Optimized Thermal Management From a Chip to a Heat Sink for High-Power GaN-Based Light-Emitting Diodes

2010 ◽  
Vol 57 (9) ◽  
pp. 2203-2207 ◽  
Author(s):  
Ray-Hua Horng ◽  
Jhih-Sin Hong ◽  
Yu-Li Tsai ◽  
Dong-Sing Wuu ◽  
Chih-Ming Chen ◽  
...  
2012 ◽  
Author(s):  
Ming-Seng Hsu ◽  
Jen-Wei Huang ◽  
Feng-Lin Shyu

2014 ◽  
Vol 11 (23) ◽  
pp. 20140965-20140965 ◽  
Author(s):  
Hui-Ming Qu ◽  
Xiao-Hui Yang ◽  
Qi Zheng ◽  
Xin-Tao Wang ◽  
Qian Chen

2012 ◽  
Vol 52 (5) ◽  
pp. 861-865 ◽  
Author(s):  
Bo-Hung Liou ◽  
Chih-Ming Chen ◽  
Ray-Hua Horng ◽  
Yi-Chen Chiang ◽  
Dong-Sing Wuu

2014 ◽  
Vol 54 (1) ◽  
pp. 124-130 ◽  
Author(s):  
Yuanyuan Chen ◽  
Bin Sun ◽  
Tianhe Ma ◽  
Xiaohan Sun

2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
Mehmet Kaya

The objective of this study was to develop suitable cooling systems for high-power multichip LEDs. To this end, three different active cooling systems were investigated to control the heat generated by the powering of high-power multichip LEDs in two different configurations (30 and 2 × 15 W). The following cooling systems were used in the study: an integrated multi-fin heat sink design with a fan, a cooling system with a thermoelectric cooler (TEC), and a heat pipe cooling device. According to the results, all three systems were observed to be sufficient for cooling high-power LEDs. Furthermore, it was observed that the integrated multifin heat sink design with a fan was the most efficient cooling system for a 30 W high-power multichip LED. The cooling system with a TEC and 46 W input power was the most efficient cooling system for 2 × 15 W high-power multichip LEDs.


2017 ◽  
Vol 122 ◽  
pp. 49-58 ◽  
Author(s):  
Jing Wang ◽  
Yi-xi Cai ◽  
Xiao-hua Li ◽  
Xu-dong Zhao ◽  
Jun Wang ◽  
...  

2019 ◽  
Vol 66 (11) ◽  
pp. 4790-4797
Author(s):  
Ning Wang ◽  
Cong Gao ◽  
Can Ding ◽  
Hong-Zhi Jia ◽  
Guo-Rong Sui ◽  
...  

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