Room Temperature Bonding of GaN on Diamond Wafers by Using Mo/Au Nano-Layer for High-Power Semiconductor Devices

2019 ◽  
Author(s):  
Kang Wang ◽  
Kun Ruan ◽  
Wenbo Hu ◽  
Shengli Wu ◽  
Hongxing Wang
2019 ◽  
Vol 41 (8) ◽  
pp. 19-30 ◽  
Author(s):  
Matthew J. Marinella ◽  
Stanley Atcitty ◽  
Sandeepan DasGupta ◽  
Robert J. Kaplar ◽  
Mark A. Smith

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