scholarly journals Hybrid Polymer/Metal Oxide Thin Films for High Performance, Flexible Transistors

Micromachines ◽  
2020 ◽  
Vol 11 (3) ◽  
pp. 264 ◽  
Author(s):  
Jae Jeong ◽  
Hye Hwang ◽  
Dalsu Choi ◽  
Byung Ma ◽  
Jaehan Jung ◽  
...  
Keyword(s):  
Electronic Properties ◽  
Polymer Nanocomposites ◽  
Flexible Electronics ◽  
High Performance ◽  
Electronic Materials ◽  
Polymer Nanocomposite ◽  
Metal Oxide Thin Films ◽  
Research Fields ◽  
Recent Developments ◽  
Polymer Metal

Metal oxides (MOs) have garnered significant attention in a variety of research fields, particularly in flexible electronics such as wearable devices, due to their superior electronic properties. Meanwhile, polymers exhibit excellent mechanical properties such as flexibility and durability, besides enabling economic solution-based fabrication. Therefore, MO/polymer nanocomposites are excellent electronic materials for use in flexible electronics owing to the confluence of the merits of their components. In this article, we review recent developments in the synthesis and fabrication techniques for MO/polymer nanocomposite-based flexible transistors. In particular, representative MO/polymer nanocomposites for flexible and transparent channel layers and gate dielectrics are introduced and their electronic properties—such as mobilities and dielectric constant—are presented. Finally, we highlight the advances in interface engineering and its influence on device electronics.

scholarly journals Recent Advances in the Synthesis of Polymer-Grafted Low-K and High-K Nanoparticles for Dielectric and Electronic Applications

Molecules ◽  
2021 ◽  
Vol 26 (10) ◽  
pp. 2942
Author(s):  
Bhausaheb V. Tawade ◽  
Ikeoluwa E. Apata ◽  
Nihar Pradhan ◽  
Alamgir Karim ◽  
Dharmaraj Raghavan
Keyword(s):  
Energy Density ◽  
Polymer Nanocomposites ◽  
High Performance ◽  
Breakdown Strength ◽  
Polymer Nanocomposite ◽  
High Energy ◽  
Polymer Chains ◽  
High Energy Density ◽  
Grafted Nanoparticles ◽  
Grafting From

The synthesis of polymer-grafted nanoparticles (PGNPs) or hairy nanoparticles (HNPs) by tethering of polymer chains to the surface of nanoparticles is an important technique to obtain nanostructured hybrid materials that have been widely used in the formulation of advanced polymer nanocomposites. Ceramic-based polymer nanocomposites integrate key attributes of polymer and ceramic nanomaterial to improve the dielectric properties such as breakdown strength, energy density and dielectric loss. This review describes the ”grafting from” and ”grafting to” approaches commonly adopted to graft polymer chains on NPs pertaining to nano-dielectrics. The article also covers various surface initiated controlled radical polymerization techniques, along with templated approaches for grafting of polymer chains onto SiO2, TiO2, BaTiO3, and Al2O3 nanomaterials. As a look towards applications, an outlook on high-performance polymer nanocomposite capacitors for the design of high energy density pulsed power thin-film capacitors is also presented.

scholarly journals Structural Batteries: A Review

Molecules ◽  
2021 ◽  
Vol 26 (8) ◽  
pp. 2203
Author(s):  
Federico Danzi ◽  
Rui Martim Salgado ◽  
Joana Espain Oliveira ◽  
Albertino Arteiro ◽  
Pedro Ponces Camanho ◽  
...  
Keyword(s):  
Composite Structures ◽  
High Performance ◽  
Lithium Ion ◽  
Material Models ◽  
Cathodic Materials ◽  
Research Fields ◽  
Recent Developments ◽  
Curing Cycle ◽  
Monolithic Solution ◽  
Alternative Configuration

Structural power composites stand out as a possible solution to the demands of the modern transportation system of more efficient and eco-friendly vehicles. Recent studies demonstrated the possibility to realize these components endowing high-performance composites with electrochemical properties. The aim of this paper is to present a systematic review of the recent developments on this more and more sensitive topic. Two main technologies will be covered here: (1) the integration of commercially available lithium-ion batteries in composite structures, and (2) the fabrication of carbon fiber-based multifunctional materials. The latter will be deeply analyzed, describing how the fibers and the polymeric matrices can be synergistically combined with ionic salts and cathodic materials to manufacture monolithic structural batteries. The main challenges faced by these emerging research fields are also addressed. Among them, the maximum allowable curing cycle for the embedded configuration and the realization that highly conductive structural electrolytes for the monolithic solution are noteworthy. This work also shows an overview of the multiphysics material models developed for these studies and provides a clue for a possible alternative configuration based on solid-state electrolytes.

