Evaluation of bonding strength of thin copper wire and lead-free solder by pullout tests

2016 ◽  
Author(s):  
Naoya Tada ◽  
Takuhiro Tanaka ◽  
Hirotsugu Tabata ◽  
Takeshi Uemori ◽  
Toshiya Nakata
Keyword(s):  
Bonding Strength ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Pullout Tests ◽  
Free Solder

scholarly journals Evaluation of Thin Copper Wire and Lead-Free Solder Joint Strength by Pullout Tests and Wire Surface Observation

Crystals ◽  
2017 ◽  
Vol 7 (8) ◽  
pp. 255 ◽  
Author(s):  
Naoya Tada ◽  
Takuhiro Tanaka ◽  
Takeshi Uemori ◽  
Toshiya Nakata
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Wire Surface ◽  
Surface Observation ◽  
Pullout Tests ◽  
Free Solder

Effects of Current Stressing and Isothermal Aging on the Tensile Strength of Microscale Lead-Free Solder Joints with Different Joint Volumes

2013 ◽  
Vol 634-638 ◽  
pp. 2800-2803 ◽  
Author(s):  
Li Meng Yin ◽  
Yan Fei Geng ◽  
Zhang Liang Xu ◽  
Song Wei
Keyword(s):  
Tensile Strength ◽  
Current Density ◽  
Isothermal Aging ◽  
Solder Joints ◽  
High Current Density ◽  
Copper Wire ◽  
Lead Free ◽  
Lead Free Solder ◽  
Current Stressing ◽  
Free Solder

Adopting an accurate micro-tensile method based on dynamic mechanical analyzer (DMA) instrument, the tensile strength of three kinds of copper-wire/solder/copper-wire sandwich structured microscale lead-free solder joints that underwent current stressing with a direct current density of 1.0×104 A/cm2 and loading time of 48 hours were investigated, and compared with those solder joints isothermal aged at 100 0C for 48 hours and as-reflowed condition. These three kinds of microscale columnar solder joints have different volumes, i.e., a same diameter of 300 μm but different heights of 100 μm, 200 μm and 300 μm. Experimental results show that both current stressing and isothermal aging degrades the tensile strength of microscale solder joints, and the solder joint with smaller volume obtains higher tensile strength under same test condition. In addition, current stressing induces obvious electromigration (EM) issue under high current density of 1.0×104 A/cm2, resulting in the decreasing of tensile strength and different fracture position, mode and surface morphology of microscale solder joints. The degree of strength degradation increases with the increasing of joint height when keep joint diameter constant, this is mainly due to that electromigration leads to voids form and grow at the interface of cathode, and solder joints with larger volume may contains more soldering defects as well.

A New Lead-Free Solder Joint Utilizing Superplastic Al-Zn Eutectoid Alloy for Next Generation SiC Power Semiconductor Devices

2016 ◽  
Vol 838-839 ◽  
pp. 482-487 ◽  
Author(s):  
Jin Onuki ◽  
Akane Saitou ◽  
Akio Chiba ◽  
Kunihiro Tamahashi ◽  
Yoshinobu Motohashi ◽  
...  
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Bonding Strength ◽  
Lead Free ◽  
Lead Free Solder ◽  
Power Semiconductor ◽  
Power Semiconductor Devices ◽  
Alloy Solder ◽  
Free Solder ◽  
Eutectoid Alloy

A new high-temperature lead-free solder joint which withstands up to 300°C utilizing superplasticity in the Al-Zn eutectoid alloy has been developed to realize SiC power semiconductor devices. The new solid state joining process consists of interfacial cleaning of joints utilizing superplasticity of the Al-Zn-eutectoid alloy at 250°C followed by diffusion bonding between 350 and 390°C. The bonding strength of the new joints exhibits almost the same value at the temperature range from RT to 300°C, above which it decreases slightly with increasing temperature. It is also found that the bonding strength of the new joints is 8 times as high as those of a high-temperature Pb-5wt%Sn-1.5wt%Ag solder and the Al-Zn eutectoid alloy solder without utilizing superplasticity at 250°C. The Al-Zn eutectoid alloy solder joint has shown high reliability in the temperature cycle testing between 50°C and 300°C up to 300 cycles.

Effect of aluminum content on structure, transport and mechanical properties of Sn-Zn eutectic lead free solder alloy rapidly solidified from melt.

2015 ◽  
Vol 10 (1) ◽  
pp. 2641-2648
Author(s):  
Rizk Mostafa Shalaby ◽  
Mohamed Munther ◽  
Abu-Bakr Al-Bidawi ◽  
Mustafa Kamal
Keyword(s):  
Mechanical Properties ◽  
Melting Point ◽  
Lead Free ◽  
Al Alloy ◽  
Lead Free Solder ◽  
Pronounced Increase ◽  
Mass Unit ◽  
Size Refinement ◽  
Free Solder ◽  
Lead Free Solders

The greatest advantage of Sn-Zn eutectic is its low melting point (198 oC) which is close to the melting point. of Sn-Pb eutectic solder (183 oC), as well as its low price per mass unit compared with Sn-Ag and Sn-Ag-Cu solders. In this paper, the effect of 0.0, 1.0, 2.0, 3.0, 4.0, and 5.0 wt. % Al as ternary additions on melting temperature, microstructure, microhardness and mechanical properties of the Sn-9Zn lead-free solders were investigated. It is shown that the alloying additions of Al at 4 wt. % to the Sn-Zn binary system lead to lower of the melting point to 195.72 ˚C.  From x-ray diffraction analysis, an aluminium phase, designated α-Al is detected for 4 and 5 wt. % Al compositions. The formation of an aluminium phase causes a pronounced increase in the electrical resistivity and microhardness. The ternary Sn-9Zn-2 wt.%Al exhibits micro hardness superior to Sn-9Zn binary alloy. The better Vickers hardness and melting points of the ternary alloy is attributed to solid solution effect, grain size refinement and precipitation of Al and Zn in the Sn matrix.  The Sn-9%Zn-4%Al alloy is a lead-free solder designed for possible drop-in replacement of Pb-Sn solders.  

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