Effect of Intermetallic and Kirkendall Voids Growth on Board Level Drop Reliability for SnAgCu Lead-Free BGA Solder Joint

2006 ◽  
Author(s):  
Luhua Xu ◽  
J.H.L. Pang
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Kirkendall Voids ◽  
Voids Growth ◽  
Board Level

Assessment of board level solder joint reliability for PBGA assemblies with lead‐free solders

2002 ◽  
Vol 14 (3) ◽  
pp. 46-50 ◽  
Author(s):  
Shi‐Wei Ricky Lee ◽  
Ben Hoi Wai Lui ◽  
Y.H. Kong ◽  
Bernard Baylon ◽  
Timothy Leung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Lead Free ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Lead Free Solders ◽  
Board Level

Board-Level Drop Reliability Performance Before and After Thermal Cycling Aging

2007 ◽  
Author(s):  
John H. L. Pang ◽  
Luhua Xu
Keyword(s):  
Thermal Cycling ◽  
Crack Path ◽  
Void Formation ◽  
Lead Free ◽  
Joint Interface ◽  
Reliability Test ◽  
Before And After ◽  
Kirkendall Voids ◽  
Reliability Performance ◽  
Board Level

The combined sequential reliability test of thermal cycling aging followed by board level drop test for lead-free SnAgCu soldered assemblies were investigated. Interfacial IMCs, Kirkendall voids formation and interconnect failure mode are studied subject to TC aging. Kirkendall voids were observed with Ar+ sputtering etching. The failure sites and mechanism were examined and correlated with IMC and void formation. Significant decrease of drop life was observed for both SAC/ENIG and SAC/Cu-OSP assemblies after thermal cycling aging. Growth of Kirkendall voids and IMC significantly weakened the solder joint interface during TC aging. Drop impact crack path changed from the IMC to the IMC/Cu interface.

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