scholarly journals Experimental and Computational Study of Acceleration Response in Layered Cylindrical Structure Considering Impedance Mismatch Effect

2011 ◽  
Vol 18 (6) ◽  
pp. 807-826 ◽  
Author(s):  
Sachiko Sueki ◽  
Samaan G. Ladkany ◽  
Brendan J. O’Toole
Keyword(s):  
High Frequency ◽  
High Performance ◽  
Computational Study ◽  
Electronic Devices ◽  
Experimental Results ◽  
Acceleration Response ◽  
Element Analysis ◽  
Impedance Mismatch ◽  
Cylindrical Structures ◽  
Axial Acceleration

Electronic devices, especially those having high performance capabilities, are sensitive to mechanical shocks and vibrations. Failure of such devices in smart projectiles caused by vibrations has been observed. The currently accepted methodology to protect electronic devices in smart projectiles is use of stiffeners and dampers. However these methods are not effective in protecting the electronic devices from high frequency accelerations in excess of 5,000 Hz. Therefore, it is important to find more effective methods to reduce high frequency vibrations for smart projectiles. In this study, layered cylindrical structures are studied experimentally and computationally to understand the effect of impedance mismatch in axial acceleration response under an impact loading. Experiments are conducted by applying impact forces at one end of cylindrical structures and measuring accelerations at the other end. Experimental results suggest that high frequency accelerations in layered structures could be less compared to those in homogeneous cylinders if a returning wave from the end of the projectile does not interfere with the applied impact force. Computational studies using finite element analysis (FEA) verified the experimental results of our interference hypothesis.

Unlocking diamond's potential as an electronic material

2007 ◽  
Vol 366 (1863) ◽  
pp. 251-265 ◽  
Author(s):  
R.S Balmer ◽  
I Friel ◽  
S.M Woollard ◽  
C.J.H Wort ◽  
G.A Scarsbrook ◽  
...  
Keyword(s):  
High Frequency ◽  
High Performance ◽  
Synthetic Diamond ◽  
Electronic Devices ◽  
Current Status ◽  
Small Signal ◽  
Practical Applications ◽  
A Current ◽  
Rf Measurements

In this paper, we review the suitability of diamond as a semiconductor material for high-performance electronic applications. The current status of the manufacture of synthetic diamond is reviewed and assessed. In particular, we consider the quality of intrinsic material now available and the challenges in making doped structures suitable for practical devices. Two practical applications are considered in detail. First, the development of high-voltage switches capable of switching voltages in excess of 10 kV. Second, the development of diamond MESFETs for high-frequency and high-power applications. Here device data are reported showing a current density of more than 30 mA mm −1 along with small-signal RF measurements demonstrating gigahertz operation. We conclude by considering the remaining challenges which will need to be overcome if commercially attractive diamond electronic devices are to be manufactured.

scholarly journals Parallel high-performance computing algorithm to generate FEM-compliant volumetric mesh representations of biomolecules at atomic scale

2019 ◽  
Author(s):  
Jorge López ◽  
Salvador Botello ◽  
Rafael Herrera ◽  
Mauricio Carrillo-Tripp
Keyword(s):  
Finite Element ◽  
High Performance Computing ◽  
Mesh Generation ◽  
High Performance ◽  
Computational Study ◽  
Atomic Scale ◽  
Element Analysis ◽  
Performance Computing ◽  
Mesh Models ◽  
Memory Efficient

AbstractThe computational study of biomolecules has been undermined by the lack of models that accurately represent the structure of big complexes at the atomic level. In this work, we report the development of an algorithm to generate a volumetric mesh of a biomolecule, of any size and shape, based on its atomic structure. Our mesh generation tool leverages the octree algorithm properties with parallel high-performance computing techniques to produce a discretized hexahedral model faster than previous methods. The reported algorithm is memory efficient and generates volumetric meshes suitable to be used directly in Finite Element Analysis. We tested the algorithm by producing mesh models of different biomolecule types and complex size, and also performed numerical simulations for the largest case. The Finite Element results show that our mesh models reproduce experimental data.

