The interfacial microstructure and Kirkendall voids in In-48Sn/Cu solder joint

2013 ◽  
Author(s):  
Fei-fei Tian ◽  
Zhi-quan Liu
Keyword(s):  
Solder Joint ◽  
Interfacial Microstructure ◽  
Kirkendall Voids

Effects of Fe on the Kirkendall Void Formation of Sn-3.5Ag-xFe/Cu Solder Joints

2010 ◽  
Vol 2010 (1) ◽  
pp. 000294-000297 ◽  
Author(s):  
S. H. Kim ◽  
Jin Yu
Keyword(s):  
Solder Joint ◽  
Solder Joints ◽  
Void Formation ◽  
Kirkendall Void ◽  
Fe Content ◽  
Kirkendall Voids

Ternary Sn-3.5Ag-xFe solders with varying amount of Fe; 0.1, 0.5, 1.0, and 2.0 wt. % were reacted with Cu UBM which was electroplated using SPS additive and characteristics of Kirkendall void formation at the solder joints were investigated. Results indicate that the propensity to form Kirkendall voids at the solder joint decreased with the Fe content. It showed that Fe dissolved in the Cu UBM and reduced the segregation of S atoms to the Cu3Sn/Cu interface, which suppressed the nucleation of Kirkendall voids at the interface.

Formation and Evolution of Intermetallic Compounds in Solder Joint for Electronic Interconnect

2011 ◽  
Vol 687 ◽  
pp. 80-84
Author(s):  
Chang Hua Du ◽  
Hai Jian Zhao ◽  
Li Meng Yin ◽  
Fang Chen
Keyword(s):  
Mechanical Properties ◽  
Solder Joint ◽  
Intermetallic Compounds ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Growth Behavior ◽  
Electronic Products ◽  
Formation And Evolution ◽  
Kirkendall Voids ◽  
Reliability Of Solder Joints

As solder joints become increasingly miniaturized to meet the severe demands of future electronic packaging, the thickness of intermetallic compounds (IMC) in solder joint continuously decreases, while, the IMC proportion to the whole solder joint increases. So IMC plays a more and more important role in the reliability of microelectronic structure and microsystems. In this paper, the formation and growth behavior, along with the composition of IMC at the interface of Sn-based solders/Cu substrate in soldering were reviewed comprehensively. The effect of isothermal aging, thermal-shearing cycling and electromigration on the interfacial IMC growth and evolution were also presented. Furthermore, the formation mechanism of Kirkendall voids during thermal aging was introduced. In addition, the effect of the interfacial IMC on mechanical properties of solder joints was in-depth summarized. Adopting an appropriate flux to control the thickness of the IMC to improve the reliability of solder joints and electronic products was proposed in the end of this paper.

Investigation on fatigue behavior of single SnAgCu/SnPb solder joint by rapid thermal cycling

2015 ◽  
Vol 27 (2) ◽  
pp. 76-83 ◽  
Author(s):  
Jibing Chen ◽  
Yanfang Yin ◽  
Jianping Ye ◽  
Yiping Wu
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Solder Bump ◽  
Fatigue Behavior ◽  
Interfacial Microstructure ◽  
Content Type ◽  
X Ray ◽  
Snpb Solder ◽  
Rapid Thermal Cycling

Purpose – The purpose of this paper is to investigate the thermal fatigue behavior of a single Sn-3.0Ag-0.5Cu (SAC) lead-free and 63Sn-37Pb (SnPb) solder joint treated by rapidly alternating heating and cooling cycles. Design/methodology/approach – With the application of electromagnetic-induced heating, the specimen was heated and cooled, controlled with a system that uses a fuzzy logic algorithm. The microstructure and morphology of the interface between the solder ball and Cu substrate was observed using scanning electron microscopy. The intermetallic compounds and the solder bump surface were analyzed by energy-dispersive X-ray spectroscopy and X-ray diffraction, respectively. Findings – The experimental results showed that rapid thermal cycling had an evident influence on the surface and interfacial microstructure of a single solder joint. The experiment revealed that microcracks originate and propagate on the superficial oxide of the solder bump after rapid thermal cycling. Originality/value – Analysis, based on finite element modeling and metal thermal fatigue mechanism, determined that the rimous cracks can be explained by the heat deformation theory and the function of temperature distribution in materials physics.

