Application study of simply and low cost numerical aperture increasing lens (NAIL) system for OBIRCH and EMMI in backside failure analysis

2015 ◽  
Author(s):  
Li Tian ◽  
Guoqiang Zhang ◽  
Kuibo Lan ◽  
Gaojie Wen ◽  
Dong Wang
Keyword(s):  
Failure Analysis ◽  
Low Cost ◽  
Numerical Aperture ◽  
Application Study

Comparing Lensed and Un-Lensed Optical Spot Probes for Blade Tip Timing Measurements

2012 ◽  
Author(s):  
Bruce D. Hockaday
Keyword(s):  
Rise Time ◽  
Low Cost ◽  
Numerical Aperture ◽  
Signal Amplitude ◽  
Spot Size ◽  
Data Conversion ◽  
Time Of Arrival ◽  
Fiber Optic Probes ◽  
Blade Tip ◽  
Beam Transmission

Detection of airfoil time-of-arrival with optical probes has been evolving since the 1980s. Time of arrival data are used to infer airfoil stresses caused by vibration through a sequence of manipulations. The data conversion begins by converting arrival time to blade position, so blade deflection can be determined from the expected non-vibrating position. Various methods are used in the industry to convert deflection data to frequency, amplitude, and stress, which is beyond the scope of this paper. Regardless of the analytical approach used, producing accurate stress information relies on the precise detection and measurement of time-of-arrival, which equates to blade position. Optical spot probes are commonly employed for blade tip sensing. Two dominant types of fiber optic probes are used in industry today; 1) un-lensed probes having their numerical aperture (NA) defined by the optical fiber and 2) lensed probes, utilizing an imaging lens to control numerical aperture and spot size. The lens adds cost and complexity to the probe but allows the probe to be installed farther away from the blade tip while keeping the sensing area small. The low-cost un-lensed probes must be installed close to the blade tip since the optical beam diverges at the angle defined by the NA of the fiber. These probes are considered interchangeable, with little regard to the inherent geometric optical differences of the beam transmission into the space where the blade travels. This paper presents a laboratory study comparing the performance characteristics between lensed and un-lensed spot probes. The study evaluates signal amplitude and rise time and arrival errors due to optical interaction with varying tip radii geometry. The study reports rise time as return signal strength as a function of circumferential location and sensing gap. Arrival errors are reported as circumferential location errors compared to a sharp reference edge as a function of the blade-to-sensor gap. The work is presented in terms of arrival location, producing information that is independent of rotation speed and vibratory mode.

Convenient method of producing cyclic single-chain Fv antibodies by split-intein-mediated protein ligation and chaperone co-expression

2020 ◽  
Vol 168 (3) ◽  
pp. 257-263 ◽  
Author(s):  
Chenjiang Liu ◽  
Yoshihiro Kobashigawa ◽  
Soichiro Yamauchi ◽  
Natsuki Fukuda ◽  
Takashi Sato ◽  
...  
Keyword(s):  
Genetic Manipulation ◽  
Low Cost ◽  
Recombinant Antibody ◽  
Expression System ◽  
Single Chain ◽  
Application Study ◽  
Variable Regions ◽  
Protein Ligation ◽  
Split Intein ◽  
Single Chain Fv

Abstract Single-chain Fv (scFv) is a recombinant antibody in which the variable regions of the heavy chain (VH) and light chain (VL) are connected by a short flexible polypeptide linker. Compared with monoclonal antibodies, scFvs have the advantages of low-cost production using Escherichia coli and easy genetic manipulation. ScFvs are, therefore, regarded as useful modules for producing next-generation medical antibodies. The practical use of scFvs has been limited due to their aggregation propensity mediated by interchain VH–VL interactions. To overcome this problem, we recently reported a cyclic scFv whose N-terminus and C-terminus were connected by sortase A-mediated ligation. Preparation of cyclic scFv is, however, a time-consuming process. To accelerate the application study of cyclic scFv, we developed a method to produce cyclic scFv by the combined use of a protein ligation technique based on protein trans-splicing reaction (PTS) by split intein and a chaperone co-expression system. This method allows for the preparation of active cyclic scFv from the cytoplasm of E. coli. The present method was applied to the production of cyclic 73MuL9-scFv, a GA-pyridine antibody, as a kind of advanced glycation end-product. These findings are expected to evoke further application study of cyclic scFv.