scholarly journals Recent developments of advanced micro-supercapacitors: design, fabrication and applications

2020 ◽  
Vol 4 (1) ◽  
Author(s):  
Fan Bu ◽  
Weiwei Zhou ◽  
Yihan Xu ◽  
Yu Du ◽  
Cao Guan ◽  
...  
Keyword(s):  
Energy Storage ◽  
Flexible Electronics ◽  
High Performance ◽  
Electrode Materials ◽  
Rapid Development ◽  
Energy Storage Devices ◽  
Long Cycle Life ◽  
Recent Developments ◽  
On Chip ◽  
And Function

AbstractThe rapid development of wearable, highly integrated, and flexible electronics has stimulated great demand for on-chip and miniaturized energy storage devices. By virtue of their high power density and long cycle life, micro-supercapacitors (MSCs), especially those with interdigital structures, have attracted considerable attention. In recent years, tremendous theoretical and experimental explorations have been carried out on the structures and electrode materials of MSCs, aiming to obtain better mechanical and electrochemical properties. The high-performance MSCs can be used in many fields, such as energy storage and medical assistant examination. Here, this review focuses on the recent progress of advanced MSCs in fabrication strategies, structural design, electrode materials design and function, and integrated applications, where typical examples are highlighted and analyzed. Furthermore, the current challenges and future development directions of advanced MSCs are also discussed.

scholarly journals Towards conductive hydrogels in e-skins: a review on rational design and recent developments

RSC Advances ◽  
2021 ◽  
Vol 11 (54) ◽  
pp. 33835-33848
Author(s):  
Chujia Li
Keyword(s):  
Flexible Electronics ◽  
High Performance ◽  
Rational Design ◽  
Recent Progress ◽  
Recent Developments ◽  
Conductive Hydrogels

This review constructed a framework of methodologies to summarize the recent progress of high-performance conductive hydrogels for flexible electronics and further provide novel insights about rational design of the advanced hydrogels.

Electronic Materials and Structures for Multichip Modules

1992 ◽  
Vol 114 (2) ◽  
pp. 226-233 ◽  
Author(s):  
H. K. Charles
Keyword(s):  
Systematic Review ◽  
Electronic Properties ◽  
High Performance ◽  
Electronic Materials ◽  
Electronic Devices ◽  
High Density ◽  
Multichip Module ◽  
Multichip Modules ◽  
New Materials ◽  
Potential Impact

Multichip modules are rapidly becoming a major thrust in electronic packaging technology. Because of the high density and high performance nature of the electronic devices packaged in multichip modules, stringent new demands are being placed on materials, interconnect, and packaging structures. A systematic review of the materials and material structures for multichip modules is presented along with their associated physical and electronic properties. Particular emphasis is placed on new materials and their potential impact on multichip module packaging. Examples of their use in the fabrication of multichip modules and advanced chip-on-board systems are described.

Development of Electronic Substrates for Medical Device Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001527-001546 ◽  
Author(s):  
Frank D. Egitto ◽  
Rabindra N. Das ◽  
Francesco Marconi ◽  
Bill Wilson ◽  
Voya R. Markovich
Keyword(s):  
Flexible Electronics ◽  
High Speed ◽  
High Performance ◽  
Electronic Materials ◽  
High Reliability ◽  
Fine Line ◽  
Flexible Materials ◽  
Novel Approach ◽  
Micro Pillars ◽  
Electronic Substrates

There is a strong desire to develop advanced electronic substrates that can meet the growing demand for miniaturization, high-speed performance, and flexibility for medical devices. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present study, we are developing flexible packages for a variety of medical applications. Here we discuss several classes of flexible materials that can be used to form high-performance flexible packaging. In addition, copper thinner than 5 μm is routinely used, with copper layers as thin as 0.2 μm used as a seed layer for semi-additive approaches. The use of semi-additive circuitization facilitates manufacture of fine-line circuit features, and traces narrower than 12μm have been produced routinely. A smooth copper-polymer interface is ideal for high speed applications and for fine line etching. Selection of an appropriate material provides good copper adhesion to the base film. Flexible materials with 1 or 2 metal layers provide the smallest possible roll diameter for systems such as catheters. Compatibility with well developed, high performance electronic materials represents a key advantage of flexible electronics systems that are enabled by high density fine line structures rather than unusual materials. Electrical interconnection between the chip and package can be made by a number of means. Solder-coated Cu-micro pillars for a variety of finer pitch applications are being developed. Cu micro pillars are grown through the dielectric or silicon and subsequently coated with solder to produce finer pitch 3D-interconnects. The paper also describes a novel approach for the fabrication of flexible electronics on PDMS substrates. The paper discusses the fabrication of PDMS substrates using different circuit patterns and geometries. Rozalia/Ron ok move from 2.5/3D to FC/WLP 12-21-11.

