Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

2002 ◽  
Vol 124 (4) ◽  
pp. 340-344 ◽  
Author(s):  
Keith B. Bowman ◽  
David H. Mollenhauer

As two dissimilar materials are bonded or cocured at elevated temperatures, residual stresses result upon cooling the layered material system to room temperature. It is well known that the free edges of composite laminates experience interlaminar stresses during applied mechanical or thermal loading. These stresses are significant and must be understood. Current experimental methods are not capable of determining the residual stresses along free edges where failure is likely to initiate. This paper describes the initial findings of a novel experimental technique that uses moire´ interferometry and material removal to determine the residual stress distribution resulting from elevated temperature processing at the free edges of layered materials.  

1996 ◽  
Vol 445 ◽  
Author(s):  
Xiang Dai ◽  
Connie Kim ◽  
Ralf Willecke ◽  
Paul S. Ho

AbstractAn experimental technique of environmental moiré interferometry has been developed for in‐situ monitoring and analysis of thermomechanical deformation of microelectronics packages subjected to thermal loading under a controlled atmosphere. Coupled with fractional fringe analysis and digital image processing, the environmental moiré interferometry technique achieves accurate and realistic deformation monitoring with high sensitivity and excellent spatial resolution. It has been applied to investigate the thermomechanical deformations induced by thermal loading in an underfilled flip‐chip‐on‐board packaging. The effects of temperature change in the range of 102 °C to 22 °C are analyzed for underfill and solder bumps. In addition, shear deformation and shear strains across the solder bumps are determined as a function of temperature. The experimental results are compared with the results of a finite element analysis for modeling verification. Good agreement between the modeling results and experimental measurements has been found in the overall displacement fields. Through this study, the role of underfill in the thermomechanical deformation of the underfilled flip‐chip package is determined.


Author(s):  
XiaoBo Zhu ◽  
YongBing Li ◽  
GuanLong Chen ◽  
Pei-Chung Wang

The bonding of dissimilar materials is of primary importance to the automotive industry as it enables designers the freedom to choose from a wide variety of low density materials such as aluminum and magnesium. However, when two dissimilar materials (e.g., aluminum-to-steel) are bonded by curing at elevated temperatures, residual stresses result upon cooling the layered material system to room temperature. Problems such as distortion and fracture of adhesive often emerge in bonding of these dissimilar materials for automotive applications. In this study, the transient distortion of riveted and rivet-bonded aluminum AA6061-T6-to-steels during the curing process was investigated using the photographic method. The influences of temperature, adhesive properties, adherend thickness, adherend strength, and the presence of constraints on the transient distortion and adhesive fracture were evaluated. The peak curing temperature was found to play the most important role in distortion and adhesive fracture, followed by the influence of adherends thickness. In contrast, the other parameters studied such as the adhesive strength, constraints' type, and adherend strength produced a limited effect on distortion. The results provide useful information about vehicle body structure's design in reducing the curing induced distortion.


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