IMC integrity for Sn96.7-Ag3.7 polymer core solder ball in BGA package

2011 ◽  
Author(s):  
Tien-Tsorng Shih ◽  
Bing-Hua Chen ◽  
Win-Der Lee ◽  
Mu-Chun Wang
Keyword(s):  
Solder Ball ◽  
Bga Package

Mechanical strength test method for solder ball joint in BGA package

2005 ◽  
Vol 11 (2) ◽  
pp. 121-129 ◽  
Author(s):  
Jong-Woong Kim ◽  
Dae-Gon Kim ◽  
Seung-Boo Jung
Keyword(s):  
Mechanical Strength ◽  
Solder Ball ◽  
Strength Test ◽  
Test Method ◽  
Ball Joint ◽  
Bga Package

scholarly journals Non-destructive Evaluation of Solder Ball Joints in BGA Package by Infrared Thermography

2005 ◽  
Vol 23 (3) ◽  
pp. 452-459
Author(s):  
Kazuya UENO ◽  
Shinobu SATONAKA ◽  
Naoto KIMURA ◽  
Jun SHIRASAKA ◽  
Tatsuya KOBAYASHI
Keyword(s):  
Infrared Thermography ◽  
Solder Ball ◽  
Non Destructive Evaluation ◽  
Bga Package ◽  
Ball Joints ◽  
Non Destructive

High-Lead Solder Ball Characteristics in BGA Package

2002 ◽  
Author(s):  
Nicholas Kao ◽  
Y. P. Wang ◽  
C. S. Hsiao
Keyword(s):  
Shear Strength ◽  
Solder Joint ◽  
High Performance ◽  
Solder Ball ◽  
Solder Paste ◽  
Joint Performance ◽  
Ball Shear ◽  
Bga Package ◽  
Ball Shear Strength ◽  
High Lead

For high performance packages in mainframe systems such as networking switch, telecommunication equipments, higher reliability is always required. Using high-lead solder ball is an effective way to enhance the solder joint performance in board level. The elongation property of high-lead alloy Sn10/Pb90 is 10 times greater than eutectic Sn/Pb alloy. The high-lead ball has higher melting temperature, it can maintain the stand off (gap) between the package and PCB when eutectic solder paste melted at 220°C. In this study, the performances of high-lead solder Sn10/Pb90 and eutectic Sn63/Pb37 are compared. A series of experiments are performed to characterize the high-lead solder ball solder joint performance. The ball shear test parameters also affect high-lead solder ball strength, such as ram height and shear speed. Lower ram height and higher speed increases the ball shear strength value. Effect of different ball pad openings, solder paste volume and reflow profile for ball placement, is also discussed in this paper. the ratio of ball pad opening diameter to solder ball diameter is related to ball shear force. When the ratio is 0.83, the ball shear is better than other value. The most important factor to ball shear strength is the solder paste amount. However, the reflow condition (the time period over 183°C) isn’t the significant factor to affect the ball shear strength.

Optical Connection between Optical Via Hole in BGA Package and Optical Waveguide on Board

2009 ◽  
Vol E92-C (2) ◽  
pp. 239-246 ◽  
Author(s):  
Keiko ODA ◽  
Takahiro MATSUBARA ◽  
Kei-ichiro WATANABE ◽  
Kaori TANAKA ◽  
Maraki MAETANI
Keyword(s):  
Optical Waveguide ◽  
Bga Package ◽  
Via Hole ◽  
Optical Connection

The Effect of Ball Pad Metallurgy and Ball Composition on Solder Ball Integrity of Plastic Ball Grid Array Packages

1998 ◽  
Author(s):  
C.H. Zhong ◽  
Sung Yi
Keyword(s):  
Failure Mode ◽  
Barrier Layer ◽  
Shear Force ◽  
Solder Ball ◽  
Ball Grid Array ◽  
Reliability Test ◽  
Shear Forces ◽  
Ball Shear ◽  
Plastic Ball ◽  
Plastic Ball Grid Array

Abstract Ball shear forces of plastic ball grid array (PBGA) packages are found to decrease after reliability test. Packages with different ball pad metallurgy form different intermetallic compounds (IMC) thus ball shear forces and failure modes are different. The characteristic and dynamic process of IMC formed are decided by ball pad metallurgy which includes Ni barrier layer and Au layer thickness. Solder ball composition also affects IMC formation dynamic process. There is basically no difference in ball shear force and failure mode for packages with different under ball pad metallurgy before reliability test. However shear force decreased and failure mode changed after reliability test, especially when packages exposed to high temperature. Major difference in ball shear force and failure mode was found for ball pad metallurgy of Ni barrier layer including Ni-P, pure Ni and Ni-Co. Solder ball composition was found to affect the IMC formation rate.

scholarly journals DDR4 data channel failure due to DC offset caused by intermittent solder ball fracture in FBGA package

IEEE Access ◽  
2021 ◽  
pp. 1-1
Author(s):  
Muhammad Waqar ◽  
Geunyong Bak ◽  
Junhyeong Kwon ◽  
Sanghyeon Baeg
Keyword(s):  
Solder Ball ◽  
Dc Offset ◽  
Data Channel
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