Thick-film fabrication techniques for millimetre-wave dielectric waveguide integrated circuits

1980 ◽  
Vol 16 (7) ◽  
pp. 245
Author(s):  
M.R. Inggs ◽  
N. Williams
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Dielectric Waveguide ◽  
Millimetre Wave ◽  
Film Fabrication

Dielectric waveguide; a low-cost technology for millimetre wave integrated circuits

1982 ◽  
Vol 52 (11-12) ◽  
pp. 522 ◽  
Author(s):  
R.V. Gelsthorpe ◽  
N. Williams ◽  
N.M. Davey
Keyword(s):  
Integrated Circuits ◽  
Dielectric Waveguide ◽  
Low Cost ◽  
Millimetre Wave

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

scholarly journals High temperature ultrasonic sensor for fission gas characterization in MTR harsh environment

2018 ◽  
Vol 170 ◽  
pp. 04008
Author(s):  
O. Gatsa ◽  
P. Combette ◽  
E. Rozenkrantz ◽  
D. Fourmentel ◽  
C. Destouches ◽  
...  
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Screen Printing ◽  
Bismuth Titanate ◽  
Elevated Temperatures ◽  
Ultrasonic Sensor ◽  
High Resistivity ◽  
Materials Testing ◽  
Coupling Coefficients ◽  
Film Fabrication

In the contemporary world, the measurements in hostile environment is one of the predominant necessity for automotive, aerospace, metallurgy and nuclear plant. The measurement of different parameters in experimental reactors is an important point in nuclear power strategy. In the near past, IES (Institut d’Électronique et des Systèmes) on collaboration with CEA (Commissariat à l’Energie Atomique et aux Energies Alternatives) have developed the first ultrasonic sensor for the application of gas quantity determination that has been tested in a Materials Testing Reactor (MTR). Modern requirements state to labor with the materials that possess stability on its parameters around 350°C in operation temperature. Previous work on PZT components elaboration by screen printing method established the new basis in thick film fabrication and characterization in our laboratory. Our trials on Bismuth Titanate ceramics showed the difficulties related to high electrical conductivity of fabricated samples that postponed further research on this material. Among piezoceramics, the requirements on finding an alternative solution on ceramics that might be easily polarized and fabricated by screen printing approach were resolved by the fabrication of thick film from Sodium Bismuth Titanate (NBT) piezoelectric powder. This material exhibits high Curie temperature, relatively good piezoelectric and coupling coefficients, and it stands to be a good solution for the anticipated application. In this paper, we present NBT thick film fabrication by screen printing, characterization of piezoelectric, dielectric properties and material parameters studies in dependence of temperature. Relatively high resistivity in the range of 1.1013 Ohm.cm for fabricated thick film is explained by Aurivillius structure in which a-and b-layers form perovskite structure between oxides of c-layer. Main results of this study are presented and discussed in terms of feasibility for an application to a new sensor device operating at high temperature level (400°). Piezoelectric parameters enhancement and loss reduction at elevated temperatures are envisaged to be optimized. Further sensor development and test in MTR are expected to be realized in the near future.

scholarly journals Examination of Thick-Films Using Modern Surface Analytical Techniques

1984 ◽  
Vol 11 (3) ◽  
pp. 219-223 ◽  
Author(s):  
G. Harsányi ◽  
G. Ripka
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Analytical Methods ◽  
Thick Films ◽  
Analytical Techniques ◽  
Electrical Measurements ◽  
Surface Impurity ◽  
And Migration

Modern surface analytical methods/EMPA, AES, SIMS etc. were used for studying the different layers in thick-film integrated circuits. Diffusion and migration effects, surface impurity distributions and surface compositions were examined. Some of the results are presented in this paper. Electrical measurements are not discussed here; only examples of the practical use of the methods are demonstrated.

Silicon-on-Glass Dielectric Waveguide—Part I: For Millimeter-Wave Integrated Circuits

2015 ◽  
Vol 5 (2) ◽  
pp. 268-279 ◽  
Author(s):  
Nazy Ranjkesh ◽  
Mohamed Basha ◽  
Aidin Taeb ◽  
Alireza Zandieh ◽  
Suren Gigoyan ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Millimeter Wave ◽  
Dielectric Waveguide ◽  
Millimeter Wave Integrated Circuits
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