Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

2019 ◽  
Vol 141 (3) ◽  
Author(s):  
Klas Brinkfeldt ◽  
Göran Wetter ◽  
Andreas Lövberg ◽  
Per-Erik Tegehall ◽  
Dag Andersson ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Piezoelectric Sensors ◽  
Sensor Data ◽  
Reflow Soldering ◽  
Physics Of Failure ◽  
Sensor Material ◽  
Printed Circuit ◽  
Soldering Process ◽  
Failure Models

The increasing complexity of electronics in systems used in safety critical applications, such as self-driving vehicles, requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and health management (PHM) that uses a combination of data-driven and physics-of-failure models is a promising approach to avoid unexpected failures in the field. However, to enable PHM based partly on physics-of-failure models, sensor data that measure the relevant environment loads to which the electronics are subjected during its mission life are required. In this work, the feasibility to manufacture and use integrated sensors in the inner layers of a printed circuit board (PCB) as mission load indicators measuring impacts and vibrations has been investigated. A four-layered PCB was designed in which piezoelectric sensors based on polyvinylidenefluoride-co-trifluoroethylene (PVDF-TrFE) were printed on one of the laminate layers before the lamination process. Manufacturing of the PCB was followed by the assembly of components consisting of ball grid arrays (BGAs) and quad flat no-leads (QFN) packages in a standard production reflow soldering process. Tests to ensure that the functionality of the sensor material was unaffected by the soldering process were performed. Results showed a yield of approximately 30% of the sensors after the reflow soldering process. The yield was also dependent on sensor placement and possibly shape. Optimization of the sensor design and placement is expected to bring the yield to 50% or better. The sensors responded as expected to impact tests. Delamination areas were present in the test PCBs, which requires further investigation. The delamination does not seem to be due to the presence of embedded sensors alone but rather the result of a combination of several factors. The conclusion of this work is that it is feasible to embed piezoelectric sensors in the layers of a PCB.

Feasibility of PCB-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

2018 ◽  
Author(s):  
Klas Brinkfeldt ◽  
Göran Wetter ◽  
Andreas Lövberg ◽  
Per-Erik Tegehall ◽  
Dag Andersson ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Health Management ◽  
Circuit Board ◽  
Piezoelectric Sensors ◽  
Sensor Data ◽  
Reflow Soldering ◽  
Physics Of Failure ◽  
Sensor Material ◽  
Soldering Process ◽  
Failure Models

The increasing complexity of electronics in systems used in safety critical applications, such as for example self-driving vehicles requires new methods to assure the hardware reliability of the electronic assemblies. Prognostics and Health Management (PHM) that uses a combination of data-driven and Physics-of-Failure models is a promising approach to avoid unexpected failures in the field. However, to enable PHM based partly on Physics-of-Failure models, sensor data that measures the relevant environment loads to which the electronics is subjected during its mission life are required. In this work, the feasibility to manufacture and use integrated sensors in the inner layers of a printed circuit board (PCB) as mission load indicators measuring impacts and vibrations has been investigated. A four-layered PCB was designed in which piezoelectric sensors based on polyvinylidenefluoride-co-trifluoroethylene (PVDF-TrFE) were printed on one of the laminate layers before the lamination process. Manufacturing of the PCB was followed by the assembly of components consisting of BGAs and QFN packages in a standard production reflow soldering process. Tests to ensure that the functionality of the sensor material was unaffected by the soldering process were performed. Results showed a yield of approximately 30% of the sensors after the reflow soldering process. The yield was also dependent on sensor placement and possibly shape. Optimization of the sensor design and placement is expected to bring the yield to 50 % or better. The sensors responded as expected to impact tests. Delamination areas were present in the test PCBs, which requires further investigation. The delamination does not seem to be due to the presence of embedded sensors alone but rather the result of a combination of several factors. The conclusion of this work is that it is feasible to embed piezoelectric sensors in the layers of a PCB.

Development of an Automated Flexible Micro-Soldering Station

2017 ◽  
Author(s):  
Vinoth Venkatesan ◽  
David J. Cappelleri
Keyword(s):  
Flexible Manufacturing ◽  
Printed Circuit Board ◽  
Vision System ◽  
Circuit Board ◽  
System Calibration ◽  
Printed Circuit ◽  
Soldering Process ◽  
Real Time Image ◽  
Motion Stage ◽  
Time Image

This paper describes a flexible automated soldering system to handle meso and micro-scale soldering operations. The system is guided by a vision system and consists of two micromanipulators, an XY motion stage, and a solder pen with an automatic solder feeder. One micromanipulator is used to hold and position the solder pen and attached solder feeder in the workspace; the second micromanipulator is used to hold and position the wire(s) to be soldered on to a printed circuit board (PCB). After hardware and vision system calibration, the user can select point(s) from a real-time image of the workspace for the desired soldering operations to occur. The soldering process is then carried out automatically two different ways: 1. By servoing the XY motion stage with the PCB to position it under the soldering manipulator followed by the solder operation; or 2. By moving the soldering manipulator to the target soldering sites on the PCB that remain stationary. Experimental results for both scenarios are presented and discussed for soldering single and multiple wires at a time. This system provides a flexible manufacturing solution for operations that demand custom micro-soldering operations in a 2D plane.

