Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

1994 ◽  
Vol 116 (2) ◽  
pp. 83-88 ◽  
Author(s):  
R. K. Govila ◽  
E. Jih ◽  
Y.-H. Pao ◽  
C. Larner
Keyword(s):  
Stress Concentration ◽  
Fatigue Damage ◽  
Thermal Fatigue ◽  
Critical Stress ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Modeling Analysis ◽  
Leadless Chip Resistors

Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C in order to induce thermal fatigue failure/damage. The test units were subjected to a maximum of 250 thermal cycles. Solder joints in both types of LCRs were examined in scanning electron microscope and a relative comparison of the extent of fatigue damage is presented. The failure mechanism is associated with cracking in the eutectic compostion Sn/Pb solder initiated at the stress concentration sites. A nonlinear, time-dependent finite element modeling analysis has been performed to determine critical stress concentration sites in the solder joint. Key parameters leading to the initiation of solder damage are identified, and recommendations are made to improve the design in terms of solder configuration such as the radius of corner of the alumina substrate and the standoff height.

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

2009 ◽  
Vol 38 (6) ◽  
pp. 884-895 ◽  
Author(s):  
E.H. Wong ◽  
S.K.W. Seah ◽  
C.S. Selvanayagam ◽  
R. Rajoo ◽  
W.D. van Driel ◽  
...  
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Drop Tests ◽  
Bend Tests ◽  
Board Level

Thermal Fatigue Analysis of PBGA Solder Joints With the Consideration of Damage Evolution

2000 ◽  
Author(s):  
Shi-Wei Ricky Lee ◽  
Keith Newman ◽  
Livia Hu
Keyword(s):  
Thermal Fatigue ◽  
Life Prediction ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Hysteresis Loops ◽  
Fatigue Analysis ◽  
Circuit Board ◽  
Element Analysis ◽  
Pcb Assembly ◽  
Plastic Ball

Abstract This paper presents a computational thermal fatigue analysis for the life prediction of solder joints in a plastic ball grid array-printed circuit board (PBGA-PCB) assembly. The PBGA has a full grid array of 256 solder balls with 1.0 mm ball pitch. The PCB is a 4-layer FR-4 laminate with a thickness of 1.57 mm (62 mils). The assembly is subjected to −40∼125°C thermal cycling (one-hour cycle). Finite element analysis is performed to obtain the creep hysteresis loops. Based on a previously developed model, the evolution of damage is considered in the life prediction of solder joints. Besides, PCBs with various thicknesses (40 mils and 20 mils) are investigated. The results from different cases are compared and discussed.

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