scholarly journals Thick film hydrogen silsesquioxane planarization for passive component technology associated with electronic-photonic integrated circuits

2019 ◽  
Vol 37 (6) ◽  
pp. 061210
Author(s):  
Ali Al-Moathin ◽  
Lianping Hou ◽  
Afesomeh Ofiare ◽  
Jue Wang ◽  
Shengwei Ye ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Photonic Integrated Circuits ◽  
Component Technology ◽  
Passive Component ◽  
Hydrogen Silsesquioxane

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

scholarly journals Wafer-scale low-loss lithium niobate photonic integrated circuits

2020 ◽  
Author(s):  
Kevin Luke ◽  
Prashanta Kharel ◽  
Christian Reimer ◽  
Lingyan He ◽  
Marko Loncar ◽  
...  
Keyword(s):  
Lithium Niobate ◽  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Low Loss ◽  
Wafer Scale

scholarly journals Perspectives on Advances in Quantum Dot Lasers and Integration with Si Photonic Integrated Circuits

ACS Photonics ◽  
2021 ◽  
Author(s):  
Chen Shang ◽  
Yating Wan ◽  
Jennifer Selvidge ◽  
Eamonn Hughes ◽  
Robert Herrick ◽  
...  
Keyword(s):  
Quantum Dot ◽  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Quantum Dot Lasers

Advanced waveguide bends for photonic integrated circuits

2019 ◽  
Author(s):  
Jeong Hwan Song ◽  
T.D. Kongnyuy ◽  
N. Hosseini ◽  
A. Stassen ◽  
R. Jansen ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Waveguide Bends
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