Automatic inspection of solder joints on printed circuit board

1990 ◽  
Author(s):  
De-Chen Zhan ◽  
Jing-Chun Chen ◽  
Zhong-Rong Li
Keyword(s):  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Automatic Inspection ◽  
Printed Circuit

High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies

2009 ◽  
Vol 38 (6) ◽  
pp. 884-895 ◽  
Author(s):  
E.H. Wong ◽  
S.K.W. Seah ◽  
C.S. Selvanayagam ◽  
R. Rajoo ◽  
W.D. van Driel ◽  
...  
Keyword(s):  
High Speed ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Drop Tests ◽  
Bend Tests ◽  
Board Level

An Automatic Inspection System for Chip Electronic Parts on a Printed Circuit Board

CIRP Annals ◽  
1987 ◽  
Vol 36 (1) ◽  
pp. 399-402 ◽  
Author(s):  
Tadanori Komatsu ◽  
Shinichi Uno ◽  
Mitsuji Inoue ◽  
Shingo Sekiguchi ◽  
Akira Kobayashi
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Inspection System ◽  
Automatic Inspection ◽  
Printed Circuit ◽  
Electronic Parts

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

1994 ◽  
Vol 116 (2) ◽  
pp. 83-88 ◽  
Author(s):  
R. K. Govila ◽  
E. Jih ◽  
Y.-H. Pao ◽  
C. Larner
Keyword(s):  
Stress Concentration ◽  
Fatigue Damage ◽  
Thermal Fatigue ◽  
Critical Stress ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Circuit Board ◽  
Printed Circuit ◽  
Modeling Analysis ◽  
Leadless Chip Resistors

Leadless chip resistors (LCR) made by two different manufacturers and surface mounted on glass/epoxy printed circuit board (PCB) were subjected to thermal cycling between −55°C to 125°C in order to induce thermal fatigue failure/damage. The test units were subjected to a maximum of 250 thermal cycles. Solder joints in both types of LCRs were examined in scanning electron microscope and a relative comparison of the extent of fatigue damage is presented. The failure mechanism is associated with cracking in the eutectic compostion Sn/Pb solder initiated at the stress concentration sites. A nonlinear, time-dependent finite element modeling analysis has been performed to determine critical stress concentration sites in the solder joint. Key parameters leading to the initiation of solder damage are identified, and recommendations are made to improve the design in terms of solder configuration such as the radius of corner of the alumina substrate and the standoff height.

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