2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)
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Fundamental analyses of fixture tooling design for flexible substrate assembly

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990400 ◽

2003 ◽

Author(s):

Ruijun Chen ◽

D.F. Baldwin

Keyword(s):

Flexible Substrate ◽

Tooling Design

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Could shock tests adequately replace drop tests?

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990367 ◽

2003 ◽

Cited By ~ 6

Author(s):

E. Suhir

Keyword(s):

Drop Tests

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Evaluation, optimization, and reliability of no-flow underfill process

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990389 ◽

2003 ◽

Cited By ~ 1

Author(s):

M. Colella ◽

D. Baldwin

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Liquid crystal polymers (LCP) for high performance SOP applications

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990395 ◽

2003 ◽

Cited By ~ 20

Author(s):

K. Brownlee ◽

S. Bhattacharya ◽

K. Shinotani ◽

C.P. Wong ◽

R. Tummala

Keyword(s):

Liquid Crystal ◽

High Performance ◽

Liquid Crystal Polymers

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Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990371 ◽

2003 ◽

Cited By ~ 8

Author(s):

S. Wiese ◽

S. Rzepka ◽

E. Meusel

Keyword(s):

Fem Simulations ◽

Plastic Behaviour ◽

Electronics Packages

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Experience gained manufacturing HDI PWBs

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990410 ◽

2003 ◽

Author(s):

T. Rapala-Virtanen

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A novel ultra high dielectric constant epoxy silver composite for embedded capacitor application

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990394 ◽

2003 ◽

Cited By ~ 8

Author(s):

Y. Rao ◽

C.P. Wong

Keyword(s):

Dielectric Constant ◽

High Dielectric Constant ◽

Embedded Capacitor ◽

High Dielectric ◽

Silver Composite

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Novel low-temperature processing of polymer dielectrics on organic substrates by variable frequency microwave processing

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990396 ◽

2003 ◽

Cited By ~ 1

Author(s):

R.V. Tanikella ◽

S.A. Bidstrup Allen ◽

P.A. Kohl

Keyword(s):

Low Temperature ◽

Microwave Processing ◽

Variable Frequency ◽

Organic Substrates ◽

Polymer Dielectrics ◽

Low Temperature Processing

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Evaluation of board level reliability of Pb-free PBGA solder joints

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990368 ◽

2003 ◽

Cited By ~ 1

Author(s):

S.-W.R. Lee ◽

B.H.W. Lui

Keyword(s):

Solder Joints ◽

Board Level ◽

Board Level Reliability

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Templated nanoporous spin-on glass for high density interconnect applications

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617) ◽

10.1109/isapm.2002.990360 ◽

2003 ◽

Author(s):

A.M. Padovani ◽

S.A. Bidstrup Allen ◽

P.A. Kohl

Keyword(s):

High Density

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2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Fundamental analyses of fixture tooling design for flexible substrate assembly

Could shock tests adequately replace drop tests?

Evaluation, optimization, and reliability of no-flow underfill process

Liquid crystal polymers (LCP) for high performance SOP applications

Time-independent plastic behaviour of solders and its effect on FEM simulations for electronics packages

Experience gained manufacturing HDI PWBs

A novel ultra high dielectric constant epoxy silver composite for embedded capacitor application

Novel low-temperature processing of polymer dielectrics on organic substrates by variable frequency microwave processing

Evaluation of board level reliability of Pb-free PBGA solder joints

Templated nanoporous spin-on glass for high density interconnect applications

2002 Proceedings. 8th International Advanced Packaging Materials Symposium (Cat. No.02TH8617)
Latest Publications