Simple, novel and low cost numerical aperture increasing lens system for high resolution infrared image in backside failure analysis

2014 ◽  
Author(s):  
Li Tian
Keyword(s):  
High Resolution ◽  
Failure Analysis ◽  
Low Cost ◽  
Numerical Aperture ◽  
Infrared Image ◽  
Lens System

Performance Evaluation of a Novel Type of Low-Energy Electron Microscope

1990 ◽  
Vol 48 (1) ◽  
pp. 354-355
Author(s):  
Bertholdand Senftinger ◽  
Helmut Liebl
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Field Strength ◽  
Numerical Aperture ◽  
Low Energy ◽  
Energy Electron ◽  
High Resolution Imaging ◽  
Lens System ◽  
Resolution Imaging ◽  
Low Energy Electron

During the last few years the investigation of clean and adsorbate-covered solid surfaces as well as thin-film growth and molecular dynamics have given rise to a constant demand for high-resolution imaging microscopy with reflected and diffracted low energy electrons as well as photo-electrons. A recent successful implementation of a UHV low-energy electron microscope by Bauer and Telieps encouraged us to construct such a low energy electron microscope (LEEM) for high-resolution imaging incorporating several novel design features, which is described more detailed elsewhere.The constraint of high field strength at the surface required to keep the aberrations caused by the accelerating field small and high UV photon intensity to get an improved signal-to-noise ratio for photoemission led to the design of a tetrode emission lens system capable of also focusing the UV light at the surface through an integrated Schwarzschild-type objective. Fig. 1 shows an axial section of the emission lens in the LEEM with sample (28) and part of the sample holder (29). The integrated mirror objective (50a, 50b) is used for visual in situ microscopic observation of the sample as well as for UV illumination. The electron optical components and the sample with accelerating field followed by an einzel lens form a tetrode system. In order to keep the field strength high, the sample is separated from the first element of the einzel lens by only 1.6 mm. With a numerical aperture of 0.5 for the Schwarzschild objective the orifice in the first element of the einzel lens has to be about 3.0 mm in diameter. Considering the much smaller distance to the sample one can expect intense distortions of the accelerating field in front of the sample. Because the achievable lateral resolution depends mainly on the quality of the first imaging step, careful investigation of the aberrations caused by the emission lens system had to be done in order to avoid sacrificing high lateral resolution for larger numerical aperture.

High Resolution Backside Thermography Using a Numerical Aperture Increasing Lens

2003 ◽  
Author(s):  
S. Thorne ◽  
S. Ippolito ◽  
M. Eraslan ◽  
B. Goldberg ◽  
M.S. Ünlü ◽  
...  
Keyword(s):  
High Resolution ◽  
Integrated Circuits ◽  
Failure Analysis ◽  
Visual Inspection ◽  
Thermal Emission ◽  
Numerical Aperture ◽  
Specific Component ◽  
Feature Size ◽  
Analytical Technique ◽  
Emission Microscopy

Abstract As the feature size in integrated circuits (ICs) become smaller, the techniques we use to localize defects must also progress to the level that they can resolve potential errors. Additionally, because most errors cannot be identified by visual inspection alone, it is necessary to develop techniques, such as thermography, with the capability of localizing failures to the specific component or defect at fault. This paper will review the theory and application of an advanced subsurface (through the substrate) analytical technique for IC failure analysis – solid immersion lens thermal emission microscopy.

SEM-Based Nanoprobing on 40, 32 and 28 nm CMOS Devices Challenges for Semiconductor Failure Analysis

2013 ◽  
Author(s):  
Erik Paul ◽  
Holger Herzog ◽  
Sören Jansen ◽  
Christian Hobert ◽  
Eckhard Langer
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Scanning Electron Microscope ◽  
Failure Analysis ◽  
Case Studies ◽  
State Of The Art ◽  
Root Cause ◽  
Highly Efficient ◽  
Technology Nodes ◽  
Scanning Electron

Abstract This paper presents an effective device-level failure analysis (FA) method which uses a high-resolution low-kV Scanning Electron Microscope (SEM) in combination with an integrated state-of-the-art nanomanipulator to locate and characterize single defects in failing CMOS devices. The presented case studies utilize several FA-techniques in combination with SEM-based nanoprobing for nanometer node technologies and demonstrate how these methods are used to investigate the root cause of IC device failures. The methodology represents a highly-efficient physical failure analysis flow for 28nm and larger technology nodes.

scholarly journals Fabrication and Compressive Behavior of a Micro-Lattice Composite by High Resolution DLP Stereolithography

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 785
Author(s):  
Chow Shing Shin ◽  
Yu Chia Chang
Keyword(s):  
High Resolution ◽  
Lattice Structure ◽  
Low Cost ◽  
Hierarchical Structures ◽  
Dip Coating ◽  
Unit Cell ◽  
Digital Light Processing ◽  
Unit Cell Size ◽  
Wide Range ◽  
And Performance