The process modelling of the infra-red reflow soldering of printed circuit board assemblies

1992 ◽  
Vol 02 (01) ◽  
pp. 23-29 ◽  
Author(s):  
DAVID C. WHALLEY ◽  
ADEBAYOO OGUNJIMI ◽  
PAUL P. CONWAY ◽  
DAVID J. WILLIAMS
Keyword(s):  
Printed Circuit Board ◽  
Process Modelling ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Printed Circuit ◽  
Infra Red

Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering

2015 ◽  
Vol 27 (2) ◽  
pp. 61-68 ◽  
Author(s):  
Attila Geczy ◽  
Márta Fejos ◽  
László Tersztyánszky
Keyword(s):  
Efficient Method ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Automotive Electronics ◽  
Production Environment ◽  
Reflow Soldering ◽  
Content Type ◽  
Printed Circuit ◽  
Novel Approach ◽  
The Given

Purpose – This paper aims to reveal the causes and find an efficient method to compensate the shrinkage to reduce failure costs. Reflow-induced printed circuit board (PCB) shrinkage is inspected in automotive electronics production environment. The shrinkage of two-sided, large PCBs results in printing offset errors and consequently soldering failures on smaller components during the reflow soldering of the second PCB side. Design/methodology/approach – During the research, the investigations had to adapt to actual production in an electronics manufacturing plant. A measurement method was developed to approximate the overall shrinkage of the given product. With the shrinkage data, it is possible to perform an efficient compensation on the given stencil design in computer-aided manufacturing environment. Findings – It was found that even with the investigated lower-quality PCB materials, the compensation on the stencil significantly reduces the quantity of failures, offering an efficient method to improve the yield of the production. Research limitations/implications – Research was oriented by the confines of production (fixed PCB sources, given PCB materials, reflow process and production line), where an immediate solution is needed. Future investigations should be focussed on the PCB parameters (different epoxy types, glass-fibre reinforcements, etc.). Practical implications – The optimised production reduces overall failure costs. The stencil re-design and application is a fast and efficient way to immediately act against the shrinkage-induced failures. The method was successfully applied in automotive electronics production. Originality/value – The paper presents a novel approach on solving an emerging problem during reflow.

scholarly journals Investigations of Infrared Desktop Reflow Oven with FPCB Substrate during Reflow Soldering Process

Metals ◽  
2021 ◽  
Vol 11 (8) ◽  
pp. 1155
Author(s):  
Muhammad Iqbal Ahmad ◽  
Mohd Sharizal Abdul Aziz ◽  
Mohd Zulkifly Abdullah ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohammad Hafifi Hafiz Ishak ◽  
...  
Keyword(s):  
Temperature Distribution ◽  
Printed Circuit Board ◽  
Operating Conditions ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Soldering Process ◽  
Depth Study ◽  
Flexible Printed Circuit ◽  
Computer Based ◽  
Fan Speed

This paper presents the study of infrared (IR) reflow oven characteristics for suitable operating conditions of the flexible printed circuit board (FPCB) in the reflow soldering process. A computer-based model that imitates a real-time oven was developed with practical boundary conditions. Since the radiation effect is dominant in the reflow process, a discrete ordinate (DO) model was selected to simulate the effect. The experimental work acts as a benchmark and the reflow profile was set to follow the standards of JSTD-020E. The simulation of the model has a great consensus between the experimental data. It was found that the temperature distribution was inhomogeneous along with the phases. The FPCB surface also has a higher surface temperature than oven air during the operating reflow profile. An in-depth study using the simulation approach reveals that the temperature distribution of the desktop reflow oven is dependent on several factors, namely fan speed, FPCB position, and FPCB thickness. The rotational fan generates an unsteady flow that induces inhomogeneous temperature at different positions in the reflow oven cavity. The results are useful for studying further improvements to achieve temperature uniformity within the oven chamber.

scholarly journals Copper coin-embedded printed circuit board for heat dissipation: manufacture, thermal simulation and reliability

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 55-60 ◽  
Author(s):  
Yuanming Chen ◽  
Shouxu Wang ◽  
Xuemei He ◽  
Wei He ◽  
Vadim V. Silberschmidt ◽  
...  
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Printed Circuit Board ◽  
Thermal Simulation ◽  
Circuit Board ◽  
Reflow Soldering ◽  
Content Type ◽  
Printed Circuit ◽  
Flatness Control ◽  
Copper Coin

Purpose – The purpose of this paper is to form copper coin-embedded printed circuit board (PCB) for high heat dissipation. Design/methodology/approach – Manufacturing optimization of copper coin-embedded PCB involved in the design and treatment of copper coin, resin flush removal and flatness control. Thermal simulation was used to investigate the effect of copper coin on heat dissipation of PCB products. Lead-free reflow soldering and thrust tests were used to characterize the reliable performance of copper coin-embedded PCB. Findings – The copper coin-embedded PCB had good agreement with resin flush removal and flatness control. Thermal simulation results indicated that copper coin could significantly enhance the heat-dissipation rate by means of a direct contact with the high-power integrated circuit chip. The copper coin-embedded PCB exhibited a reliable structure capable of withstanding high-temperature reflow soldering and high thrust testing. Originality/value – The use of a copper coin-embedded PCB could lead to higher heat dissipation for the stable performance of high-power electronic components. The copper coin-embedded method could have important potential for improving the design for heat dissipation in the PCB industry.

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