Microwave processing techniques for high density interconnects and hybridization

2003 ◽  
Author(s):  
N. Budraa ◽  
Boon Ng ◽  
D. Wang ◽  
S. Ahsan ◽  
Yu Zhang ◽  
...  
Keyword(s):  
Microwave Processing ◽  
High Density ◽  
Processing Techniques

Microwave Processing and Sintering of PZT and PLZT Ceramics

1988 ◽  
Vol 124 ◽  
Author(s):  
W. B. Harrison ◽  
M. R. B. Hanson ◽  
B. G. Koepke
Keyword(s):  
Lead Titanate ◽  
Microwave Sintering ◽  
Ferroelectric Properties ◽  
Lead Zirconate ◽  
Microwave Processing ◽  
High Density ◽  
Pzt Ceramics ◽  
Conventional Sintering ◽  
Processing Techniques ◽  
Fast Firing

ABSTRACTMicrowave processing techniques were established for all of the thermal treatment steps necessary to prepare high density PZT and PLZT. The microstructure and ferroelectric properties of the microwave processed materials were compared to conventionally sintered and fast fired PZT. Unique high density, small grain size, PZT and PLZT were obtained by microwave sintering either conventionally or fully microwave processed powders. It was estimated that microwave sintering would use only five percent of the energy used by conventional sintering.The suitability of microwave processing for the production of two modifications (Sr and La) of lead zirconate - lead titanate (PZT) ceramics was investigated in this program. A commercial microwave oven was used to evaluate drying, calcining, binder burnoff, and sintering. These materials were then compared to those produced by fast-firing and conventional sintering methods.

Evaluation of the Conventional Versus Two Rapid Microwave Processing Techniques Using the Masson Trichrome Histochemical Methtod

2015 ◽  
Vol 4 (3) ◽  
pp. 1-15
Author(s):  
Tobias Choji ◽  
Samuel Ogenyi ◽  
Anthony Ngokere ◽  
Solomon Chollom ◽  
Kizito Jugu ◽  
...  
Keyword(s):  
Microwave Processing ◽  
Processing Techniques

Microwave Processing at the University of Florida

1994 ◽  
Vol 347 ◽  
Author(s):  
D. E. Clark ◽  
D. C. Folz ◽  
R. L. Schulz ◽  
Z. Fathi ◽  
A. D. Cozzi ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Physical And Mechanical Properties ◽  
Microwave Processing ◽  
Microwave Energy ◽  
Development Work ◽  
University Of Florida ◽  
Waste Remediation ◽  
Manufacturing Operations ◽  
Processing Techniques ◽  
The University

ABSTRACTMicrowave energy for processing materials is emerging as a vital manufacturing technology for the nineties and beyond. Research to date has shown significant advantages in several areas, including drying and sintering, joining, surface modification and waste remediation. Increased processing rates, improved physical and mechanical properties and, in some cases, reduced hazardous emissions have sparked the interest of many manufacturers in the ability to integrate microwave processing techniques into existing and future manufacturing operations. This presentation will provide an overview of the microwave processing research and development work in progress at the University of Florida.

scholarly journals Implementation of Novel Image Restoration Technique from High Density Impulse Noise through Adaptive Max-Min Filter

2019 ◽  
Vol 9 (2) ◽  
pp. 2326-2328
Keyword(s):  
Impulse Noise ◽  
Nonlinear Filter ◽  
High Density ◽  
Significant Feature ◽  
Salt And Pepper Noise ◽  
Image Processing Techniques ◽  
Restoration Technique ◽  
Processing Techniques ◽  
Salt And Pepper

Noise is ardent factor that reduces the quality of any system, disturbing the corresponding output. This is very noticeable especially in image processing techniques, wherein the image output is distorted to a very large extent. To reduce the effect of noise and to improve the quality of any image, it is mandatory to completely remove high density salt-and-pepper impulse noise. The salt-and –pepper impulse noise is a major hindrance that has to be eliminated by restoring the image using a specialized method that applies to all noise pixels. Involving edge protection and noise control, significant improves image quality compared to those restored by using just a nonlinear filter. The significant feature of the proposed idea is that removal of salt-and-pepper-noise as high as 95%.is obtained.

