scholarly journals Dynamic High-Temperature Characterization of an Iridium Alloy in Compression at High Strain Rates

2014 ◽  
Author(s):  
Bo Song ◽  
Kevin Nelson ◽  
Ronald J. Lipinski ◽  
John L. Bignell ◽  
G. B. Ulrich ◽  
...  
2016 ◽  
Vol 725 ◽  
pp. 138-142
Author(s):  
Ming Jun Piao ◽  
Hoon Huh ◽  
Ik Jin Lee

This paper is concerned with the characterization of the OFHC copper flow stress at strain rates ranging from 10−3 s−1 to 106 s−1 considering the large strain and high temperature effects. Several uniaxial material tests with OFHC copper are performed at a wide range of strain rates from 10−3 s−1 to 103 s−1 by using a INSTRON 5583, a High Speed Material Testing Machine (HSMTM), and a tension split Hopkinson pressure bar. In order to consider the thermal softening effect, tensile tests at 25°C and 200°C are performed at strain rates of 10−3 s−1,101 s−1, and 102 s−1. A modified thermal softening model is considered for the accurate application of the thermal softening effect at high strain rates. The large strain behavior is challenged by using the swift power law model. The high strain rates behavior is fitted with the Lim–Huh model. The hardening curves are evaluated by comparing the final shape of the projectile from numerical simulation results with the Taylor impact tests.


Fuel ◽  
2020 ◽  
Vol 271 ◽  
pp. 117580
Author(s):  
Rima Zouagri ◽  
Abdelbaki Mameri ◽  
Fouzi Tabet ◽  
Amar Hadef

Author(s):  
Pradeep Lall ◽  
Di Zhang ◽  
Jeff Suhling ◽  
David Locker

Portable products such as smartphones and tablets stay in the powered on condition for a majority of their operational life during which time the device internals are maintained at higher than ambient temperature. Thus, it would be expected for interconnects in portable products to be at a temperature high than room temperature when subjected to accidental drop or shock. Furthermore, electronics in missile-applications may be subjected to high strain rates after prolonged period of storage often at high temperature. Electronics systems including interconnects may experience high strain rates in the neighborhood of 1–100 per sec during operation at high temperature. However, the material properties of SAC305 leadfree solders at high strain rates and high operating temperatures are scarce after long-term storage. Furthermore, the solder interconnects in simulation of product drop are often modeled using elastic-plastic properties or linear elastic properties, neither of which accommodate the effect of operating temperature on the solder interconnect deformation at high operating temperature. SAC305 solders have been shown to demonstrate the significant degradation of mechanical properties including the tensile strength and the elastic modulus after exposure to high temperature storage for moderate periods of time. Previously, Anand’s viscoplastic constitutive model has been widely used to describe the inelastic deformation behavior of solders in electronic components under thermo-mechanical deformation. Uniaxial stress-strain curves have been plotted over a wide range of strain rates (ε̇ = 10, 35, 50, 75 /sec) and temperatures (T = 25, 50, 75, 100, 125°C). Anand viscoplasticity constants have been calculated by non-linear fitting procedures. In addition, the accuracy of the extracted Anand constants has been evaluated by comparing the model prediction and experimental data.


Author(s):  
Matti Isakov ◽  
Jeremy Seidt ◽  
Kauko O¨stman ◽  
Amos Gilat ◽  
Veli-Tapani Kuokkala

In this study the mechanical properties of ferritic stainless steel EN 1.4521 (AISI 444) were characterized in uniaxial tension and simple shear. The specimen geometries were designed so that tests could be carried out both with a conventional uniaxial materials testing machine and at high strain rates with the Tensile Hopkinson Split Bar method. During the tests, specimen surface deformation was measured using a three dimensional digital image correlation technique based on a two-camera stereovision setup. This technique allowed direct measurement of the specimen gauge section deformation during the test. Test results indicate that the selected approach is suitable for large strain plastic deformation characterization of ductile metals. The stress-strain data obtained from the simple shear tests shows a correlation with the tensile test results according to the von Mises effective stress-strain criterion. Since necking is absent in shear, test data can be obtained at considerably higher plastic strains than in tension. However, the final fracture occurs under a complex loading mode due to the distortion of the specimen geometry and multiaxial loading introduced by the simple shear arrangement. Test results also show that reliable material data can be obtained at high strain rates.


2009 ◽  
Vol 20 (11) ◽  
pp. 115701 ◽  
Author(s):  
Bo Song ◽  
Kevin Connelly ◽  
John Korellis ◽  
Wei-Yang Lu ◽  
Bonnie R Antoun

2008 ◽  
Vol 45 (2) ◽  
pp. 493-497 ◽  
Author(s):  
K. S. Raju ◽  
S. Dandayudhapani ◽  
C. K. Thorbole

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