Reliability of Solder-Connected, Thick-Film Hybrid Integrated Circuits

1973 ◽  
Author(s):  
Darnall P. Burks
Keyword(s):  
Integrated Circuits ◽  
Thick Film

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

scholarly journals Examination of Thick-Films Using Modern Surface Analytical Techniques

1984 ◽  
Vol 11 (3) ◽  
pp. 219-223 ◽  
Author(s):  
G. Harsányi ◽  
G. Ripka
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Analytical Methods ◽  
Thick Films ◽  
Analytical Techniques ◽  
Electrical Measurements ◽  
Surface Impurity ◽  
And Migration

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.

scholarly journals New Thick-Film Microwave Elements for Microwave Integrated Circuits

1983 ◽  
Vol 11 (1) ◽  
pp. 1-20 ◽  
Author(s):  
Janusz J. Gondek ◽  
Marek A. Wójcicki ◽  
Jan Cąber
Keyword(s):  
Thin Film ◽  
Integrated Circuits ◽  
Mathematical Models ◽  
Thick Film ◽  
Technological Process ◽  
Operating Conditions ◽  
Microwave Integrated Circuits ◽  
Thin Film Technology ◽  
Strip Lines ◽  
Constituent Elements

The realisation of microwave integrated circuits consisting of numerous elements and components, both passive and active, takes place in steps. Initially, experimental constituent elements are designed and constructed, and only after it is found that they satisfy the operating conditions, can they be integrated into a sub-system. As a result of this we obtain complicated Microwave Integrated Circuits (MICs). Initially however one has to construct basic MIC elements such as: resonators, filters, couplings, Y branch joints, circulators, etc. During research over several years carried out at the Microelectronics Department, Institute of Electronics, of the Mining and Metallurgical University of Kraków and devoted to the application of thick-film technology to MIC, the authors have devised and constructed several microwave elements using strip-lines and this paper reports of the results of their studies.Pastes produced by DU PONT/USA were used. New mathematical models for designing thick-film microwave elements have been elaborated using computer techniques. These programmes have differed from analogous ones for MIC realized by thin-film technology can be adapted, after certain modifications, to the realisation of MIC. The authors have introduced new technological operations, not used so far, to the technological process. This has made possible the production of thick-film microwave elements with parameters comparable to those obtained in thin-film technology.

scholarly journals Reliability Prediction of Thick Film Hybrid Integrated Circuits

1992 ◽  
Vol 15 (1) ◽  
pp. 27-31
Author(s):  
Rumen Pranchov ◽  
Veneta Athanassova ◽  
Ruslan Georgiev ◽  
Stefan Pomakov
Keyword(s):  
Integrated Circuits ◽  
Quality Assessment ◽  
Thick Film ◽  
Failure Rate ◽  
Confidence Level ◽  
Test Pattern ◽  
Reliability Prediction ◽  
Us Military ◽  
The Us

When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US military or the French standards. The results obtained from tests of Test Pattern Circuits may be used successfully for reliability estimating during the design period of new thick film Hybrid Integrated Circuits. Six types of Test Pattern Circuits were designed and tested and a model for estimating thick film Hybrid Integrated Circuits failure rate is proposed. Failure rate values predicted by using the method with Test Pattern Circuits, and the results, obtained from the tests of two kinds of Hybrid Integrated Circuits concerned for a 90% confidence level were compared.

scholarly journals The Application of New Du Pont/USA/Copper Composition for Manufacturing of Thick-Film Microwave Low Loss Resonators on L and X Band

1981 ◽  
Vol 9 (2) ◽  
pp. 157-163 ◽  
Author(s):  
Janusz J. Gondek ◽  
Marek A. Wojcicki ◽  
Jan Koprowski
Keyword(s):  
Statistical Analysis ◽  
Integrated Circuits ◽  
Mathematical Models ◽  
Thick Film ◽  
Future Development ◽  
Microwave Filters ◽  
Low Loss ◽  
Microwave Integrated Circuits ◽  
X Band ◽  
Measurement Results

The applicability of the various copper compositions to the production of thick-film microwave devices has been examined. The results of this work are presented in this paper. The paper presents criteria and computer programs for thick-film microwave integrated circuits. The investigations of asymmetrical striplines, stripline and circular resonators, microwave filters etc., have been used as a basis. The circuits were examined within the frequency band of 1–12 GHz. Based on the measurement results and the statistical analysis of the parameters of microwave integrated circuits, interesting conclusions concerned with the applications of thick-film techniques to microwaves have been drawn. The results obtained have been compared with other work and new mathematical models have been prepared. Finally the future development of microwave integrated circuits has been commented on.

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