Measurement of Bit Leakages in a Functional SRAM

2009 ◽  
Author(s):  
Xiaowei Deng ◽  
Wah Kit Loh ◽  
Beena Pious ◽  
Jayesh Raval ◽  
Bashar Khan ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Statistical Evaluation ◽  
Low Cost ◽  
Nondestructive Measurement ◽  
Sensitivity Assessment ◽  
Leakage Measurement ◽  
First Time

Abstract A direct bit leakage measurement (DBLM) scheme is proposed and implemented in 8Mb and 32Mb SRAM’s in 45nm and 28nm technologies. It allows, for the first time, direct and nondestructive measurement of various defect induced leakages in each bit in a functional SRAM. It thus enables collection of various defect induced bit leakage data for low-cost and fast failure analysis. It also enables collection of massive bit leakage data for statistical evaluation and location sensitivity assessment.

A Study on a Low Cost Thin Film Antireflection Coating Solution for Failure Analysis Applications

2016 ◽  
Author(s):  
Fritz Christian Awitan ◽  
Camille Joyce Garcia ◽  
Dirk Andrew Doyle ◽  
Lawrence Benedict
Keyword(s):  
Failure Analysis ◽  
Focused Ion Beam ◽  
Spray Pyrolysis Technique ◽  
Low Cost ◽  
Ion Beam ◽  
Antireflection Coating ◽  
Hot Plate ◽  
Coating Solution ◽  
Set Up ◽  
Voltage Contrast

Abstract An ARC solution that can be used to improve backside imaging for backside photoemission microscopy applications is presented in this paper. Zinc Oxide (ZnO) -based thin films used as ARCs are deposited at the backside of the failing units through a simple and low cost spray pyrolysis technique. An improvised set-up, composed of an atomizer and a hot plate, is used in the experiment. The paper provides evidence of acceptable process repeatability and demonstrates that the technique and the material have important applications in the field of failure analysis. Furthermore, it shows that the application of ARC resulted in better defect localization. The location of the defect is easily been determined upon doing frontside inspection - to - backside image comparison on the deposited unit. By using high kV ion beam passive voltage contrast (PVC) and angled cut focused ion beam (FIB) cross section, we are able to isolate further and show the nature of the defect at the failing block.

Development of a Portable Optical Interferometry Microscope System

2015 ◽  
Vol 656-657 ◽  
pp. 561-566
Author(s):  
Hiroyuki Nishimoto ◽  
Kenji Yamaguchi ◽  
Katsunori Kimura ◽  
Yoshiaki Suzuki ◽  
Kazutake Uehara ◽  
...  
Keyword(s):  
Optical Axis ◽  
Low Cost ◽  
Optical Filter ◽  
Numerical Aperture ◽  
Video Camera ◽  
Optical Interferometry ◽  
Objective Lens ◽  
Basic Performance ◽  
Manufacturing Applications ◽  
Interference Image

Optical interferometry methods are widely used for measuring microdisplacement with nanometer accuracy. However, most commercially available optical interferometry systems are large and expensive for manufacturing applications. In this study, we report the development of a low-cost portable optical interferometry microscope for factory use. The light source was a tungsten–halogen white lamp with an optical filter. The microscope has an objective lens with a numerical aperture of 0.3, a magnifying power of 10, and field depth of 3.056 μm. Interference images were collected with an NTSC CCD-video camera. The resolution of the interference image is 320 × 240 pixels and stored in BMP format. To obtain phase shifted interferometry images, a piezoelectric actuator was used to monitor the table movement along the optical axis. The total cost of all system parts is approximately 7000 to 8000 US dollars. To evaluate the basic performance of the developed interferometry microscope, we measured a steel ball, the penetration mark of a Rockwell scale hardness indenter, and a gauge block surface with a bump. The developed interferometry microscope can measure continuous and gently sloping surfaces. The processing time is approximately 10–20 s.

Further Analysis on Silver Ions Migration

2015 ◽  
Vol 798 ◽  
pp. 402-405
Author(s):  
Xin Gong ◽  
Chao Duan
Keyword(s):  
Thermal Conductivity ◽  
Electric Field ◽  
Failure Analysis ◽  
Influence Factor ◽  
Low Cost ◽  
Short Circuit ◽  
Silver Ions ◽  
Design Evaluation ◽  
Reliability Design ◽  
Catastrophic Failures

Silver ions migration can cause short circuit between two conductors with different voltage, and it is the main cause of many catastrophic failures in components. Since silver glue is widely used to adhere chips in the components for its low cost, being able to coated automatically and high thermal conductivity. Research on the mechanisms of silver migration is quite important for taking measures to prevent Ag-migration caused failures. In previous studies four factors has been presented which induce a silver ions migration, they are silver material, electric field, humidity, and contamination, but will it be inevitable when the above factors exist? In another word, what should we do to prevent the migration? In this paper, we confirm that the above four factors are necessary rather than sufficient for silver migration and present a new influence factor on silver migration through a failure analysis case, which gives an important guidance for the reliability design, evaluation and analysis of a component.

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