Microstructural-based physics of failure models to predict fatigue reliability

2006 ◽  
Author(s):  
R.G. Tryon ◽  
A. Dey ◽  
G. Krishnan ◽  
Yaowu Zhao
Keyword(s):  
Fatigue Reliability ◽  
Physics Of Failure ◽  
Failure Models

Microstructural-Based Physics of Failure Models to Predict Fatigue Reliability

2007 ◽  
Vol 50 (2) ◽  
pp. 73-84 ◽  
Author(s):  
Robert Tryon ◽  
Animesh Dey ◽  
Ganapathi Krishnan
Keyword(s):  
Fatigue Life ◽  
Grain Orientation ◽  
Real Life ◽  
Turbine Engines ◽  
External Loading ◽  
Fatigue Reliability ◽  
Material Models ◽  
Physics Of Failure ◽  
Failure Models ◽  
Crack Growth Model

The fatigue life of materials is strongly influenced by their microstructure. The scatter in fatigue life is caused by the scatter in grain size, grain orientation, and stresses induced in each grain of the material due to external loading. A novel microstructural fatigue crack growth model that accounts for real-life variability in the material is presented in this study. Ti-6Al-4V, a common aerospace titanium alloy used in numerous turbine engines, has been studied to predict its fatigue life and scatter at load ratios of 0.1 and -1.0. The predictions have been compared with experimental data. Results indicate that the microstructural material models accurately predict the behavior of Ti-6Al-4V.

Comparative Reliability Prediction Using Physics of Failure Models

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000189-000195
Author(s):  
Milton Watts ◽  
K. Rob Harker
Keyword(s):  
Circuit Complexity ◽  
High Impact ◽  
Reliability Prediction ◽  
Life Test ◽  
Physics Of Failure ◽  
Failure Models ◽  
The Individual ◽  
Aging Models ◽  
Device Test

Quartzdyne Electronics has invested millions of device test hours in life testing of circuits in both powered and un-powered tests. In addition to time at temperature, these tests include thermal cycling and high impact drop testing. Recent projects have required the use of larger packages and components as we have expanded the variety of circuits that we build. It is desirable to predict the effects of these changes on long-term reliability before investing in tooling. In this study we will compare a new design which contains these larger components to the simpler, smaller designs for which we have extensive life-test data. Using a physics-of-failure approach, component mounting stresses will be analyzed using finite element modeling. These results will be compared to pre and post-aging shear strengths of actual components of varying sizes. Aging models will then be developed to predict the reliability of the new design based on the comparative stress margins of the individual components coupled with circuit complexity. Once validated, the aging models will enable reliability prediction and trade-off analysis for future designs.

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

1995 ◽  
Vol 117 (2) ◽  
pp. 141-146 ◽  
Author(s):  
A. Dasgupta ◽  
V. Ramappan
Keyword(s):  
Sensitivity Analysis ◽  
Mechanical Design ◽  
Finite Element Models ◽  
Electronic Packages ◽  
Simulation Studies ◽  
Physics Of Failure ◽  
Manufacturing Quality ◽  
Solder Reflow ◽  
Failure Models

Techniques based on physics-of-failure principles are fairly well established for mechanical design of electronic packages. This paper provides an example where such techniques can also be exploited to develop guidelines for assessment of manufacturing quality and its impact on reliability. As a case study, this study examines the influence of plating waviness in vias and Plated Through Holes (PTH), on reliability during solder reflow cycles and during subsequent operational thermal cycling. The stress analysis is performed with elastic-plastic finite element models which are seeded with various levels of plating waviness defects. Sensitivity analysis is done with factorial parametric simulation studies based on Design of Experiment (DOE) methods. Buckling and fatigue failure models are used to establish inspection criteria for acceptable thresholds of plating waviness.

