Solder Ball Connect (SBC) assemblies under thermal loading: I. Deformation measurement via moiré interferometry, and its interpretation

1993 ◽  
Vol 37 (5) ◽  
pp. 635-648 ◽  
Author(s):  
Y. Guo ◽  
C. K. Lim ◽  
W. T. Chen ◽  
C. G. Woychik
Keyword(s):  
Solder Ball ◽  
Thermal Loading ◽  
Moiré Interferometry ◽  
Deformation Measurement ◽  
Moire Interferometry

In‐Situ Mapping and Modeling Verification of Thermomechanical Deformation in Underfilled Flip‐Chip Packaging Using Moiré Interferometry

1996 ◽  
Vol 445 ◽  
Author(s):  
Xiang Dai ◽  
Connie Kim ◽  
Ralf Willecke ◽  
Paul S. Ho
Keyword(s):  
Flip Chip ◽  
Thermal Loading ◽  
Deformation Monitoring ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Fringe Analysis ◽  
Element Analysis ◽  
Solder Bumps ◽  
Thermomechanical Deformation

AbstractAn experimental technique of environmental moiré interferometry has been developed for in‐situ monitoring and analysis of thermomechanical deformation of microelectronics packages subjected to thermal loading under a controlled atmosphere. Coupled with fractional fringe analysis and digital image processing, the environmental moiré interferometry technique achieves accurate and realistic deformation monitoring with high sensitivity and excellent spatial resolution. It has been applied to investigate the thermomechanical deformations induced by thermal loading in an underfilled flip‐chip‐on‐board packaging. The effects of temperature change in the range of 102 °C to 22 °C are analyzed for underfill and solder bumps. In addition, shear deformation and shear strains across the solder bumps are determined as a function of temperature. The experimental results are compared with the results of a finite element analysis for modeling verification. Good agreement between the modeling results and experimental measurements has been found in the overall displacement fields. Through this study, the role of underfill in the thermomechanical deformation of the underfilled flip‐chip package is determined.

A Study of the Deformation Measurement of 3D Displacement Field

2005 ◽  
Vol 295-296 ◽  
pp. 313-318
Author(s):  
S.R. Lee ◽  
Z.S. Luo ◽  
H.S. Chiou ◽  
B.G. Wang ◽  
L.S. Liu
Keyword(s):  
Displacement Field ◽  
Incident Angle ◽  
Vertical Direction ◽  
Moiré Interferometry ◽  
Deformation Measurement ◽  
Measuring Error ◽  
Moire Interferometry ◽  
First Order ◽  
Out Of Plane ◽  
Plane Displacement

With the development of modern engineering such as micro-electro-mechanical system (MEMS) and new material, the deformation measurement of 3D displacement field is required. Moiré interferometry has become common for measuring the deformations of two-dimension in-plane displacement field. To solve the problem of 3D displacement field, a system for measuring the deformations of 3D displacement field is designed. By using this system, we can measure the out-of-plane displacement by appending a set of electronic speckle interference system based on Moiré interferometry system. Adjusting the incident angle of the incident light, the transmitting direction of the first order diffracted wave in a Moiré interferometry system is assigned to deviate with a small angle from the vertical direction of the specimen surface. Thus the first order diffracted wave is separated from the place of the appended interference field. The striated patterns of the deformations of 3D displacement field can be obtained at the same time. These striated patterns are recorded respectively by three CCD cameras and are stored and processed by a computer. The synchronous measuring method brings certain amount of measuring errors into the measurement of in-plane displacement. This measuring error is analyzed in theory. When real-time measurement is not required, this system can be changed into another system in which the in-plane and the out-of-plane displacement field are measured by time sharing to reduce the measuring errors. The theoretical derivation and a part of experimental results for verification are presented.

The dynamic deformation measurement of the high speed heated LY12 aluminium plate with moire interferometry

1998 ◽  
Vol 83 (1-3) ◽  
pp. 159-163 ◽  
Author(s):  
Xie Huimin ◽  
Wang Guotao ◽  
Dai Fulong ◽  
Zhang Guangjun ◽  
Liu Xingfu ◽  
...  
Keyword(s):  
High Speed ◽  
Dynamic Deformation ◽  
Moiré Interferometry ◽  
Deformation Measurement ◽  
Moire Interferometry

Experimental Investigation of Residual Stresses in Layered Materials Using Moire´ Interferometry

2002 ◽  
Vol 124 (4) ◽  
pp. 340-344 ◽  
Author(s):  
Keith B. Bowman ◽  
David H. Mollenhauer
Keyword(s):  
Residual Stresses ◽  
Thermal Loading ◽  
Elevated Temperatures ◽  
Dissimilar Materials ◽  
Layered Materials ◽  
Moiré Interferometry ◽  
Moire Interferometry ◽  
Material System ◽  
Interlaminar Stresses ◽  
Free Edges

As two dissimilar materials are bonded or cocured at elevated temperatures, residual stresses result upon cooling the layered material system to room temperature. It is well known that the free edges of composite laminates experience interlaminar stresses during applied mechanical or thermal loading. These stresses are significant and must be understood. Current experimental methods are not capable of determining the residual stresses along free edges where failure is likely to initiate. This paper describes the initial findings of a novel experimental technique that uses moire´ interferometry and material removal to determine the residual stress distribution resulting from elevated temperature processing at the free edges of layered materials.  

Thermal Deformation Measurement on Electronic Packaging by Moire Interferometry

2000 ◽  
Vol 2000 (0) ◽  
pp. 537-538
Author(s):  
Kazuo ARAKAWA ◽  
Mitsugu TODO ◽  
Shinji YAMADA ◽  
Yashuyuki MORITA ◽  
Kiyoshi TAKAHASHI
Keyword(s):  
Electronic Packaging ◽  
Thermal Deformation ◽  
Moiré Interferometry ◽  
Deformation Measurement ◽  
Moire Interferometry
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