Theoretical Modeling of Conformal Criterion for Flexible Electronics Attached onto Complex Surface

2021 ◽  
pp. 1-10
Author(s):  
Lin Xiao ◽  
Ming Cheng ◽  
Furong Chen ◽  
Shan Jiang ◽  
YongAn Huang
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Electronic Devices ◽  
Target Surface ◽  
Complex Surface ◽  
Rigid Sphere ◽  
Principal Curvatures ◽  
Element Analysis ◽  
Mechanics Model ◽  
Conformal Contact

Abstract Transferring completed electronic devices onto curvilinear surfaces is popular for fabricating three-dimensional curvilinear electronics with high performance, while the problem of conformality between the unstretchable devices and the surfaces needs to be considered. Prior conformability design based on conformal mechanics model is a feasible way to reduce the non-conformal contact. Former studies mainly focused on stretchable film electronics conforming onto soft bio-tissue with a sinusoidal form microscopic morphology or unstretchable film conforming onto rigid sphere substrate, which limits its applicability in the aspect of shape and modulus of the substrate. Here, a conformal mechanics model with general geometric shape and material is introduced by choosing a bicurvature surface as the target surface, and the conformal contact behavior of film electronics is analyzed. All eight fundamental local surface features is obtained by adjusting two principal curvatures of the bicurvature surface, and the conformal performance is simulated. A dimensionless conformal criterion is given by minimizing the total energy as a function of seven dimensionless parameters, including four in geometric and three in material. The model and analysis results are verified by the finite element analysis, and it can provide a guidance for prior conformability design of the curvilinear electronic devices during the planar manufacturing process.

Direct copper metallization on TGV (Thru-Glass-Via) for high performance glass substrate

2017 ◽  
Vol 2017 (1) ◽  
pp. 000464-000467
Author(s):  
Shigeo ONITAKE ◽  
Kotoku INOUE ◽  
Masatoshi TAKAYAMA
Keyword(s):  
Glass Substrate ◽  
High Frequency ◽  
High Performance ◽  
Low Cost ◽  
Electronic Devices ◽  
Sol Gel ◽  
Copper Film ◽  
Copper Metallization ◽  
Communication Devices ◽  
Seed Layers

Abstract IoT (Internet of things) society will be coming in the near future, and everything will be connected by the Internet. Consequently, data traffic will be increased, and so will the demand to improve the performance of communication devices. Currently, plastics and ceramics are commonly used as insulating materials for communication components, but they are getting close to the limit in terms of material properties, because the next generation high performance communication devices require signal frequency of 20GHz and beyond. Therefore, further improvements in the properties of the insulating materials as well as in the performance of electronic devices are being demanded. Copper conformal metallization on glass provides many opportunities for high frequency electronic devices. The most obvious advantage is given by the material properties. The glass substrate was chosen for low conductivity and low dielectric loss for high frequency application, and for its scalability to the larger area panels with low cost. While applications require strong interfacial adhesion between copper film and glass substrate, glass is often inferior as compared to metal-to metal adhesion. Direct copper metallization on glass is conventionally a difficult task, and it usually does not provide enough peeling strength either. Therefore, forming Ni and Ti seed layers by sputtering and precursors deposited by sol-gel method are being studied. However, these processes have been limitedly used or not been used in mass production, because creation of vias and simultaneous formation of seed layers on both sides by sputtering is difficult to undertake. The Sol-gel method does not provide stable peel strength and it takes a long process. This additional process requirement to add a layer to promote the adhesion of Cu to glass burdens the factories in a couple of ways: 1) enlarging the glass substrate is difficult due to the limitation in equipment size, 2) forming the film inside the through holes is also difficult due to high-aspect ratio via requirements, and 3) high cost due to slow processing speed. In an earlier reports, we presented evidence that we have successfully demonstrated direct copper plating on glass, showing the adhesion strength of 0.42kN/m between glass and copper seed layer. In the present work, we are reporting wet plating process which enables easy and uniform film formation on large glass substrates and inside through holes. This low cost wet plating process enables forming copper film directly on glass without adhesion layer and enhancing the adhesion strength without degrading glass properties and copper conductivity.

scholarly journals Tension-Stiffening Effect Consideration for Modeling Deflection of Cracked Reinforced UHPC Beams

2021 ◽  
Vol 14 (1) ◽  
pp. 415
Author(s):  
Le Teng ◽  
Rongling Zhang ◽  
Kamal Henri Khayat
Keyword(s):  
Reinforced Concrete ◽  
High Performance ◽  
High Performance Concrete ◽  
Bending Moment ◽  
Moment Of Inertia ◽  
Fiber Reinforced Concrete ◽  
Experimental Results ◽  
Element Analysis ◽  
Time Saving ◽  
Tension Stiffening

