 (8) ◽  
pp. 392 ◽  
Author(s):  
Lin Xiao ◽  
Chen Zhu ◽  
Wennan Xiong ◽  
YongAn Huang ◽  
Zhouping Yin
Keyword(s):  
High Performance ◽  
Maximum Size ◽  
Design Rule ◽  
Stretchable Electronics ◽  
Developable Surface ◽  
Bridge Structure ◽  
Principal Curvatures ◽  
Element Analysis ◽  
Developable Surfaces ◽  
Geometric Mapping

Conformal design of the island-bridge structure is the key to construct high-performance inorganic stretchable electronics that can be conformally transferred to non-developable surfaces. Former studies in conformal problems of epidermal electronics are mainly focused on soft surfaces that can adapt to the deformation of the electronics, which are not suitable for applications in hard, non-developable surfaces because of their loose surface constraints. In this paper, the conformal design problem for the island-bridge structure on a hard, non-developable surface was studied, including the critical size for island and stiffness and the demand for stretchability for the bridge. Firstly, the conformal model for an island on a part of torus surface was established to determine the relationship between the maximum size of the island and the curvatures of the surface. By combining the principle of energy minimization and the limit of material failure, a critical non-dimensional width for conformability was given for the island as a function of its thickness and interfacial adhesion energy, and the ratio of two principal curvatures of the surface. Then, the dependency of the tensile stiffness of the bridge on its geometric parameters was studied by finite element analysis (FEA) to guide the deterministic assembly of the islands on the surface. Finally, the location-dependent demands for the stretchability of the bridges were given by geometric mapping. This work will provide a design rule for stretchable electronics that fully conforms to the non-developable surface.

scholarly journals Recent Advances in Natural Functional Biopolymers and Their Applications of Electronic Skins and Flexible Strain Sensors

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 813
Author(s):  
Ziying Wang ◽  
Zongtao Ma ◽  
Jingyao Sun ◽  
Yuhua Yan ◽  
Miaomiao Bu ◽  
...  
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Low Cost ◽  
Electronic Waste ◽  
Electronic Devices ◽  
Strain Sensors ◽  
Functional Design ◽  
Nonrenewable Resources ◽  
Design Strategies ◽  
Flexible Sensors

In order to replace nonrenewable resources and decrease electronic waste disposal, there is a rapidly rising demand for the utilization of reproducible and degradable biopolymers in flexible electronics. Natural biopolymers have many remarkable characteristics, including light weight, excellent mechanical properties, biocompatibility, non-toxicity, low cost, etc. Thanks to these superior merits, natural functional biopolymers can be designed and optimized for the development of high-performance flexible electronic devices. Herein, we provide an insightful overview of the unique structures, properties and applications of biopolymers for electronic skins (e-skins) and flexible strain sensors. The relationships between properties and sensing performances of biopolymers-based sensors are also investigated. The functional design strategies and fabrication technologies for biopolymers-based flexible sensors are proposed. Furthermore, the research progresses of biopolymers-based sensors with various functions are described in detail. Finally, we provide some useful viewpoints and future prospects of developing biopolymers-based flexible sensors.

Parallel Computing for Tire Simulations

2011 ◽  
Vol 39 (3) ◽  
pp. 193-209 ◽  
Author(s):  
H. Surendranath ◽  
M. Dunbar
Keyword(s):  
High Performance ◽  
Effective Means ◽  
Cost Effective ◽  
Turnaround Time ◽  
Careful Consideration ◽  
Rolling Contact ◽  
Element Analysis ◽  
Parallel Solvers ◽  
Design Changes ◽  
Highly Nonlinear

Abstract Over the last few decades, finite element analysis has become an integral part of the overall tire design process. Engineers need to perform a number of different simulations to evaluate new designs and study the effect of proposed design changes. However, tires pose formidable simulation challenges due to the presence of highly nonlinear rubber compounds, embedded reinforcements, complex tread geometries, rolling contact, and large deformations. Accurate simulation requires careful consideration of these factors, resulting in the extensive turnaround time, often times prolonging the design cycle. Therefore, it is extremely critical to explore means to reduce the turnaround time while producing reliable results. Compute clusters have recently become a cost effective means to perform high performance computing (HPC). Distributed memory parallel solvers designed to take advantage of compute clusters have become increasingly popular. In this paper, we examine the use of HPC for various tire simulations and demonstrate how it can significantly reduce simulation turnaround time. Abaqus/Standard is used for routine tire simulations like footprint and steady state rolling. Abaqus/Explicit is used for transient rolling and hydroplaning simulations. The run times and scaling data corresponding to models of various sizes and complexity are presented.

