scholarly journals Improving ion beam injector performance by augmenting capacitance of vacuum diode

2002 ◽  
Author(s):  
D.A. Goerz ◽  
M.J. Wilson
Keyword(s):  
Ion Beam ◽  
Vacuum Diode

scholarly journals Вольт-амперные характеристики начальной стадии дугового разряда в высоковольтном вакуумном диоде

2019 ◽  
Vol 45 (12) ◽  
pp. 33
Author(s):  
С.Г. Давыдов ◽  
А.Н. Долгов ◽  
А.В. Корнеев ◽  
Р.Х. Якубов
Keyword(s):  
Electron Beam ◽  
High Voltage ◽  
Arc Discharge ◽  
Ion Beam ◽  
Vacuum Diode ◽  
Vacuum Arc ◽  
Ion Acceleration ◽  
Plasma Cloud ◽  
Initial Stage ◽  
Instability Development

AbstractThe process of electron instability development and propagation of a cathode electron beam and anomalous ion beam, followed by outburst of current in the initial stage of arc discharge was observed in rarefied plasma cloud of high-voltage vacuum diode. These events are consistent with the model of anomalous ion acceleration in interelectrode plasma at the spark stage of vacuum arc discharge.

Ion-beam formation in a vacuum diode

1975 ◽  
Vol 18 (2) ◽  
pp. 173-175 ◽  
Author(s):  
S. P. Bugaev ◽  
V. I. Koshelev ◽  
M. N. Timofeev
Keyword(s):  
Ion Beam ◽  
Vacuum Diode ◽  
Beam Formation

Study of IBAD Deposited AlN Films for Vacuum Diode Electron Emission

1996 ◽  
Vol 449 ◽  
Author(s):  
E.W. Forsythe ◽  
J.A. Sprague ◽  
B.A. Khan ◽  
S. Metha ◽  
D.A. Smith ◽  
...  
Keyword(s):  
Field Emission ◽  
Growth Parameters ◽  
Ion Beam ◽  
Vacuum Diode ◽  
Basic Operation ◽  
Annealing Conditions ◽  
Ion Beam Assisted Deposition ◽  
Long Time ◽  
Ge Doping ◽  
Diode Voltage

ABSTRACTWe have demonstrated the basic operation of a vacuum diode based on the negative electron affinity polycrystalline AlN thin film emitters. The AlN films, both undoped and Ge doped, were deposited by ion beam assisted deposition (IBAD). The IBAD process utilizes thermal evaporation from either electron-beam or resistance heated sources with ion bombardment from Kaufman-type ion sources at energies from 50 to 1500 eV. Films were post-annealed by rapid thermal annealing and long-time tube furnace annealing in a N2 atmosphere to test improvements in crystallinity. The electrical and transport properties of the films were tested by DC l-V measurements. The structure of the AlN films was investigated by TEM, SIMS, optical absorption, and RBS as a function of growth parameters and annealing. The field emission was tested for films with different Ge doping concentrations, film thickness, diode voltage, and post annealing conditions. Field emission was observed for the undoped AlN films with a thickness of approximately 10 nm.

Direct Observations of the Epitaxial Growth of Sputtered Ag on Si

1973 ◽  
Vol 31 ◽  
pp. 122-123
Author(s):  
J. S. Maa ◽  
Thos. E. Hutchinson
Keyword(s):  
Epitaxial Growth ◽  
Film Growth ◽  
Ion Beam ◽  
Ion Beam Sputtering ◽  
Microscopy Technique ◽  
Direct Observations ◽  
In Situ Electron Microscopy ◽  
Beam Sputtering ◽  
The Subject

The growth of Ag films deposited on various substrate materials such as MoS2, mica, graphite, and MgO has been investigated extensively using the in situ electron microscopy technique. The three stages of film growth, namely, the nucleation, growth of islands followed by liquid-like coalescence have been observed in both the vacuum vapor deposited and ion beam sputtered thin films. The mechanisms of nucleation and growth of silver films formed by ion beam sputtering on the (111) plane of silicon comprise the subject of this paper. A novel mode of epitaxial growth is observed to that seen previously.The experimental arrangement for the present study is the same as previous experiments, and the preparation procedure for obtaining thin silicon substrate is presented in a separate paper.

