Cost of Ownership/Yield Enhancement of High Volume Immersion Lithography Using Topcoat-Less Resists

2011 ◽  
Vol 24 (2) ◽  
pp. 173-181 ◽  
Author(s):  
Hamid R. Khorram ◽  
Katsushi Nakano ◽  
Natsuko Sagawa ◽  
Tomoharu Fujiwara ◽  
Yasuhiro Iriuchijima ◽  
...  
Keyword(s):  
High Volume ◽  
Yield Enhancement ◽  
Immersion Lithography ◽  
Cost Of Ownership

Cost of Ownership/Yield Enhancement of High Volume Immersion Lithography Using Topcoat-Less Resists

2012 ◽  
Vol 25 (1) ◽  
pp. 63-71 ◽  
Author(s):  
Hamid R. Khorram ◽  
Katsushi Nakano ◽  
Natsuko Sagawa ◽  
Tomoharu Fujiwara ◽  
Yasuhiro Iriuchijima ◽  
...  
Keyword(s):  
High Volume ◽  
Yield Enhancement ◽  
Immersion Lithography ◽  
Cost Of Ownership

Topcoat-less resist approach for high volume production and yield enhancement of immersion lithography

2010 ◽  
Author(s):  
Katsushi Nakano ◽  
Rei Seki ◽  
Tadamasa Kawakubo ◽  
Yoshihiro Maruta ◽  
Toshiyuki Sekito ◽  
...  
Keyword(s):  
High Volume ◽  
Yield Enhancement ◽  
Immersion Lithography ◽  
High Volume Production ◽  
Volume Production

High hydrophobic topcoat approach for high volume production and yield enhancement of immersion lithography

2012 ◽  
Author(s):  
Natsuko Sagawa ◽  
Katsushi Nakano ◽  
Yuuki Ishii ◽  
Kazunori Kusabiraki ◽  
Motoyuki Shima
Keyword(s):  
High Volume ◽  
Yield Enhancement ◽  
Immersion Lithography ◽  
High Volume Production ◽  
Volume Production

High Volume Scan FA for Yield Enhancement at the 90nm Node

2010 ◽  
Author(s):  
Ryan Ross ◽  
Gil Garteiz
Keyword(s):  
Real Time ◽  
Yield Loss ◽  
High Volume ◽  
Time Frame ◽  
Yield Enhancement ◽  
Complex Activity ◽  
Yield Improvement ◽  
Short Time

Abstract Driving yield improvement activities to decrease baseline logic / scan yield fallout is often perceived as a challenging or complex activity. Much of this perception is based on yield or device teams historical interactions with the FA teams on these types of requests. This paper will present our methodology for generating a relatively high volume of scan FA results in a short time frame. This type of high volume scan FA enables real time FA paretos of what is causing scan / logic yield loss.

Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield

2014 ◽  
Vol 2014 (DPC) ◽  
pp. 001893-001912
Author(s):  
Thomas Uhrmann ◽  
Jürgen Burggraf ◽  
Harald Wiesbauer ◽  
Julian Bravin ◽  
Thorsten Matthias ◽  
...  
Keyword(s):  
Chemical Stability ◽  
High Volume ◽  
Bonding Process ◽  
Thickness Variation ◽  
Total Thickness ◽  
Process Yield ◽  
Cost Of Ownership ◽  
Temporary Bonding ◽  
Total Thickness Variation ◽  
Determining Factor

The ability to process thin wafers with thicknesses of 20-50um on front- and backside is a key technology for 3D stacked ICs (3Ds-IC). The most obvious reason for thin wafers is the reduced form factor, which is especially important for handheld consumer devices. However, probably even more important is that thinner wafers enable significant cost reduction for TSVs. Consensus has developed on the use of Temporary Bonding / Debonding Technology as the solution of choice for reliably handling thin wafers through backside processing steps. Temporary bonding and debonding comprises several processes for which yield is essential, as costly fully functional device wafers are being processed. The presented temporary bonding process consists of a bi-layer system, a release layer, Dow Corning WL-3001 Bonding Release and an adhesive layer, Dow Corning WL-4030 or WL-4050 Bonding Adhesive, processed on EVG's 850XT universal temporary bonding and debonding platform. Furthermore, this bi-layer spin coated material allows a room temperature bonding-debonding process increase process throughput which translates to low cost of ownership for high volume manufacturing. As such, this bi-layer approach features high chemical stability exposed to phosphoric acid, nitric acid, organic solvents and other chemicals familiar to TSV fabrication. Besides chemical stability this adhesive system provides also a high thermal stability when exposed to temperatures up to 300 °C. The temporary bonding process yield has a major impact on the overall Cost of Ownership (CoO). On the other hand, throughput of the individual process steps like spin coating, bonding, cure, debonding and cleaning processes is the second determining factor for improved CoO. In this presentation, we will present a study of the total thickness variation (TTV) and the evolution of TTV at different stages of the process. High resolution in-line metrology is an enabling tool to trace the bond integrity and yield throughout backside processing. As TTV is a major determining factor of the overall process yield, understanding its impact over the bonded wafer pair carries major importance. Especially, non-continuity of the edge region, showing an inherent edge bead after coating, and edge die yield will be focus of our contribution. Finally, our experimental results will be transferred into a cost of ownership model, discussing the pros and cons for high volume production.

Driving down CIGS cost of ownership with high volume thermal deposition systems

2010 ◽  
Author(s):  
John Patrin ◽  
Chad Conroy ◽  
Jian-gang Wen ◽  
Doug Brown ◽  
Ken Pfeiffer ◽  
...  
Keyword(s):  
High Volume ◽  
Thermal Deposition ◽  
Cost Of Ownership

Control and reduction of immersion defectivity for yield enhancement at high volume production

2009 ◽  
Author(s):  
Katsushi Nakano ◽  
Rei Seki ◽  
Toshiyuki Sekito ◽  
Masato Yoshida ◽  
Tomoharu Fujiwara ◽  
...  
Keyword(s):  
High Volume ◽  
Yield Enhancement ◽  
High Volume Production ◽  
Volume Production

Flexible 60-90W ArF light source for double patterning immersion lithography in high volume manufacturing

2009 ◽  
Author(s):  
Slava Rokitski ◽  
Toshi Ishihara ◽  
Rajeskar Rao ◽  
Rui Jiang ◽  
Daniel Riggs ◽  
...  
Keyword(s):  
Light Source ◽  
High Volume ◽  
Immersion Lithography ◽  
Double Patterning
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