scholarly journals On the effect of Kirkendall voids on solder joint reliability

PAMM ◽  
2007 ◽  
Vol 7 (1) ◽  
pp. 4030035-4030036 ◽  
Author(s):  
Wolfgang H. Müller ◽  
Kerstin Weinberg ◽  
Thomas Böhme
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Kirkendall Voids

Interfacial Microstructure and Joint Strength of Sn–3.5Ag–X (X = Cu, In, Ni) Solder Joint

2002 ◽  
Vol 17 (1) ◽  
pp. 43-51 ◽  
Author(s):  
Won Kyoung Choi ◽  
Jong Hoon Kim ◽  
Sang Won Jeong ◽  
Hyuck Mo Lee
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Intermetallic Layer ◽  
Melting Behavior ◽  
Interfacial Microstructure ◽  
X Ray Diffraction ◽  
Solder Alloys ◽  
X Ray ◽  
Joint Characteristics ◽  
Ductile Fractures

Interfacial phase and microstructure, solder hardness, and joint strength of Sn–3.5Ag–X (X = Cu, In, Ni; compositions are all in wt% unless specified otherwise) solder alloys were investigated. Considering the melting behavior and the mechanical properties, five compositions of Sn–3.5Ag–X solder alloys were selected. To examine the joint characteristics, they were soldered on under bump metallurgy isothermally at 250 °C for 60 s. Aging and thermal cycling (T/C) were also performed on the solder joint. The interfacial microstructure of the joint was observed by scanning electron microscopy. X-ray diffraction and energy dispersive x-ray analyses were made toidentify the type of solder phase and to measure compositions. Excessive growth of an interfacial intermetallic layer in the Sn–3.5Ag–6.5 In solder joint led to a brittle fracture. In the other four solder joints, ductile fractures occurred through the solder region and the solder hardness was closely related with the joint strength.

scholarly journals The Enhanced Mechanism of 0.05 wt. % Nd Addition on High Temperature Reliability of Sn-3.8Ag-0.7Cu/Cu Solder Joint

2020 ◽  
Vol 10 (24) ◽  
pp. 8935
Author(s):  
Peng Xue ◽  
Jianzhi Tao ◽  
Peng He ◽  
Weimin Long ◽  
Sujuan Zhong
Keyword(s):  
High Temperature ◽  
Solder Joint ◽  
Aging Treatment ◽  
Interfacial Microstructure ◽  
Growth Constant ◽  
Nd Addition ◽  
Excellent Mechanical Property ◽  
Surface Active ◽  
Cu3sn Imcs ◽  
Effect Of Surface

In this study, the effect of appropriate Nd addition on improving the high-temperature reliability of Sn-3.8Ag-0.7Cu (SAC387)/Cu solder joint after aging treatment was investigated. The interfacial microstructure of solder joint was refined with proper addition of Nd. This phenomenon could be explained as the adsorbing-hindering effect of surface-active Nd atoms which blocked the growth of brittle intermetallic compounds (IMCs) in the solder joint. Theoretical analysis indicated that 0.05 wt. % addition of Nd could distinctly decrease the growth constant of Cu6Sn5 IMCs and slightly decrease the growth constant of Cu3Sn IMCs respectively. The shear force of SAC387-0.05Nd/Cu solder joint was evidently improved compared with the origin solder joint. In addition, SAC387-0.05Nd/Cu solder joint maintained excellent mechanical property compared with SAC387/Cu solder joint even after 1440 h aging treatment.

Interfacial microstructure and properties of Sn–0.7Cu–0.05Ni/Cu solder joint with rare earth Nd addition

2011 ◽  
Vol 509 (25) ◽  
pp. 7152-7161 ◽  
Author(s):  
Guang Zeng ◽  
Songbai Xue ◽  
Lili Gao ◽  
Liang Zhang ◽  
Yuhua Hu ◽  
...  
Keyword(s):  
Rare Earth ◽  
Solder Joint ◽  
Interfacial Microstructure ◽  
Microstructure And Properties ◽  
Nd Addition
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