Effects of Ion Beam Milling on Surface Topography

1973 ◽  
Vol 31 ◽  
pp. 84-85
Author(s):  
P.G. Pawar ◽  
P. Duhamel ◽  
G.W. Monk
Keyword(s):  
Surface Topography ◽  
Ion Beam ◽  
Solid Material ◽  
Beam Current ◽  
Atomic Mass ◽  
Micro Milling ◽  
Ion Milling ◽  
Controlled Atmospheres ◽  
Milling Operations ◽  
Sufficient Energy

A beam of ions of mass greater than a few atomic mass units and with sufficient energy can remove atoms from the surface of a solid material at a useful rate. A system used to achieve this purpose under controlled atmospheres is called an ion miliing machine. An ion milling apparatus presently available as IMMI-III with a IMMIAC was used in this investigation. Unless otherwise stated, all the micro milling operations were done with Ar+ at 6kv using a beam current of 100 μA for each of the two guns, with a specimen tilt of 15° from the horizontal plane.It is fairly well established that ion bombardment of the surface of homogeneous materials can produce surface topography which resembles geological erosional features.

Nucleation and Early Growth of Sputtered thin Films

1970 ◽  
Vol 28 ◽  
pp. 516-517
Author(s):  
Dudley M. Sherman ◽  
Thos. E. Hutchinson
Keyword(s):  
Thin Films ◽  
Electron Beam ◽  
Ion Beam ◽  
Ion Source ◽  
Water Cooling ◽  
Stages Of Growth ◽  
Lens Assembly ◽  
Microscope Technique ◽  
Ion Beam Sputter Deposition

The in situ electron microscope technique has been shown to be a powerful method for investigating the nucleation and growth of thin films formed by vacuum vapor deposition. The nucleation and early stages of growth of metal deposits formed by ion beam sputter-deposition are now being studied by the in situ technique.A duoplasmatron ion source and lens assembly has been attached to one side of the universal chamber of an RCA EMU-4 microscope and a sputtering target inserted into the chamber from the opposite side. The material to be deposited, in disc form, is bonded to the end of an electrically isolated copper rod that has provisions for target water cooling. The ion beam is normal to the microscope electron beam and the target is placed adjacent to the electron beam above the specimen hot stage, as shown in Figure 1.

SEM analysis of DC magnetron sputtered beryllium films

1988 ◽  
Vol 46 ◽  
pp. 960-961
Author(s):  
E. F. Lindsey ◽  
C. W. Price ◽  
E. L. Pierce ◽  
E. J. Hsieh
Keyword(s):  
Fine Structure ◽  
Electron Emission ◽  
Secondary Electron ◽  
Low Voltage ◽  
Ion Beam ◽  
Secondary Electron Emission ◽  
Sem Analysis ◽  
Fused Silica ◽  
Grain Structure ◽  
Silica Substrate

Columnar structures produced by DC magnetron sputtering can be altered by using RF biased sputtering or by exposing the film to nitrogen pulses during sputtering, and these techniques are being evaluated to refine the grain structure in sputtered beryllium films deposited on fused silica substrates. Beryllium is brittle, and fractures in sputtered beryllium films tend to be intergranular; therefore, a convenient technique to analyze grain structure in these films is to fracture the coated specimens and examine them in an SEM. However, fine structure in sputtered deposits is difficult to image in an SEM, and both the low density and the low secondary electron emission coefficient of beryllium seriously compound this problem. Secondary electron emission can be improved by coating beryllium with Au or Au-Pd, and coating also was required to overcome severe charging of the fused silica substrate even at low voltage. The coating structure can obliterate much of the fine structure in beryllium films, but reasonable results were obtained by using the high-resolution capability of an Hitachi S-800 SEM and either ion-beam coating with Au-Pd or carbon coating by thermal evaporation.

Ion Beam Induced Interfacial Reactions in Molybdenum Thin Films on Silicon

1981 ◽  
Vol 39 ◽  
pp. 162-163
Author(s):  
L. J. Chen ◽  
L. S. Hung ◽  
J. W. Mayer
Keyword(s):  
Ion Beam ◽  
Chemical Vapor ◽  
Interfacial Reactions ◽  
Practical Applications ◽  
Microelectronic Devices ◽  
Recent Emergence ◽  
Chemical Vapor Deposited ◽  
Atomic Mixing ◽  
Silicon Interface ◽  
Kinetics Of

When an energetic ion penetrates through an interface between a thin film (of species A) and a substrate (of species B), ion induced atomic mixing may result in an intermixed region (which contains A and B) near the interface. Most ion beam mixing experiments have been directed toward metal-silicon systems, silicide phases are generally obtained, and they are the same as those formed by thermal treatment.Recent emergence of silicide compound as contact material in silicon microelectronic devices is mainly due to the superiority of the silicide-silicon interface in terms of uniformity and thermal stability. It is of great interest to understand the kinetics of the interfacial reactions to provide insights into the nature of ion beam-solid interactions as well as to explore its practical applications in device technology.About 500 Å thick molybdenum was chemical vapor deposited in hydrogen ambient on (001) n-type silicon wafer with substrate temperature maintained at 650-700°C. Samples were supplied by D. M. Brown of General Electric Research & Development Laboratory, Schenectady, NY.

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