Tension-stiffening effects can significantly influence the flexural performance of cracked reinforced concrete specimens. Such effect is amplified for fiber-reinforced concrete, given the fact that fibers can bridge the cracks. The objective of this study was to develop a model to predict the deflection of cracked reinforced ultra-high performance concrete (R-UHPC) beam elements. The modeling approach characterized the average bending moment of inertia by combining the existing model used for conventional reinforced concrete and the analytical model of stress distribution of UHPC along the cross-section. The finite element analysis (FEA) was employed to evaluate the flexural deflection based on the average bending moment of inertia. The calculated load-deflection relationships have been compared to experimental results. The results indicated that the relative errors of deflection between predicted and experimental results can be controlled within 15%, compared to values ranging from 5% to 50% calculated by neglecting the tensile properties of cracked UHPC and values ranging from 5% to 30% calculated by effective inertia of bending moment of ACI code. Therefore, the developed model can be used in practice because it can secure the accuracy of deflection prediction of the R-UHPC beams. Such a simplified model also has higher sustainability compared to FEA using solid elements since it is easier and time-saving to be established and calculated.

Parallel Computing for Tire Simulations

2011 ◽  
Vol 39 (3) ◽  
pp. 193-209 ◽  
Author(s):  
H. Surendranath ◽  
M. Dunbar
Keyword(s):  
High Performance ◽  
Effective Means ◽  
Cost Effective ◽  
Turnaround Time ◽  
Careful Consideration ◽  
Rolling Contact ◽  
Element Analysis ◽  
Parallel Solvers ◽  
Design Changes ◽  
Highly Nonlinear

Abstract Over the last few decades, finite element analysis has become an integral part of the overall tire design process. Engineers need to perform a number of different simulations to evaluate new designs and study the effect of proposed design changes. However, tires pose formidable simulation challenges due to the presence of highly nonlinear rubber compounds, embedded reinforcements, complex tread geometries, rolling contact, and large deformations. Accurate simulation requires careful consideration of these factors, resulting in the extensive turnaround time, often times prolonging the design cycle. Therefore, it is extremely critical to explore means to reduce the turnaround time while producing reliable results. Compute clusters have recently become a cost effective means to perform high performance computing (HPC). Distributed memory parallel solvers designed to take advantage of compute clusters have become increasingly popular. In this paper, we examine the use of HPC for various tire simulations and demonstrate how it can significantly reduce simulation turnaround time. Abaqus/Standard is used for routine tire simulations like footprint and steady state rolling. Abaqus/Explicit is used for transient rolling and hydroplaning simulations. The run times and scaling data corresponding to models of various sizes and complexity are presented.

Tire Cornering Simulation Using an Explicit Finite Element Analysis Code

1998 ◽  
Vol 26 (2) ◽  
pp. 109-119 ◽  
Author(s):  
M. Koishi ◽  
K. Kabe ◽  
M. Shiratori
Keyword(s):  
Finite Element Method ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Test System ◽  
Experimental Results ◽  
The Finite Element Method ◽  
Element Analysis ◽  
Explicit Finite Element ◽  
Explicit Finite Element Analysis ◽  
Element Method

Abstract The finite element method has been used widely in tire engineering. Most tire simulations using the finite element method are static analyses, because tires are very complex nonlinear structures. Recently, transient phenomena have been studied with explicit finite element analysis codes. In this paper, the authors demonstrate the feasibility of tire cornering simulation using an explicit finite element code, PAM-SHOCK. First, we propose the cornering simulation using the explicit finite element analysis code. To demonstrate the efficiency of the proposed simulation, computed cornering forces for a 175SR14 tire are compared with experimental results from an MTS Flat-Trac Tire Test System. The computed cornering forces agree well with experimental results. After that, parametric studies are conducted by using the proposed simulation.

