Electronic Materials and Structures for Multichip Modules

1992 ◽  
Vol 114 (2) ◽  
pp. 226-233 ◽  
Author(s):  
H. K. Charles
Keyword(s):  
Systematic Review ◽  
Electronic Properties ◽  
High Performance ◽  
Electronic Materials ◽  
Electronic Devices ◽  
High Density ◽  
Multichip Module ◽  
Multichip Modules ◽  
New Materials ◽  
Potential Impact

Multichip modules are rapidly becoming a major thrust in electronic packaging technology. Because of the high density and high performance nature of the electronic devices packaged in multichip modules, stringent new demands are being placed on materials, interconnect, and packaging structures. A systematic review of the materials and material structures for multichip modules is presented along with their associated physical and electronic properties. Particular emphasis is placed on new materials and their potential impact on multichip module packaging. Examples of their use in the fabrication of multichip modules and advanced chip-on-board systems are described.

An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter
Keyword(s):  
Thin Film ◽  
Low Power ◽  
Manufacturing Process ◽  
High Performance ◽  
Low Cost ◽  
High Density ◽  
Point Of View ◽  
Multichip Module ◽  
Multichip Modules

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

scholarly journals Hybrid Polymer/Metal Oxide Thin Films for High Performance, Flexible Transistors

Micromachines ◽  
2020 ◽  
Vol 11 (3) ◽  
pp. 264 ◽  
Author(s):  
Jae Jeong ◽  
Hye Hwang ◽  
Dalsu Choi ◽  
Byung Ma ◽  
Jaehan Jung ◽  
...  
Keyword(s):  
Electronic Properties ◽  
Polymer Nanocomposites ◽  
Flexible Electronics ◽  
High Performance ◽  
Electronic Materials ◽  
Polymer Nanocomposite ◽  
Metal Oxide Thin Films ◽  
Research Fields ◽  
Recent Developments ◽  
Polymer Metal

Metal oxides (MOs) have garnered significant attention in a variety of research fields, particularly in flexible electronics such as wearable devices, due to their superior electronic properties. Meanwhile, polymers exhibit excellent mechanical properties such as flexibility and durability, besides enabling economic solution-based fabrication. Therefore, MO/polymer nanocomposites are excellent electronic materials for use in flexible electronics owing to the confluence of the merits of their components. In this article, we review recent developments in the synthesis and fabrication techniques for MO/polymer nanocomposite-based flexible transistors. In particular, representative MO/polymer nanocomposites for flexible and transparent channel layers and gate dielectrics are introduced and their electronic properties—such as mobilities and dielectric constant—are presented. Finally, we highlight the advances in interface engineering and its influence on device electronics.

scholarly journals Materials and processing approaches for foundry-compatible transient electronics

2017 ◽  
Vol 114 (28) ◽  
pp. E5522-E5529 ◽  
Author(s):  
Jan-Kai Chang ◽  
Hui Fang ◽  
Christopher A. Bower ◽  
Enming Song ◽  
Xinge Yu ◽  
...  
Keyword(s):  
Data Storage ◽  
Integrated Circuit ◽  
High Performance ◽  
Electronic Materials ◽  
Electronic Devices ◽  
Complementary Metal Oxide Semiconductor ◽  
Water Soluble ◽  
Oxide Semiconductor ◽  
Cost Structures ◽  
Functional Capabilities

Foundry-based routes to transient silicon electronic devices have the potential to serve as the manufacturing basis for “green” electronic devices, biodegradable implants, hardware secure data storage systems, and unrecoverable remote devices. This article introduces materials and processing approaches that enable state-of-the-art silicon complementary metal-oxide-semiconductor (CMOS) foundries to be leveraged for high-performance, water-soluble forms of electronics. The key elements are (i) collections of biodegradable electronic materials (e.g., silicon, tungsten, silicon nitride, silicon dioxide) and device architectures that are compatible with manufacturing procedures currently used in the integrated circuit industry, (ii) release schemes and transfer printing methods for integration of multiple ultrathin components formed in this way onto biodegradable polymer substrates, and (iii) planarization and metallization techniques to yield interconnected and fully functional systems. Various CMOS devices and circuit elements created in this fashion and detailed measurements of their electrical characteristics highlight the capabilities. Accelerated dissolution studies in aqueous environments reveal the chemical kinetics associated with the underlying transient behaviors. The results demonstrate the technical feasibility for using foundry-based routes to sophisticated forms of transient electronic devices, with functional capabilities and cost structures that could support diverse applications in the biomedical, military, industrial, and consumer industries.