Microstructure of sputter deposited Ni-Sb ohmic contacts on GaAs

1989 ◽  
Vol 47 ◽  
pp. 450-451
Author(s):  
S. Yegnasubramanian ◽  
V.C. Kannan ◽  
R. Dutto ◽  
P.J. Sakach
Keyword(s):  
High Performance ◽  
Ohmic Contacts ◽  
Surface Defects ◽  
Pure Metal ◽  
Device Fabrication ◽  
Native Oxide ◽  
Metal Thin Films ◽  
Recent Developments ◽  
Different Temperatures ◽  
Sputter Deposited

Recent developments in the fabrication of high performance GaAs devices impose crucial requirements of low resistance ohmic contacts with excellent contact properties such as, thermal stability, contact resistivity, contact depth, Schottky barrier height etc. The nature of the interface plays an important role in the stability of the contacts due to problems associated with interdiffusion and compound formation at the interface during device fabrication. Contacts of pure metal thin films on GaAs are not desirable due to the presence of the native oxide and surface defects at the interface. Nickel has been used as a contact metal on GaAs and has been found to be reactive at low temperatures. Formation Of Ni2 GaAs at 200 - 350C is reported and is found to grow epitaxially on (001) and on (111) GaAs, but is shown to be unstable at 450C. This paper reports the investigations carried out to understand the microstructure, nature of the interface and composition of sputter deposited and annealed (at different temperatures) Ni-Sb ohmic contacts on GaAs by TEM. Attempts were made to correlate the electrical properties of the films such as the sheet resistance and contact resistance, with the microstructure. The observations are corroborated by Scanning Auger Microprobe (SAM) investigations.

What Can Digitization Do For Formulated Product Innovation and Development

2020 ◽  
Author(s):  
James McDonagh ◽  
William Swope ◽  
Richard L. Anderson ◽  
Michael Johnston ◽  
David J. Bray
Keyword(s):  
High Performance ◽  
Quality Data ◽  
High Quality Data ◽  
Base Level ◽  
Hybrid Approaches ◽  
Digital Ecosystem ◽  
Recent Developments ◽  
Chemical Simulation ◽  
High Level ◽  
Physical And Chemical

Digitization offers significant opportunities for the formulated product industry to transform the way it works and develop new methods of business. R&D is one area of operation that is challenging to take advantage of these technologies due to its high level of domain specialisation and creativity but the benefits could be significant. Recent developments of base level technologies such as artificial intelligence (AI)/machine learning (ML), robotics and high performance computing (HPC), to name a few, present disruptive and transformative technologies which could offer new insights, discovery methods and enhanced chemical control when combined in a digital ecosystem of connectivity, distributive services and decentralisation. At the fundamental level, research in these technologies has shown that new physical and chemical insights can be gained, which in turn can augment experimental R&D approaches through physics-based chemical simulation, data driven models and hybrid approaches. In all of these cases, high quality data is required to build and validate models in addition to the skills and expertise to exploit such methods. In this article we give an overview of some of the digital technology demonstrators we have developed for formulated product R&D. We discuss the challenges in building and deploying these demonstrators.<br>

Double-network hydrogel with adjustable surface morphology and multifunctional integration for flexible strain sensors

Soft Matter ◽  
2021 ◽  
Author(s):  
Yang Yu ◽  
Fengjin Xie ◽  
Xinpei Gao ◽  
Liqiang Zheng
Keyword(s):  
Surface Morphology ◽  
Flexible Electronics ◽  
High Performance ◽  
Strain Sensors ◽  
Next Generation ◽  
Double Network ◽  
Conductive Hydrogels

The next generation of high-performance flexible electronics has put forward new demands to the development of ionic conductive hydrogels. In recent years, many efforts have been made toward developing double-network...

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