scholarly journals Dynamic High-temperature Testing of an Iridium Alloy in Compression at High-strain Rates

Strain ◽  
2014 ◽  
Vol 50 (6) ◽  
pp. 539-546 ◽  
Author(s):  
B. Song ◽  
K. Nelson ◽  
R. Lipinski ◽  
J. Bignell ◽  
G. Ulrich ◽  
...  
Keyword(s):  
High Temperature ◽  
High Strain ◽  
Strain Rates ◽  
High Strain Rates ◽  
High Temperature Testing

Anand Viscoplasticity Model for the Effect of Aging on Mechanical Behavior of SAC305 Operating at High Strain Rate and High Temperature

2015 ◽  
Author(s):  
Pradeep Lall ◽  
Di Zhang ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
High Temperature ◽  
High Strain ◽  
Operating Temperature ◽  
Uniaxial Stress ◽  
Strain Rates ◽  
High Strain Rates ◽  
Plastic Properties ◽  
Long Term Storage ◽  
Wide Range ◽  
Operational Life

Portable products such as smartphones and tablets stay in the powered on condition for a majority of their operational life during which time the device internals are maintained at higher than ambient temperature. Thus, it would be expected for interconnects in portable products to be at a temperature high than room temperature when subjected to accidental drop or shock. Furthermore, electronics in missile-applications may be subjected to high strain rates after prolonged period of storage often at high temperature. Electronics systems including interconnects may experience high strain rates in the neighborhood of 1–100 per sec during operation at high temperature. However, the material properties of SAC305 leadfree solders at high strain rates and high operating temperatures are scarce after long-term storage. Furthermore, the solder interconnects in simulation of product drop are often modeled using elastic-plastic properties or linear elastic properties, neither of which accommodate the effect of operating temperature on the solder interconnect deformation at high operating temperature. SAC305 solders have been shown to demonstrate the significant degradation of mechanical properties including the tensile strength and the elastic modulus after exposure to high temperature storage for moderate periods of time. Previously, Anand’s viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components under thermo-mechanical deformation. Uniaxial stress-strain curves have been plotted over a wide range of strain rates (ε̇ = 10, 35, 50, 75 /sec) and temperatures (T = 25, 50, 75, 100, 125°C). Anand viscoplasticity constants have been calculated by non-linear fitting procedures. In addition, the accuracy of the extracted Anand constants has been evaluated by comparing the model prediction and experimental data.

scholarly journals Deformation mechanism of fine grained Mg–7Gd–5Y–1.2Nd–0.5Zr alloy under high temperature and high strain rates

2020 ◽  
Vol 8 (4) ◽  
pp. 1144-1153 ◽  
Author(s):  
Wanru Tang ◽  
Zheng Liu ◽  
Shimeng Liu ◽  
Le Zhou ◽  
Pingli Mao ◽  
...  
Keyword(s):  
High Temperature ◽  
Deformation Mechanism ◽  
High Strain ◽  
Strain Rates ◽  
High Strain Rates ◽  
Fine Grained

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

2017 ◽  
Author(s):  
Pradeep Lall ◽  
Di Zhang ◽  
Jeff Suhling ◽  
David Locker
Keyword(s):  
High Temperature ◽  
High Strain ◽  
Operating Temperature ◽  
Uniaxial Stress ◽  
Prolonged Storage ◽  
Strain Rates ◽  
High Strain Rates ◽  
Plastic Properties ◽  
Wide Range ◽  
Operational Life

Electronics in automotive underhood environments may be subjected to high temperatures in the neighborhood of 175°C while subjected to high strain rate mechanical loads of vibration. Portable products such as smartphones and tablets stay in the powered on condition for a majority of their operational life during which time the device internals are maintained at higher than ambient temperature. Thus, it would be expected for interconnects in portable products to be at a temperature high than room temperature when subjected to accidental drop or shock. Furthermore, electronics in missile-applications may be subjected to high strain rates after prolonged period of storage often at high temperature. Electronics systems including interconnects may experience high strain rates in the neighborhood of 1–100 per sec during operation at high temperature. However, the material properties of SAC305 leadfree solders at high strain rates and high operating temperatures are scarce after long-term storage. Furthermore, the solder interconnects in simulation of product drop are often modeled using elastic-plastic properties or linear elastic properties, neither of which accommodate the effect of operating temperature on the solder interconnect deformation at high operating temperature. SAC305 solders have been shown to demonstrate the significant degradation of mechanical properties including the tensile strength and the elastic modulus after exposure to high temperature storage for moderate periods of time. Previously, Anand’s viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components under thermo-mechanical deformation. Uniaxial stress-strain curves have been plotted over a wide range of strain rates (ε. = 10, 35, 50, 75 /sec) and temperatures (T = 25, 50, 75, 100, 125, 150, 175, 200°C). Anand viscoplasticity constants have been calculated by non-linear fitting procedures. In addition, the accuracy of the extracted Anand constants has been evaluated by comparing the model prediction and experimental data.

scholarly journals Dynamic High-Temperature Characterization of an Iridium Alloy in Compression at High Strain Rates

2014 ◽  
Author(s):  
Bo Song ◽  
Kevin Nelson ◽  
Ronald J. Lipinski ◽  
John L. Bignell ◽  
G. B. Ulrich ◽  
...  
Keyword(s):  
High Temperature ◽  
High Strain ◽  
Strain Rates ◽  
High Strain Rates

Characterization of Hardening Behavior at Ultra-High Strain Rate, Large Strain, and High Temperature

2016 ◽  
Vol 725 ◽  
pp. 138-142
Author(s):  
Ming Jun Piao ◽  
Hoon Huh ◽  
Ik Jin Lee
Keyword(s):  
High Temperature ◽  
High Strain ◽  
Large Strain ◽  
Thermal Softening ◽  
Ofhc Copper ◽  
Strain Rates ◽  
High Strain Rates ◽  
Softening Effect ◽  
Wide Range

This paper is concerned with the characterization of the OFHC copper flow stress at strain rates ranging from 10−3 s−1 to 106 s−1 considering the large strain and high temperature effects. Several uniaxial material tests with OFHC copper are performed at a wide range of strain rates from 10−3 s−1 to 103 s−1 by using a INSTRON 5583, a High Speed Material Testing Machine (HSMTM), and a tension split Hopkinson pressure bar. In order to consider the thermal softening effect, tensile tests at 25°C and 200°C are performed at strain rates of 10−3 s−1,101 s−1, and 102 s−1. A modified thermal softening model is considered for the accurate application of the thermal softening effect at high strain rates. The large strain behavior is challenged by using the swift power law model. The high strain rates behavior is fitted with the Lim–Huh model. The hardening curves are evaluated by comparing the final shape of the projectile from numerical simulation results with the Taylor impact tests.

Processing of High-Temperature Superconductors at High Strain Rates

2019 ◽  
Author(s):  
A. G. Mamalis ◽  
D. E. Manolakos ◽  
A. Szalay ◽  
G. Pantazopoulos
Keyword(s):  
High Temperature ◽  
High Strain ◽  
High Temperature Superconductors ◽  
Strain Rates ◽  
High Strain Rates
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