Two-dimensional square-pyramidal VO2 with tunable electronic properties

2015 ◽  
Vol 3 (13) ◽  
pp. 3189-3197 ◽  
Author(s):  
Zhen-Kun Tang ◽  
Xi-Bo Li ◽  
Deng-Yu Zhang ◽  
Yan-Ning Zhang ◽  
Li-Min Liu
Keyword(s):  
Electronic Properties ◽  
High Performance ◽  
Two Dimensional ◽  
New Materials

In order to design the high-performance spintronics, it is rather critical to develop new materials, which can easily regulate the magnetism of nanostructures.

Interconnect Technologies for Heterogeneous 3D Integration : CMOS and MEMS

2010 ◽  
Vol 1249 ◽  
Author(s):  
Hyung Suk Yang ◽  
Muhannad Bakir
Keyword(s):  
High Performance ◽  
Electronic Circuit ◽  
Microelectromechanical Systems ◽  
High Density ◽  
Mems Devices ◽  
New Materials ◽  
3D Integration ◽  
Through Silicon Via ◽  
Wide Range ◽  
Conventional Methods

AbstractMicroelectromechanical Systems (MEMS) market is a rapidly growing market with a wide range of devices. Most of these devices require an interaction with an electronic circuit, and with the increasing number of high performance MEMS devices that are being introduced, a demand for integrating CMOS and MEMS using high-density and low-parasitic interconnects have also been on the rise.Unfortunately, conventional methods of integrating CMOS with MEMS cannot provide the high density and low-parasitic interconnections required by modern high performance MEMS devices, and at the same time provide the flexibility required to accommodate new devices that are made using new materials and highly innovative fabrication processes.Heterogeneous 3D integration of MEMS and CMOS has the potential to provide both the performance and the integration flexibility; however there are two interconnect challenges that need to be addressed. This paper outlines the details of these interconnect challenges and introduces two interconnect technologies, Mechanically Flexible Interconnects (MFI) and Through-Silicon Via (TSV), developed specifically to address these challenges.

Thermal and Mechanical Analysis of a Multichip Module

1992 ◽  
Vol 264 ◽  
Author(s):  
M. S. Hu
Keyword(s):  
High Speed ◽  
Mechanical Analysis ◽  
High Density ◽  
Electrical Performance ◽  
Multichip Module ◽  
Multichip Modules ◽  
Printed Wiring Board ◽  
Proper Design ◽  
Wiring Board ◽  
High Density Packaging

AbstractHigh speed, high density packaging requirements have made multichip modules (MCM) one of the most active areas of research in the electronic industry.High density printed wiring board (PWB) have low production cost and good electrical performance. However, the most questioned issue in application is the reliability. As a result, a thermal and mechanical analysis on a MCM has been conducted to understand its feasibility. The results indicate that with proper design, the components can operate under satisfactory conditions on PWB laminates.