Lattice structures are superior to stochastic foams in mechanical properties and are finding increasing applications. Their properties can be tailored in a wide range through adjusting the design and dimensions of the unit cell, changing the constituent materials as well as forming into hierarchical structures. In order to achieve more levels of hierarchy, the dimensions of the fundamental lattice have to be small enough. Although lattice size of several microns can be fabricated using the two-photon polymerization technique, sophisticated and costly equipment is required. To balance cost and performance, a low-cost high resolution micro-stereolithographic system has been developed in this work based on a commercial digital light processing (DLP) projector. Unit cell lengths as small as 100 μm have been successfully fabricated. Decreasing the unit cell size from 150 to 100 μm increased the compressive stiffness by 26%. Different pretreatments to facilitate the electroless plating of nickel on the lattice structure have been attempted. A pretreatment of dip coating in a graphene suspension is the most successful and increased the strength and stiffness by 5.3 and 3.6 times, respectively. Even a very light and incomplete nickel plating in the interior has increase the structural stiffness and strength by more than twofold.

A HIGH-RESOLUTION 2D IMAGING LASER RADAR FOR OCCLUDED HARD TARGET VIEWING AND IDENTIFICATION

2008 ◽  
Vol 18 (02) ◽  
pp. 393-400 ◽  
Author(s):  
ROBERT J. GRASSO ◽  
JOHN C. WIKMAN ◽  
DAVID P. DROUIN ◽  
GEORGE F. DIPPEL ◽  
PAUL I. EGBERT
Keyword(s):  
High Resolution ◽  
Target Identification ◽  
Low Cost ◽  
System Size ◽  
Operating Conditions ◽  
Array Technology ◽  
Diode Pumped ◽  
Target Ranging ◽  
2D Imaging ◽  
Gated Imaging

BAE SYSTEMS has developed a Low Cost Targeting System (LCTS) consisting of a FLIR for target detection, laser-illuminated, gated imaging for target identification, laser rangefinder and designator, GPS positioning, and auto-tracking capability within a small compact system size. The system is based upon BAE Systems proven micro-bolometer passive LWIR camera coupled with Intevac's new EBAPS camera. A dual wavelength diode pumped laser provides eyesafe ranging and target illumination, as well as designation; a custom detector module senses the return pulse for target ranging and to set the range gates for the gated camera. Trials show that the current detectors offer complete extinction of signals outside of the gated range, thus, providing high resolution within the gated region. The images have shown high spatial resolution arising from the use of solid state focal plane array technology. Imagery has been collected in both the laboratory and the field to verify system performance during a variety of operating conditions.

High-Resolution Monitoring of Atmospheric Pollutants Using a System of Low-Cost Sensors

2014 ◽  
Vol 52 (7) ◽  
pp. 3823-3832 ◽  
Author(s):  
Sutharshan Rajasegarar ◽  
Timothy C. Havens ◽  
Shanika Karunasekera ◽  
Christopher Leckie ◽  
James C. Bezdek ◽  
...  
Keyword(s):  
High Resolution ◽  
Low Cost ◽  
Atmospheric Pollutants

scholarly journals High-Resolution Atmospheric Sensing of Multiple Atmospheric Variables Using the DataHawk Small Airborne Measurement System

2013 ◽  
Vol 30 (10) ◽  
pp. 2352-2366 ◽  
Author(s):  
Dale A. Lawrence ◽  
Ben B. Balsley
Keyword(s):  
High Resolution ◽  
Measurement System ◽  
Current System ◽  
Low Cost ◽  
Structure Constant ◽  
Turbulence Structure ◽  
Quality Of Data ◽  
Airborne Measurement ◽  
Atmospheric Measurement ◽  
Atmospheric Variables

Abstract The DataHawk small airborne measurement system provides in situ atmospheric measurement capabilities for documenting scales as small as 1 m and can access reasonably large volumes in and above the atmospheric boundary layer at low cost. The design of the DataHawk system is described, beginning with the atmospheric measurement requirements, and articulating five key challenges that any practical measurement system must overcome. The resulting characteristics of the airborne and ground support components of the DataHawk system are outlined, along with its deployment, operating, and recovery modes. Typical results are presented to illustrate the types and quality of data provided by the current system, as well as the need for more of these finescale measurements. Particular focus is given to the DataHawk's ability to make very-high-resolution measurements of a variety of atmospheric variables simultaneously, with emphasis given to the measurement of two important finescale turbulence parameters, (the temperature turbulence structure constant) and ɛ (the turbulent energy dissipation rate). Future sensing possibilities and limitations using this approach are also discussed.

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