Drop test for Sn96.7-Ag3.7 polymer core solder ball in BGA package

2011 ◽  
Author(s):  
Tien-Tsorng Shih ◽  
Bing-Hua Chen ◽  
Win-Der Lee ◽  
Mu-Chun Wang
Keyword(s):  
Solder Ball ◽  
Drop Test ◽  
Bga Package

2nd Level Reliability Improvement on WLCSP

2010 ◽  
Vol 2010 (1) ◽  
pp. 000333-000338
Author(s):  
Seungwook Park ◽  
Jupyo Hong ◽  
Changbae Lee ◽  
Sunhee Moon ◽  
Jinsoo Kim ◽  
...  
Keyword(s):  
Solder Ball ◽  
Coefficient Of Thermal Expansion ◽  
Drop Test ◽  
Wafer Level ◽  
Molding Process ◽  
Property Variation ◽  
Chip Scale Package ◽  
Low Modulus ◽  
Market Needs ◽  
Reliability Issue

Recently the package market is demanding the smaller package size and the lower impedance electrical path with a short interconnection. The wafer level chip scale package is one of them, which has the solution of the market needs above. However, WLCSP technology is still not fully accepted on the large device size that is larger than 5mm × 5mm. It needs to overcome 2nd level reliability issue on both solder joint and drop reliability test. To improve 2nd level reliability, we need to apply the longer stand–off design such as Cu –post and double solder ball instead of single solder ball, and low modulus material on polymer layer under the solder pad for releasing thermal stress which result in the solder joints crack due to CTEs (Coefficient of Thermal Expansion) mismatch between organic PCB and WLCSP. In this paper, the double ball structure is introduced as one of them can provide the longer stand off. In addition of improving 2nd level reliability and drop test it may need to apply different solder ball component properties to increase Thermal cycling and drop test. The WLCSP structured a double solder ball showed a better 2nd level reliability result. This paper describes the molding process for double ball process and 2nd level reliability by solder property variation.

Optimal design of thin-profile fine-pitch ball grid array package under drop impact test

2011 ◽  
Vol 225 (12) ◽  
pp. 2775-2791 ◽  
Author(s):  
R S Chen ◽  
H E Cheng ◽  
R W Wu ◽  
C H Huang ◽  
W C Liao ◽  
...  
Keyword(s):  
Solder Ball ◽  
Ball Grid Array ◽  
Drop Test ◽  
Circuit Board ◽  
Impact Pulse ◽  
Excitation Scheme ◽  
Thin Profile ◽  
Fine Pitch ◽  
Support Excitation ◽  
The Impact

This article describes the board-level drop reliability of thin-profile fine-pitch ball grid array (TFBGA) subjected to Joint Electron Device Engineering Council (JEDEC) drop test conditions featuring an impact pulse profile with a peak acceleration of 1500  G and a pulse duration of 0.5 ms. The solder ball is assumed to be an elastoplastic model and the other components linear elastic ones. Both the global/local finite element and the finite grid region methods are introduced to improve the accuracy and the convergence during the meshing process. Meanwhile, the contact impact process during the drop test is translated into the effective support excitation load on the printed circuit board (PCB) through the support excitation scheme to simplify the analysis. By means of optimal parameters of the Taguchi robust design, the average stress of the solder ball at the PCB side surface becomes 80.9 MPa, which shows a 57 per cent reduction compared to the original stress of 189.7 MPa. As a result, the impact reliability of the TFBGA package is significantly improved. Finally, the JEDEC drop test is conducted to verify the optimal results obtained by the Taguchi method.

Thermal cycling effect on the drop reliability of BGA lead-free solder joints

2017 ◽  
Vol 29 (4) ◽  
pp. 199-202 ◽  
Author(s):  
Fang Liu ◽  
Jiacheng Zhou ◽  
Nu Yan
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Printed Circuit Board ◽  
Solder Joints ◽  
Drop Test ◽  
Circuit Board ◽  
Metallographic Analysis ◽  
Content Type ◽  
Bga Package ◽  
Free Solder

Purpose The purpose of this paper is to study the drop reliability of ball-grid array (BGA) solder joints affected by thermal cycling. Design/methodology/approach The drop test was made with the two kinds of chip samples with the thermal cycling or not. Then, the dyeing process was taken by these samples. Finally, through observing the metallographic analysis results, the conclusions could be found. Findings It is observed that the solder joint cracks which were only subjected to drop loads without thermal cycling appeared near the BGA package pads. The solder joint cracks which were subjected to drop loads with thermal cycling appear near the printed circuit board pads. Originality/value This paper obtains the solder joint cracks picture with drop test under the thermal cycling.

Mechanical strength test method for solder ball joint in BGA package

2005 ◽  
Vol 11 (2) ◽  
pp. 121-129 ◽  
Author(s):  
Jong-Woong Kim ◽  
Dae-Gon Kim ◽  
Seung-Boo Jung
Keyword(s):  
Mechanical Strength ◽  
Solder Ball ◽  
Strength Test ◽  
Test Method ◽  
Ball Joint ◽  
Bga Package
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