Mineral/microfibrillated cellulose composite materials: High performance products, applications, and product forms

TAPPI Journal ◽  
2018 ◽  
Vol 17 (09) ◽  
pp. 507-515 ◽  
Author(s):  
David Skuse ◽  
Mark Windebank ◽  
Tafadzwa Motsi ◽  
Guillaume Tellier
Keyword(s):  
Composite Materials ◽  
High Performance ◽  
Aqueous Suspension ◽  
Production Capacity ◽  
Cost Savings ◽  
Cost Effective ◽  
New Materials ◽  
Wet Strength ◽  
Product Forms ◽  
Cellulose Composite

When pulp and minerals are co-processed in aqueous suspension, the mineral acts as a grinding aid, facilitating the cost-effective production of fibrils. Furthermore, this processing allows the utilization of robust industrial milling equipment. There are 40000 dry metric tons of mineral/microfbrillated (MFC) cellulose composite production capacity in operation across three continents. These mineral/MFC products have been cleared by the FDA for use as a dry and wet strength agent in coated and uncoated food contact paper and paperboard applications. We have previously reported that use of these mineral/MFC composite materials in fiber-based applications allows generally improved wet and dry mechanical properties with concomitant opportunities for cost savings, property improvements, or grade developments and that the materials can be prepared using a range of fibers and minerals. Here, we: (1) report the development of new products that offer improved performance, (2) compare the performance of these new materials with that of a range of other nanocellulosic material types, (3) illustrate the performance of these new materials in reinforcement (paper and board) and viscosification applications, and (4) discuss product form requirements for different applications.

Intercalation of First Row Transition Metals inside Covalent-Organic Frameworks (COF): a Strategy to Fine Tune the Electronic Properties of Porous Crystalline Materials

2018 ◽  
Author(s):  
Srimanta Pakhira ◽  
Jose Mendoza-Cortes
Keyword(s):  
Transition Metal ◽  
Transition Metals ◽  
Electronic Properties ◽  
High Surface ◽  
Electronic Devices ◽  
High Surface Area ◽  
Main Role ◽  
Covalent Organic Frameworks ◽  
Porous Network ◽  
Crystalline Materials

<div>Covalent organic frameworks (COFs) have emerged as an important class of nano-porous crystalline materials with many potential applications. They are intriguing platforms for the design of porous skeletons with special functionality at the molecular level. However, despite their extraordinary properties, it is difficult to control their electronic properties, thus hindering the potential implementation in electronic devices. A new form of nanoporous material, COFs intercalated with first row transition metal is proposed to address this fundamental drawback - the lack of electronic tunability. Using first-principles calculations, we have designed 31 new COF materials <i>in-silico</i> by intercalating all of the first row transition metals (TMs) with boroxine-linked and triazine-linked COFs: COF-TM-x (where TM=Sc-Zn and x=3-5). This is a significant addition considering that only 187 experimentally COFs structures has been reported and characterized so far. We have investigated their structure and electronic properties. Specifically, we predict that COF's band gap and density of states (DOSs) can be controlled by intercalating first row transition metal atoms (TM: Sc - Zn) and fine tuned by the concentration of TMs. We also found that the $d$-subshell electron density of the TMs plays the main role in determining the electronic properties of the COFs. Thus intercalated-COFs provide a new strategy to control the electronic properties of materials within a porous network. This work opens up new avenues for the design of TM-intercalated materials with promising future applications in nanoporous electronic devices, where a high surface area coupled with fine-tuned electronic properties are desired.</div>

Failure Analysis and Defect Inspection of Electronic Devices by High-Resolution Cathodoluminescence

2017 ◽  
Author(s):  
C. Monachon ◽  
M.S. Zielinski ◽  
D. Gachet ◽  
S. Sonderegger ◽  
S. Muckenhirn ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Electronic Materials ◽  
Electronic Devices ◽  
Optical Emission ◽  
Large Field ◽  
Nanometer Scale ◽  
Defect Analysis ◽  
Defect Inspection ◽  
Spectrally Resolved ◽  
Non Destructive

Abstract Quantitative cathodoluminescence (CL) microscopy is a new optical spectroscopy technique that measures electron beam-induced optical emission over large field of view with a spatial resolution close to that of a scanning electron microscope (SEM). Correlation of surface morphology (SE contrast) with spectrally resolved and highly material composition sensitive CL emission opens a new pathway in non-destructive failure and defect analysis at the nanometer scale. Here we present application of a modern CL microscope in defect and homogeneity metrology, as well as failure analysis in semiconducting electronic materials

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