Organic Electronics

2020 ◽  
Author(s):  
Stephen R. Forrest
Keyword(s):  
Thin Film ◽  
Organic Electronics ◽  
Thin Film Transistors ◽  
High Performance ◽  
Electronic Devices ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Organic Thin Film ◽  
Graduate Studies ◽  
Organic Light

Organic electronics is a platform for very low cost and high performance optoelectronic and electronic devices that cover large areas, are lightweight, and can be both flexible and conformable to irregularly shaped surfaces such as foldable smart phones. Organics are at the core of the global organic light emitting device (OLED) display industry, and also having use in efficient lighting sources, solar cells, and thin film transistors useful in medical and a range of other sensing, memory and logic applications. This book introduces the theoretical foundations and practical realization of devices in organic electronics. It is a product of both one and two semester courses that have been taught over a period of more than two decades. The target audiences are students at all levels of graduate studies, highly motivated senior undergraduates, and practicing engineers and scientists. The book is divided into two sections. Part I, Foundations, lays down the fundamental principles of the field of organic electronics. It is assumed that the reader has an elementary knowledge of quantum mechanics, and electricity and magnetism. Background knowledge of organic chemistry is not required. Part II, Applications, focuses on organic electronic devices. It begins with a discussion of organic thin film deposition and patterning, followed by chapters on organic light emitters, detectors, and thin film transistors. The last chapter describes several devices and phenomena that are not covered in the previous chapters, since they lie outside of the current mainstream of the field, but are nevertheless important.

Double-network hydrogel with adjustable surface morphology and multifunctional integration for flexible strain sensors

Soft Matter ◽  
2021 ◽  
Author(s):  
Yang Yu ◽  
Fengjin Xie ◽  
Xinpei Gao ◽  
Liqiang Zheng
Keyword(s):  
Surface Morphology ◽  
Flexible Electronics ◽  
High Performance ◽  
Strain Sensors ◽  
Next Generation ◽  
Double Network ◽  
Conductive Hydrogels

The next generation of high-performance flexible electronics has put forward new demands to the development of ionic conductive hydrogels. In recent years, many efforts have been made toward developing double-network...

scholarly journals A thin, deformable, high-performance supercapacitor implant that can be biodegraded and bioabsorbed within an animal body

2021 ◽  
Vol 7 (2) ◽  
pp. eabe3097
Author(s):  
Hongwei Sheng ◽  
Jingjing Zhou ◽  
Bo Li ◽  
Yuhang He ◽  
Xuetao Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Electronic Devices ◽  
Form Factors ◽  
Time Frame ◽  
Water Soluble ◽  
Two Dimensional ◽  
Medical Electronics ◽  
Thin Structure ◽  
Shed Light

It has been an outstanding challenge to achieve implantable energy modules that are mechanically soft (compatible with soft organs and tissues), have compact form factors, and are biodegradable (present for a desired time frame to power biodegradable, implantable medical electronics). Here, we present a fully biodegradable and bioabsorbable high-performance supercapacitor implant, which is lightweight and has a thin structure, mechanical flexibility, tunable degradation duration, and biocompatibility. The supercapacitor with a high areal capacitance (112.5 mF cm−2 at 1 mA cm−2) and energy density (15.64 μWh cm−2) uses two-dimensional, amorphous molybdenum oxide (MoOx) flakes as electrodes, which are grown in situ on water-soluble Mo foil using a green electrochemical strategy. Biodegradation behaviors and biocompatibility of the associated materials and the supercapacitor implant are systematically studied. Demonstrations of a supercapacitor implant that powers several electronic devices and that is completely degraded after implantation and absorbed in rat body shed light on its potential uses.

scholarly journals Ultrathin, Lightweight, and Flexible CNT Buckypaper Enhanced Using MXenes for Electromagnetic Interference Shielding

2021 ◽  
Vol 13 (1) ◽  
Author(s):  
Rongliang Yang ◽  
Xuchun Gui ◽  
Li Yao ◽  
Qingmei Hu ◽  
Leilei Yang ◽  
...  
Keyword(s):  
Electromagnetic Interference ◽  
High Performance ◽  
Electronic Devices ◽  
Deposition Process ◽  
Shielding Effectiveness ◽  
Emi Shielding ◽  
Emi Shielding Effectiveness ◽  
X Band ◽  
Wearable Electronic Devices ◽  
Emi Se

AbstractLightweight, flexibility, and low thickness are urgent requirements for next-generation high-performance electromagnetic interference (EMI) shielding materials for catering to the demand for smart and wearable electronic devices. Although several efforts have focused on constructing porous and flexible conductive films or aerogels, few studies have achieved a balance in terms of density, thickness, flexibility, and EMI shielding effectiveness (SE). Herein, an ultrathin, lightweight, and flexible carbon nanotube (CNT) buckypaper enhanced using MXenes (Ti3C2Tx) for high-performance EMI shielding is synthesized through a facile electrophoretic deposition process. The obtained Ti3C2Tx@CNT hybrid buckypaper exhibits an outstanding EMI SE of 60.5 dB in the X-band at 100 μm. The hybrid buckypaper with an MXene content of 49.4 wt% exhibits an EMI SE of 50.4 dB in the X-band with a thickness of only 15 μm, which is 105% higher than that of pristine CNT buckypaper. Furthermore, an average specific SE value of 5.7 × 104 dB cm2 g−1 is exhibited in the 5-μm hybrid buckypaper. Thus, this assembly process proves promising for the construction of ultrathin, flexible, and high-performance EMI shielding films for application in electronic devices and wireless communications.

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