Wafer Level Curing of Polymer Dielectrics with Variable Frequency Microwaves

2007 ◽  
Author(s):  
Robert L. Hubbard ◽  
Richard S. Garard
Keyword(s):  
Variable Frequency ◽  
Wafer Level ◽  
Polymer Dielectrics ◽  
Curing Of Polymer

Low Temperature Rapid Curing of Polymer Dielectrics on Metallized Organic Laminates by Variable Frequency Microwave Processing

2005 ◽  
Vol 2 (2) ◽  
pp. 142-154 ◽  
Author(s):  
Taehyun Sung ◽  
Sue A. Bidstrup Allen ◽  
Paul A. Kohl
Keyword(s):  
Dielectric Constant ◽  
Low Temperature ◽  
Elevated Temperatures ◽  
Similar Degree ◽  
Variable Frequency ◽  
Heating Rates ◽  
Residual Content ◽  
Polymer Dielectrics ◽  
Degree Of Curing ◽  
Curing Of Polymer

The curing of polymer dielectrics on organic laminates by variable frequency microwave (VFM) processing was studied. Polymer dielectrics, such as polyimides, normally require long cure times at elevated temperatures resulting in processing incompatibility with epoxy-based laminates due to the low thermal stability of the organic laminates. In this study, VFM processing was investigated as an alternative, low temperature technique for curing polyimide and benzycyclobutene (BCB) on metallized bismaleimide triazine/epoxy (BT) board. The VFM heating characteristics of the metallized (BT) boards were studied. The VFM heating rates of the BT boards strongly depended on the configuration, size, and shape of the copper patterns on the boards. The VFM curing of polyimide and BCB on the metallized BT boards was also performed. The curing condition was optimized to minimize board degradation. At the same board degradation level, the chemical, thermo-mechanical and electrical properties of the VFM cured film were compared with a film thermally cured using a conventional convection furnace. A higher degree of curing and lower dielectric constant was achieved for benzocyclobutene (BCB) films on BT boards processed using VFM curing than was obtained using conventional curing. VFM cured polyimide (PI 2611) showed a similar degree of curing and Young's modulus to conventionally cured PI 2611. However, the VFM cured PI 2611 showed a higher residual content solvent and a higher dielectric constant than conventionally cured PI 2611.

Study of Variable Frequency Induction Heating in Steel Making Process

2010 ◽  
Vol 130 (10) ◽  
pp. 1131-1138 ◽  
Author(s):  
Kazuhiko Fukutani ◽  
Kenji Umetsu ◽  
Takeo Itou ◽  
Takanori Isobe ◽  
Tadayuki Kitahara ◽  
...  
Keyword(s):  
Induction Heating ◽  
Variable Frequency ◽  
Steel Making

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

Silicon Migration Seal Wafer-Level Vacuum Encapsulation

2020 ◽  
Vol 140 (7) ◽  
pp. 165-169
Author(s):  
Yukio Suzuki ◽  
Dupuit Victor ◽  
Toshiya Kojima ◽  
Yoshiaki Kanamori ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level
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