Organic Electronics

2020 ◽  
Author(s):  
Stephen R. Forrest
Keyword(s):  
Thin Film ◽  
Organic Electronics ◽  
Thin Film Transistors ◽  
High Performance ◽  
Electronic Devices ◽  
Thin Film Deposition ◽  
Film Deposition ◽  
Organic Thin Film ◽  
Graduate Studies ◽  
Organic Light

Organic electronics is a platform for very low cost and high performance optoelectronic and electronic devices that cover large areas, are lightweight, and can be both flexible and conformable to irregularly shaped surfaces such as foldable smart phones. Organics are at the core of the global organic light emitting device (OLED) display industry, and also having use in efficient lighting sources, solar cells, and thin film transistors useful in medical and a range of other sensing, memory and logic applications. This book introduces the theoretical foundations and practical realization of devices in organic electronics. It is a product of both one and two semester courses that have been taught over a period of more than two decades. The target audiences are students at all levels of graduate studies, highly motivated senior undergraduates, and practicing engineers and scientists. The book is divided into two sections. Part I, Foundations, lays down the fundamental principles of the field of organic electronics. It is assumed that the reader has an elementary knowledge of quantum mechanics, and electricity and magnetism. Background knowledge of organic chemistry is not required. Part II, Applications, focuses on organic electronic devices. It begins with a discussion of organic thin film deposition and patterning, followed by chapters on organic light emitters, detectors, and thin film transistors. The last chapter describes several devices and phenomena that are not covered in the previous chapters, since they lie outside of the current mainstream of the field, but are nevertheless important.

scholarly journals A RF Redundant TSV Interconnection for High Resistance Si Interposer

Micromachines ◽  
2021 ◽  
Vol 12 (2) ◽  
pp. 169
Author(s):  
Mengcheng Wang ◽  
Shenglin Ma ◽  
Yufeng Jin ◽  
Wei Wang ◽  
Jing Chen ◽  
...  
Keyword(s):  
Millimeter Wave ◽  
High Frequency ◽  
High Performance ◽  
Rapid Development ◽  
Coplanar Waveguide ◽  
Equivalent Circuit Model ◽  
High Resistivity ◽  
Performance Requirements ◽  
Wave Radar ◽  
Interconnect Design

Through Silicon Via (TSV) technology is capable meeting effective, compact, high density, high integration, and high-performance requirements. In high-frequency applications, with the rapid development of 5G and millimeter-wave radar, the TSV interposer will become a competitive choice for radio frequency system-in-package (RF SIP) substrates. This paper presents a redundant TSV interconnect design for high resistivity Si interposers for millimeter-wave applications. To verify its feasibility, a set of test structures capable of working at millimeter waves are designed, which are composed of three pieces of CPW (coplanar waveguide) lines connected by single TSV, dual redundant TSV, and quad redundant TSV interconnects. First, HFSS software is used for modeling and simulation, then, a modified equivalent circuit model is established to analysis the effect of the redundant TSVs on the high-frequency transmission performance to solidify the HFSS based simulation. At the same time, a failure simulation was carried out and results prove that redundant TSV can still work normally at 44 GHz frequency when failure occurs. Using the developed TSV process, the sample is then fabricated and tested. Using L-2L de-embedding method to extract S-parameters of the TSV interconnection. The insertion loss of dual and quad redundant TSVs are 0.19 dB and 0.46 dB at 40 GHz, respectively.

scholarly journals A thin, deformable, high-performance supercapacitor implant that can be biodegraded and bioabsorbed within an animal body

2021 ◽  
Vol 7 (2) ◽  
pp. eabe3097
Author(s):  
Hongwei Sheng ◽  
Jingjing Zhou ◽  
Bo Li ◽  
Yuhang He ◽  
Xuetao Zhang ◽  
...  
Keyword(s):  
High Performance ◽  
Electronic Devices ◽  
Form Factors ◽  
Time Frame ◽  
Water Soluble ◽  
Two Dimensional ◽  
Medical Electronics ◽  
Thin Structure ◽  
Shed Light

It has been an outstanding challenge to achieve implantable energy modules that are mechanically soft (compatible with soft organs and tissues), have compact form factors, and are biodegradable (present for a desired time frame to power biodegradable, implantable medical electronics). Here, we present a fully biodegradable and bioabsorbable high-performance supercapacitor implant, which is lightweight and has a thin structure, mechanical flexibility, tunable degradation duration, and biocompatibility. The supercapacitor with a high areal capacitance (112.5 mF cm−2 at 1 mA cm−2) and energy density (15.64 μWh cm−2) uses two-dimensional, amorphous molybdenum oxide (MoOx) flakes as electrodes, which are grown in situ on water-soluble Mo foil using a green electrochemical strategy. Biodegradation behaviors and biocompatibility of the associated materials and the supercapacitor implant are systematically studied. Demonstrations of a supercapacitor implant that powers several electronic devices and that is completely degraded after implantation and absorbed in rat body shed light on its potential uses.

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