Temporal and frequency characteristic analysis of margin-related failures caused by an intermittent nano-scale fracture of the solder ball in a BGA package device
2017 ◽
Vol 69
◽
pp. 88-99
◽
Keyword(s):
2020 ◽
Vol 10
(2)
◽
pp. 36-43
2011 ◽
Vol 8
(3)
◽
pp. 321-341
◽
2014 ◽
Vol 628
◽
pp. 171-176
Keyword(s):
Keyword(s):