Effects of Pad Array Dimensions and Misalignment Offsets on Optimal Fraction of Conductive Particles in Anisotropic Conductive Film Packages

2013 ◽  
Vol 13 (1) ◽  
pp. 301-309 ◽  
Author(s):  
Chao-Ming Lin
Keyword(s):  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Conductive Particles

Optimization of Heating Temperature History for Anisotropic Conductive Film Interconnection

2012 ◽  
Vol 134 (1) ◽  
Author(s):  
Yasutada Nakagawa ◽  
Ryohei Yokoyama
Keyword(s):  
Global Optimization ◽  
Heating Temperature ◽  
Optimization Method ◽  
Temperature History ◽  
Optimization Approach ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Optimization Parameters ◽  
Connection Length ◽  
Conductive Particles

Anisotropic conductive film (ACF) interconnection is used for mounting electronic components, because this method can decrease the mounting area and electric connection length, as well as the thermal stress in the connecting area. An ACF comprises thermosetting resin and conductive particles. The resin is heated and its curing rate and viscosity changes complexly with the heating temperature during the process. There are several requirements for the heating temperature history from the industrial viewpoint such as the reliability of adhesion and energy efficiency. These requirements are related to the curing rate and the viscosity of the resin. A global optimization method proposed for nonlinear programming problems is adopted to optimize the values of the curing reaction parameters and the temperature history. First, the values of parameters in the functions determining the curing rate and viscosity are identified, and the curing rate and viscosity calculated using the values of the parameters agree well with the experimental data. Then, several optimization examples clarify features of the optimum heating temperature history. It is possible to increase the final curing rate to ensure adhesion and to control the viscosity in the bubble-removing process. The period in which bubbles are removed can be changed by the setting of the optimization parameters. It is also possible to minimize the heat input and ensure the required final curing rate. These results clarify that the temperature history for ACF interconnection can be determined accurately by the presented global optimization approach.

Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on-Glass Packaging Using Anisotropic Conductive Film Bonding

2017 ◽  
Vol 886 ◽  
pp. 97-101 ◽  
Author(s):  
Chao Ming Lin ◽  
Yung Chuan Chiou ◽  
Chun Yi Chu
Keyword(s):  
Side View ◽  
Anisotropic Conductive Film ◽  
Conductive Particle ◽  
Field Of Vision ◽  
Fine Pitch ◽  
Conductive Film ◽  
Bonding Properties ◽  
Free Material ◽  
Conductive Particles ◽  
Glass Packaging

Anisotropic conductive film (ACF), is a lead-free material that is commonly used in fine-pitch interconnect manufacturing to make and maintain the electrical and mechanical connections between the micro-electrodes. A key issue about the circuit conductivity is the deformation, breakage, and number of conductive particles in the ACF packaging. For the field of vision, the Film-On-Glass (FOG) assembly on the glass-side is used to obtain excellent images in experimental observation. This paper utilizes the microscope technology to investigate the bonding properties of the conductive particles, and consider the electrical resistance effects after packaging. The results show the deformation shape, breakage type, and number of conductive particles will be quantitatively affect the electrical performances, and one can measure the area, diameter, and roundness of the deformed particles’ projection in the glass-side view to evaluate the ACF packaging quality.

Deformation of Conductive Particles and Reliability of Electronic Devices Using COG

2002 ◽  
Author(s):  
Takashi Akiguchi ◽  
Hideo Koguchi ◽  
M. Yamaguchi ◽  
A. Takayasu
Keyword(s):  
Material Properties ◽  
Electronic Devices ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Conductive Particles

Following the increasing adoption of TFT-type LCD modules in mobile and other equipment, COG (chip-on-glass) mounting is being increasingly employed instead of TCP (tape carrier package) mounting to make LCD modules smaller, thinner, and cheaper. Since the IC and LCD panel electrodes are bonded together by the conductive particles embedded in ACF (anisotropic conductive film), the bonding conditions depend substantially on the respective characteristics of the IC electrodes and the conductive particles in the ACF. We examined the effects of the arrangement, area and material properties of IC electrodes and of the profile and material properties of conductive ACF particles.

Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications

2005 ◽  
Author(s):  
Chunyan Yin ◽  
Hua Lu ◽  
Chris Bailey ◽  
Yan-Cheong Chan
Keyword(s):  
Contact Resistance ◽  
Flip Chip ◽  
Semiconductor Industry ◽  
Moisture Diffusion ◽  
Testing Time ◽  
Anisotropic Conductive Film ◽  
Conductive Films ◽  
Conductive Film ◽  
Moisture Effects ◽  
Conductive Particles

Anisotropic conductive film (ACF) which consists of an adhesive epoxy matrix and randomly distributed conductive particles are widely used as the connection material for electronic devices with high I/O counts. However, for the semiconductor industry the reliability of the ACF is still a major concern due to a lack of experimental reliability data. This paper reports the investigations into the moisture-induced failures in Flip-Chip-on-Flex interconnections with Anisotropic Conductive Films (ACFs). Both experimental and modeling methods were applied. In the experiments, the contact resistance was used as a quality indicator and was measured continuously during the accelerated tests (autoclave tests). The temperature, relative humidity and the pressure were set at 121°C, 100%RH, and 2atm respectively. The contact resistance of the ACF joints increased during the tests and nearly 25% of the joints were found to be open after 168 hours’ testing time. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. For a better understanding of the experimental results, 3-D Finite Element (FE) models were built and a macro-micro modeling method was used to determine the moisture diffusion and moisture-induced stresses inside the ACF joints. Modeling results are consistent with the findings in the experimental work.

Electron beam curing of acrylated epoxy resins for anisotropic conductive film application

2013 ◽  
Vol 547 ◽  
pp. 246-249 ◽  
Author(s):  
Tae gyu Shin ◽  
Inhyuk Lee ◽  
Jungmin Lee ◽  
Jinyoung Hwang ◽  
Hoeil Chung ◽  
...  
Keyword(s):  
Electron Beam ◽  
Epoxy Resins ◽  
Anisotropic Conductive Film ◽  
Conductive Film ◽  
Electron Beam Curing

Microwave model of anisotropic conductive film flip-chip interconnections for high frequency applications

1999 ◽  
Vol 22 (4) ◽  
pp. 575-581 ◽  
Author(s):  
Myung-Jin Yim ◽  
Woonghwan Ryu ◽  
Young-Doo Jeon ◽  
Junho Lee ◽  
Seungyoung Ahn ◽  
...  
Keyword(s):  
High Frequency ◽  
Flip Chip ◽  
Anisotropic Conductive Film ◽  
Conductive Film
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