Research Progress on Electrostatic Discharge Failure Models in Semiconductor Materials

2012 ◽  
Vol 548 ◽  
pp. 527-531 ◽  
Author(s):  
Xiao Yu Liu ◽  
Jiang Shao ◽  
Xing Hao Wang ◽  
Feng Ming Lu
Keyword(s):  
Integrated Circuits ◽  
Failure Modes ◽  
Electrostatic Discharge ◽  
Failure Mechanisms ◽  
Research Progress ◽  
Failure Model ◽  
High Current ◽  
Operation Condition ◽  
Physics Of Failure ◽  
Failure Models

Electrostatic discharge (ESD) is a single, fast, high current transfer of electrostatic charge between two objects at different electrostatic potentials, and it is one of the most important failure mechanisms in integrated circuits due to their complex operation condition. The modes, mechanism, and models of the ESD failure were discussed. Firstly failure modes of ESD were classified and the failure mechanisms were described. Then three failure models including Wunsch and Bell model, Speakman model and Tasca model were summarized. The differences of the assumption and application area of these models were discussed in detail later. At last, suggestions for future studying ESD physics of failure model were proposed.

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Klas Brinkfeldt ◽  
Göran Wetter ◽  
Andreas Lövberg ◽  
Per-Erik Tegehall ◽  
Dag Andersson ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Piezoelectric Sensors ◽  
Sensor Data ◽  
Reflow Soldering ◽  
Physics Of Failure ◽  
Sensor Material ◽  
Printed Circuit ◽  
Soldering Process ◽  
Failure Models

The increasing complexity of electronics in systems used in safety critical applications, such as self-driving vehicles, requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and health management (PHM) that uses a combination of data-driven and physics-of-failure models is a promising approach to avoid unexpected failures in the field. However, to enable PHM based partly on physics-of-failure models, sensor data that measure the relevant environment loads to which the electronics are subjected during its mission life are required. In this work, the feasibility to manufacture and use integrated sensors in the inner layers of a printed circuit board (PCB) as mission load indicators measuring impacts and vibrations has been investigated. A four-layered PCB was designed in which piezoelectric sensors based on polyvinylidenefluoride-co-trifluoroethylene (PVDF-TrFE) were printed on one of the laminate layers before the lamination process. Manufacturing of the PCB was followed by the assembly of components consisting of ball grid arrays (BGAs) and quad flat no-leads (QFN) packages in a standard production reflow soldering process. Tests to ensure that the functionality of the sensor material was unaffected by the soldering process were performed. Results showed a yield of approximately 30% of the sensors after the reflow soldering process. The yield was also dependent on sensor placement and possibly shape. Optimization of the sensor design and placement is expected to bring the yield to 50% or better. The sensors responded as expected to impact tests. Delamination areas were present in the test PCBs, which requires further investigation. The delamination does not seem to be due to the presence of embedded sensors alone but rather the result of a combination of several factors. The conclusion of this work is that it is feasible to embed piezoelectric sensors in the layers of a PCB.

Degradation Modeling and Reliability Assessment of Capacitors

2019 ◽  
Author(s):  
Anunay Gupta ◽  
Om Prakash Yadav ◽  
Arighna Roy ◽  
Douglas DeVoto ◽  
Joshua Major
Keyword(s):  
Stochastic Process ◽  
Reliability Assessment ◽  
Likelihood Estimation ◽  
Model Parameters ◽  
Degradation Behavior ◽  
Temporal Uncertainty ◽  
Extrinsic Factors ◽  
Physics Of Failure ◽  
Degradation Modeling ◽  
Failure Models

Abstract The degradation of capacitors under accelerated stress conditions occur in a monotonic and non-linear fashion. Several efforts have been made to model the degradation behavior of capacitor considering either physics-of-failure models or statistical models and subsequently estimate its reliability and lifetime parameters. But most of these models fail to reflect the physical properties of the degradation path, which varies according to several intrinsic and extrinsic factors. These factors introduce random and temporal uncertainty among the population of capacitors. The gamma stochastic process can model both type of uncertainties among the population of capacitors. In this paper, we model the capacitor degradation by non-homogeneous gamma stochastic process in which both the model parameters (shape and scale) are dependent on stress variables. The model parameters are estimated using the maximum likelihood estimation approach.

Physics-of-failure models of erosion wear in electrohydraulic servovalve, and erosion wear life prediction method

Mechatronics ◽  
2013 ◽  
Vol 23 (8) ◽  
pp. 1202-1214 ◽  
Author(s):  
Xin Fang ◽  
Jinyong Yao ◽  
Xizhong Yin ◽  
Xun Chen ◽  
Chunhua Zhang
Keyword(s):  
Life Prediction ◽  
Prediction Method ◽  
Erosion Wear ◽  
Physics Of Failure ◽  
Wear Life ◽  
Failure Models
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