Laser-Based Area-Selective Processing Techniques for High-Density Interconnects

1989 ◽  
Vol 158 ◽  
Author(s):  
Y.S. Liu ◽  
H. S. Cole
Keyword(s):  
High Density ◽  
Direct Write ◽  
Selective Processing ◽  
Processing Techniques ◽  
Laser Direct Write

ABSTRACTThis paper reviews several laser-based area-selective processing techniques developed for high-density multichip interconnection applications. Key material and process requirements for the development of a viable laser-direct-write interconnect technique on polyimide are addressed.

Cerium-Doped Yttrium Aluminum Perovskite (Yap): Properties of Commercial Crystals

1994 ◽  
Vol 348 ◽  
Author(s):  
W. Peter Trower
Keyword(s):  
Physical Properties ◽  
Energy Resolution ◽  
Comparative Evaluation ◽  
Industrial Applications ◽  
High Density ◽  
Small Laboratory ◽  
Physical Origin ◽  
Yttrium Aluminum ◽  
Commercial Sources ◽  
Processing Techniques

ABSTRACTThe journey of YAP from interesting laboratory curiosity to a material with commercial possibilities has taken two full decades. The reported YAP properties which motivated this effort are its rapid (~ 27 ns) dominant (~ 97%) decay which results in negligible afterglow; high density (~ 5.55 g/cm3); brightness (~ 50% of NaI:Tl); energy resolution (~ 6% at 455 keV); physical ruggedness; and chemical nonreactivity. Lone among its draw backs as a practical scintillator is its emission which is centered in the UV (~ 350 nm). Three firms now offer YAP crystals of sufficient size and quality that industrial applications are becoming possible.To date, the physical properties of YAP have only been published on small laboratory samples. Here we report a comprehensive and comparative evaluation of physical properties of material from all known commercial sources. Further, we speculate on the physical origin of variations among samples. Finally, we attempt to predict what can ultimately be expected from YAP as further refinements in its processing techniques are perfected.

3D Passive Integrated Capacitors Towards Even Higher Integration

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001907-001930
Author(s):  
Sophie Gaborieau ◽  
Catherine Bunel ◽  
Franck Murray
Keyword(s):  
Development Program ◽  
High Density ◽  
Ceramic Technology ◽  
Advanced Technology ◽  
Fourth Generation ◽  
The Third ◽  
Low Profile ◽  
Metal Insulator Metal ◽  
High K Materials ◽  
Processing Techniques

IPDIA is involved in Silicon based 3D-IPD advanced technology. This very flexible technology is using standard processing techniques to integrate passive components such as inductors, resistors or capacitors into a silicon substrate. 3D high-density capacitor is at the forefront of IPDIA development program. First process generation with 25nF/mm2 and second generation reaching 80nF/mm2 have been in production for several years. The third generation with multiple metal-insulator-metal (MIM) layer stacks in the pores is reaching 250nF/mm2 and is being qualified now. Intrinsic low parasitic elements of these capacitors (low ESR and ESL) make it very attractive for DC decoupling and very competitive with the ceramic technology. Assembly can be performed using standard reflow soldering and its low profile also allows PICS capacitor integration in embedded module board technology. Sensors, healthcare and medical applications can benefit from this new development. To enable even higher integration, development activities are now focused on the third and fourth generation of high-density capacitors targeting ambitious 1μF/mm2. In this presentation, main characteristics of the PICS high-density capacitors will be described emphasizing on its capability, main applications and advantages versus discrete components. Then, in a second part, challenges raised by the increase of the capacitor density while keeping an acceptable breakdown voltage will be discussed. This includes the integration of high-k materials with adequate electrode and the research for maximizing the 3D silicon surface.

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