scholarly journals Reliability Prediction of Thick Film Hybrid Integrated Circuits

1992 ◽  
Vol 15 (1) ◽  
pp. 27-31
Author(s):  
Rumen Pranchov ◽  
Veneta Athanassova ◽  
Ruslan Georgiev ◽  
Stefan Pomakov
Keyword(s):  
Integrated Circuits ◽  
Quality Assessment ◽  
Thick Film ◽  
Failure Rate ◽  
Confidence Level ◽  
Test Pattern ◽  
Reliability Prediction ◽  
Us Military ◽  
The Us

When using the well known handbooks for reliability predicting (MIL, CNET) some problems occur in quality assessment of components which are not produced according to the requirements of the US military or the French standards. The results obtained from tests of Test Pattern Circuits may be used successfully for reliability estimating during the design period of new thick film Hybrid Integrated Circuits. Six types of Test Pattern Circuits were designed and tested and a model for estimating thick film Hybrid Integrated Circuits failure rate is proposed. Failure rate values predicted by using the method with Test Pattern Circuits, and the results, obtained from the tests of two kinds of Hybrid Integrated Circuits concerned for a 90% confidence level were compared.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

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