Kirkendall voids at Cu/solder interface and their effects on solder joint reliability

2005 ◽  
Author(s):  
Z. Mei ◽  
M. Ahmad ◽  
M. Hu ◽  
G. Ramakrishna
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Kirkendall Voids ◽  
Solder Interface

scholarly journals On the effect of Kirkendall voids on solder joint reliability

PAMM ◽  
2007 ◽  
Vol 7 (1) ◽  
pp. 4030035-4030036 ◽  
Author(s):  
Wolfgang H. Müller ◽  
Kerstin Weinberg ◽  
Thomas Böhme
Keyword(s):  
Solder Joint ◽  
Solder Joint Reliability ◽  
Joint Reliability ◽  
Kirkendall Voids

Experimental evaluation of SnAgCu solder joint reliability in 100-μm pitch flip-chip assemblies

2014 ◽  
Vol 54 (5) ◽  
pp. 939-944 ◽  
Author(s):  
Ye Tian ◽  
Xi Liu ◽  
Justin Chow ◽  
Yi Ping Wu ◽  
Suresh K. Sitaraman
Keyword(s):  
Solder Joint ◽  
Experimental Evaluation ◽  
Flip Chip ◽  
Solder Joint Reliability ◽  
Snagcu Solder ◽  
Joint Reliability
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