Dry etching of fused silica glass in C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications

Author(s):  
Laicun Lin ◽  
Mingchuan Zhang ◽  
Delong Qiu ◽  
Xiangmeng Jing ◽  
Feng Jiang ◽  
...  
2015 ◽  
Vol 22 (1) ◽  
pp. 119-127 ◽  
Author(s):  
Laicun Lin ◽  
Xiangmeng Jing ◽  
Qidong Wang ◽  
Feng Jiang ◽  
Liqiang Cao ◽  
...  

2016 ◽  
Vol 28 (1) ◽  
pp. 480-486 ◽  
Author(s):  
Laicun Lin ◽  
Xiangmeng Jing ◽  
Fengman Liu ◽  
Wen Yin ◽  
Daquan Yu ◽  
...  

1998 ◽  
Vol 42 (12) ◽  
pp. 2277-2281 ◽  
Author(s):  
Hyun Cho ◽  
C.B Vartuli ◽  
C.R Abernathy ◽  
S.M Donovan ◽  
S.J Pearton ◽  
...  

2013 ◽  
Vol 546 ◽  
pp. 136-140 ◽  
Author(s):  
Jong Cheon Park ◽  
Ok Geun Jeong ◽  
Jin Kon Kim ◽  
Young-Hoon Yun ◽  
Stephen J. Pearton ◽  
...  

1998 ◽  
Vol 27 (4) ◽  
pp. 166-170 ◽  
Author(s):  
Hyun Cho ◽  
C. B. Vartuli ◽  
S. M. Donovan ◽  
J. D. Mackenzie ◽  
C. R. Abernathy ◽  
...  

2000 ◽  
Vol 18 (4) ◽  
pp. 1220-1224 ◽  
Author(s):  
J. W. Lee ◽  
M. W. Devre ◽  
B. H. Reelfs ◽  
D. Johnson ◽  
J. N. Sasserath ◽  
...  

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